IP Library Granted Patent US 11,189,735
Granted Patent B2
US 11,189,735 · App. 16/736,813 · Granted Nov 30, 2021

Semiconductor device and display apparatus

Inventors: Hiroshi Hayashi (Tokyo, JP); Naoki Asano (Tokyo, JP); Ryo Koshiishi (Tokyo, JP)
Assignee: JOLED INC.
H01L29/7869H01L21/0217H01L21/02164H01L21/02178H01L27/1225H01L27/1248H01L27/1255H01L29/12H01L29/78606H01L29/78696
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Quick Facts
Patent No.
US 11,189,735
App. No.
16/736,813
Granted
Nov 30, 2021
Kind
B2
Abstract

A semiconductor device includes a gate electrode, a semiconductor film, and a conductive film. The semiconductor film includes an oxide semiconductor material. The semiconductor film includes a channel region, a low-resistance region, and an intermediate region. The channel region is opposed to the gate electrode. The low-resistance region has a lower electric resistance than the channel region. The intermediate region is provided between the low-resistance region and the channel region. The conductive film is provided selectively in contact with the low-resistance region of the semiconductor film.

Claims (53)

1. A semiconductor device comprising:

a substrate;

a gate electrode over the substrate;

a semiconductor film including an oxide semiconductor material, the semiconductor film including a channel region opposed to the gate electrode, a low-resistance region having a lower electric resistance than the channel region, and an intermediate region between the low-resistance region and the channel region, wherein the intermediate region has a dimension of no less than 1 μm nor more than 3 μm in a channel length direction; and

a conductive film provided selectively in contact with the low-resistance region of the semiconductor film, wherein the conductive film is between the substrate and the semiconductor film, and the gate electrode does not overlap the conductive film in a plan view.

2. The semiconductor device according to claim 1 , further comprising:

a gate insulating film between the gate electrode and the semiconductor film, wherein

the gate electrode, the gate insulating film, and the semiconductor film are provided in this order over the substrate.

3. The semiconductor device according to claim 1 , further comprising a metal oxide film that is in contact with at least the intermediate region of the semiconductor film.

4. The semiconductor device according to claim 1 , wherein the conductive film includes an oxide.

5. The semiconductor device according to claim 4 , wherein

the semiconductor film includes a metal, and

the conductive film includes the metal that is same as the metal included in the semiconductor film.

6. The semiconductor device according to claim 1 , further comprising:

a gate insulating film between the gate electrode and the semiconductor film, wherein

the semiconductor film, the gate insulating film, and the gate electrode are provided in this order over the substrate.

7. The semiconductor device according to claim 6 , wherein the gate electrode and the gate insulating film have an identical planar shape.

8. The semiconductor device according to claim 1 , further comprising:

a contact electrode electrically connected to the low-resistance region, wherein the semiconductor film is between the conductive film and the contact electrode.

9. The semiconductor device according to claim 8 , wherein the contact electrode directly contacts the semiconductor film, and the conductive film directly contacts the semiconductor film.

10. A semiconductor device comprising:

a substrate;

a gate electrode over the substrate;

a semiconductor film including an oxide semiconductor material, the semiconductor film including a channel region opposed to the gate electrode, a low-resistance region having a lower electric resistance than the channel region, and an intermediate region provided between the low-resistance region and the channel region and having a carrier concentration satisfying the following Expression 1:

C 1< C 2< C 3  Expression 1

where

C1 denotes the carrier concentration in the channel region of the semiconductor film,

C2 denotes the carrier concentration in the intermediate region of the semiconductor film, and

C3 denotes the carrier concentration in the low-resistance region of the semiconductor film; and

a conductive auxiliary film provided selectively in contact with the low-resistance region of the semiconductor film, the conductive auxiliary film reducing a resistance of the semiconductor film, wherein the conductive auxiliary film is between the semiconductor film and the substrate, and the intermediate region is exposed by the gate electrode in a plan view.

11. The semiconductor device according to claim 10 , wherein the conductive auxiliary film includes aluminum.

12. The semiconductor device according to claim 10 , wherein the conductive auxiliary film include a hydrogen-containing film.

13. The semiconductor device according to claim 10 , wherein the carrier concentration C2 in the intermediate region of the semiconductor film is no higher than 1.4×10 20 cm −3 .

14. The semiconductor device according to claim 10 , further comprising:

a gate insulating film between the gate electrode and the semiconductor film, wherein

the semiconductor film, the gate insulating film, and the gate electrode are provided in this order over the substrate.

15. The semiconductor device according to claim 10 , further comprising:

a gate insulating film between the gate electrode and the semiconductor film, wherein

the gate electrode, the gate insulating film, and the semiconductor film are provided in this order over the substrate.

16. The semiconductor device according to claim 10 , further comprising:

a contact electrode electrically connected to the low-resistance region, wherein the contact electrode directly contacts a first side of the semiconductor film, and the conductive auxiliary film directly contacts a second side of the semiconductor film opposite to the first side.

17. A display apparatus comprising a display element and a semiconductor device that drives the display element, the semiconductor device including:

a gate electrode;

a semiconductor film including an oxide semiconductor material, the semiconductor film including a channel region opposed to the gate electrode, a low-resistance region having a lower electric resistance than the channel region, and an intermediate region provided between the low-resistance region and the channel region and having a carrier concentration satisfying the following Expression 1:

C 1< C 2< C 3  Expression 1

where

C1 denotes the carrier concentration in the channel region of the semiconductor film,

C2 denotes the carrier concentration in the intermediate region of the semiconductor film, and

C3 denotes the carrier concentration in the low-resistance region of the semiconductor film;

a conductive auxiliary film provided selectively in contact with the low-resistance region of the semiconductor film, the conductive auxiliary film reducing a resistance of the semiconductor film; and

a contact electrode electrically connected to the low-resistance region through the conductive auxiliary film.

18. The display apparatus according to claim 17 , wherein the contact electrode directly contacts the conductive auxiliary film.

19. The display apparatus according to claim 18 , wherein the conductive auxiliary film directly contacts the semiconductor film.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2025
From: JDI DESIGN AND DEVELOPMENT G.K.
To: MAGNOLIA BLUE CORPORATION
Reel/Frame 072039/0656 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2024
From: JOLED, INC.
To: JDI DESIGN AND DEVELOPMENT G.K.
Reel/Frame 066382/0619 →
CORRECTION BY AFFIDAVIT FILED AGAINST REEL/FRAME 063396/0671 Recorded Jun 12, 2023
From: JOLED, INC.
To: JOLED, INC.
Reel/Frame 064067/0723 →
SECURITY INTEREST Recorded Apr 20, 2023
From: JOLED, INC.
To: INCJ, LTD.
Reel/Frame 063396/0671 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2020
From: HAYASHI, HIROSHI; ASANO, NAOKI; KOSHIISHI, RYO
To: JOLED INC.
Reel/Frame 051442/0972 →