Fixing device for double sided heat sink and associated heat dissipating system

1. A system, comprising:

a carrier including opposed first and second carrier sides;

a first cooling portion mounted adjacent the first carrier side of the carrier;

a second cooling portion mounted adjacent the second carrier side of the carrier and disposed in spaced relation relative to the second carrier side to define an open gap extending between the second cooling portion and the second carrier side of the carrier to facilitate heat dissipation;

a heat transfer member coupled to the first cooling portion and the second cooling portion, the heat transfer member configured to transfer heat between the first and second cooling portions, the heat transfer member straddling the first and second carrier sides of the carrier;

an electronic chip mounted to the carrier; and

a fixing device for coupling the first cooling portion and the second cooling portion relative to the carrier, the fixing device including a limiting protrusion disposed between the carrier and the second cooling portion, to maintain the open gap between the second cooling portion and the carrier.

2. The system of claim 1 wherein the fixing device comprises:

a first holder mounted relative to the first cooling portion and extending through the carrier; and

a second holder mounted relative to the second cooling portion and cooperatively engaging the first holder to secure the first and second holders to each other.

3. The system of claim 2 wherein the first holder extends through a mounting hole of the carrier.

4. The system of claim 3 wherein the first holder includes an outer first flexible latch, the outer first flexible latch engaging the second carrier side of the carrier to secure the first holder and the first cooling portion relative to the carrier.

5. The system of claim 4 wherein the first holder defines a longitudinal through-hole, the second holder being at least partially received within the longitudinal through-hole of the first holder.

6. The system of claim 5 wherein the first holder and the second holder comprise cooperating structure to secure the first and second holders when the second holder is at least partially received within the longitudinal through-hole of the first holder.

7. The system of claim 6 wherein the second holder extends through the mounting hole of the carrier.

8. The system of claim 7 wherein the second holder includes an outer second flexible latch, the outer second flexible latch engaging the cooperating structure of the first holder to secure the first and second holders.

9. The system of claim 8 wherein the cooperating structure of the first holder includes a flange, the outer second flexible latch of the second holder engaging the flange.

10. The system of claim 2 including a spring mounted about the first holder, the spring biasing the first cooling portion toward the first carrier side of the carrier.

11. The system of claim 2 wherein the carrier comprises a baseplate of an input/output card.

12. The system of claim 2 comprising first and second fixing devices configured for coupling the first cooling portion to the second cooling portion, each of the first and second fixing devices including first and second holders.

13. The system of claim 1 wherein the second cooling portion is free from direct contact with the second carrier side of the carrier.

14. The system of claim 1 wherein the heat transfer member is directly connected to the first cooling portion and to the second cooling portion.

15. The system of claim 4 wherein the limiting protrusion extends from the outer first flexible latch to engage the second cooling portion.

16. A method, comprising:

positioning first and second cooling portions of a heat sink adjacent respective first and second opposed carrier sides of a carrier, the carrier including an electronic chip;

securing the first and second cooling portions relative to the carrier with at least one fixing device;

connecting a heat transfer member to the first and second cooling portions, the heat transfer member straddling the first and second carrier sides of the carrier;

transferring heat generated by the electronic chip between the first and second cooling portions via at least the heat transfer member; and

maintaining the second cooling portion in spaced relation relative to the second carrier side of the carrier to define an open gap extending between the second cooling portion and the second carrier side of the carrier to facilitate heat dissipation;

wherein the at least one fixing device includes a limiting protrusion disposed between the carrier and the second cooling portion, the limiting protrusion maintaining the open gap between the second cooling portion and the carrier.

17. The method of claim 16 wherein the second cooling portion is free from direct contact with the second carrier side of the carrier.

18. The method of claim 16 wherein securing the first and second cooling portions comprises:

cooperatively engaging a first holder of the at least one fixing device mounted relative to the first cooling portion and extending through the carrier with a second holder of the at least one fixing device mounted relative to the second cooling portion.

19. The method of claim 18 wherein the first holder defines a longitudinal through-hole, the second holder being at least partially received within the longitudinal through-hole of the first holder;

wherein the first holder includes an outer first flexible latch, the outer first flexible latch engaging the second carrier side of the carrier to secure the first holder and the first cooling portion relative to the carrier, the limiting protrusion extending from the outer first flexible latch; and

wherein the second holder includes an outer second flexible latch, the outer second flexible latch engaging cooperating structure of the first holder to secure the first and second holders.

20. The method of claim 19 wherein the limiting protrusion extends from the outer first flexible latch to engage the second cooling portion.