IP Library Granted Patent US 11,085,134
Granted Patent B2
US 11,085,134 · App. 16/737,678 · Granted Aug 10, 2021

Fabric-based user interface buttons and deformable user interface using bi-elastic formed information handling system chassis

Inventors: Weijong Sheu (Austin, TX); Deeder M. Aurongzeb (Austin, TX); Christopher A. Torres (San Marcos, TX)
Assignee: Dell Products L.P.
D03D1/0088A61B5/6804G01L1/18D10B2401/16D10B2403/02431
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Quick Facts
Patent No.
US 11,085,134
App. No.
16/737,678
Granted
Aug 10, 2021
Kind
B2
Abstract

A fabric cover may be configured to mechanically couple to and cover part of a frame and the fabric cover may have a plurality of layers including a first non-conductive fabric layer, a second non-conductive fabric layer, a piezoresistive core layer between the first non-conductive fabric layer and the second fabric non-conductive layer, and a first conductive layer comprising a plurality of first conductive fiber traces and located between the first non-conductive fabric layer and the second non-conductive fabric layer. A localized impedance of the piezoresistive core layer indicates a mechanical force applied to the fabric cover proximate to such localized impedance.

Claims (55)

1. A system comprising:

a frame;

a fabric cover mechanically coupled to and covering part of the frame, the fabric cover comprising a plurality of layers including:

a first non-conductive fabric layer;

a second non-conductive fabric layer;

a piezoresistive core layer between the first non-conductive fabric layer and the second non-conductive fabric layer; and

a first conductive layer comprising a plurality of first conductive fiber traces and located between the first non-conductive fabric layer and the second non-conductive fabric layer;

a first contact assembly mechanically coupled to the frame and comprising a plurality of first electrical contacts, each of the first electrical contacts electrically coupled to a corresponding one of the plurality of first conductive fiber traces; and

a processing subsystem communicatively coupled to the first contact assembly and configured to determine a location of the fabric cover in which a localized impedance of the piezoresistive core layer indicates a mechanical force applied to the fabric cover proximate to such localized impedance.

2. The system of claim 1 , further comprising:

a second conductive layer comprising a plurality of second conductive fiber traces located between the second non-conductive fabric layer and the piezoresistive core layer, wherein the first conductive layer is located between the first non-conductive fabric layer and the piezoresistive core layer; and

a second contact assembly mechanically coupled to the frame and comprising a plurality of second electrical contacts, each of the second electrical contacts electrically coupled to a corresponding one of the plurality of second conductive fiber traces;

wherein the processing subsystem is further communicatively coupled to the second contact assembly and configured to determine a location of the fabric cover in which a localized impedance of the piezoresistive core layer indicates a mechanical force applied to the fabric cover proximate to such localized impedance.

3. The system of claim 1 , wherein the mechanical force is that of a person applying the mechanical force to a surface of the fabric cover.

4. The system of claim 1 , further comprising:

a first mechanical member mechanically coupled to the frame; and

a second mechanical member mechanically coupled to the frame;

wherein the frame comprises a flexible portion to allow the second mechanical member to be movable relative to the first mechanical member between a closed position and at least one open position.

5. The system of claim 4 , wherein the mechanical force is that of the second mechanical member moving relative to the first mechanical member from the closed position and the at least one open position or vice versa.

6. The system of claim 4 , wherein the first mechanical member comprises a keyboard assembly.

7. The system of claim 4 , wherein the second mechanical member comprises a display assembly.

8. The system of claim 1 , wherein the fabric cover includes at least one of a shape or a microtexture adapted to a particular functionality of a fabric button implemented by the fabric cover.

9. A fabric cover configured to mechanically couple to and cover part of a frame, the fabric cover comprising a plurality of layers including:

a first non-conductive fabric layer;

a second non-conductive fabric layer;

a piezoresistive core layer between the first non-conductive fabric layer and the second fabric non-conductive layer; and

a first conductive layer comprising a plurality of first conductive fiber traces and located between the first non-conductive fabric layer and the second non-conductive fabric layer;

wherein:

a localized impedance of the piezoresistive core layer indicates a mechanical force applied to the fabric cover proximate to such localized impedance; and

the fabric cover includes at least one of a shape or a microtexture adapted to a particular functionality of a fabric button implemented by the fabric cover.

10. The fabric cover of claim 9 , further comprising:

a second conductive layer comprising a plurality of second conductive fiber traces located between the second non-conductive fabric layer and the piezoresistive core layer, wherein the first conductive layer is located between the first non-conductive fabric layer and piezoresistive core layer.

11. The fabric cover of claim 9 , wherein the mechanical force is that of a person applying the mechanical force to a surface of the fabric cover.

12. A method comprising:

coupling a fabric cover to a frame to cover the frame, the fabric cover comprising a plurality of layers including:

a first non-conductive fabric layer;

a second non-conductive fabric layer;

a piezoresistive core layer between the first non-conductive fabric layer and the second non-conductive fabric layer; and

a first conductive layer comprising a plurality of first conductive fiber traces and located between the first non-conductive fabric layer and the second non-conductive fabric layer;

mechanically coupling a first contact assembly mechanically to the frame, the first contact assembly comprising a plurality of first electrical contacts, each of the first electrical contacts electrically coupled to a corresponding one of the plurality of first conductive fiber traces; and

communicatively coupling a processing subsystem to the first contact assembly, the processing subsystem configured to determine a location of the fabric cover in which a localized impedance of the piezoresistive core layer indicates a mechanical force applied to the fabric cover proximate to such localized impedance.

13. The method of claim 12 , wherein:

the fabric cover comprises a plurality of second conductive fiber traces located between the second non-conductive fabric layer and the piezoresistive core layer, further wherein the first conductive layer is located between the first non-conductive fabric layer and the piezoresistive core layer;

the method further comprising:

mechanically coupling a second contact assembly to the frame, the second contact assembly comprising a plurality of second electrical contacts, each of the second electrical contacts electrically coupled to a corresponding one of the plurality of second conductive fiber traces; and

communicatively coupling the processing subsystem to the second contact assembly.

14. The method of claim 12 , wherein the mechanical force is that of a person applying the mechanical force to a surface of the fabric cover.

15. The method of claim 12 , further comprising:

mechanically coupling a first mechanical member to the frame; and

mechanically coupling a second mechanical member to the frame;

wherein the frame comprises a flexible portion to allow the second mechanical member to be movable relative to the first mechanical member between a closed position and at least one open position.

16. The method of claim 15 , wherein the mechanical force is that of the second mechanical member moving relative to the first mechanical member from the closed position and the at least one open position or vice versa.

17. The method of claim 15 , wherein the first mechanical member comprises a keyboard assembly.

18. The method of claim 15 , wherein the second mechanical member comprises a display assembly.

19. The method of claim 12 , further comprising forming within the fabric cover at least one of a shape or a microtexture adapted to a particular functionality of a fabric button implemented by the fabric cover.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053311/0169) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0742 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052216/0758) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0680 →
RELEASE OF SECURITY INTEREST AF REEL 052243 FRAME 0773 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0152 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 053311/0169 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 26, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052243/0773 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Mar 24, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052216/0758 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2020
From: SHEU, WEIJONG; AURONGZEB, DEEDER M.; TORRES, CHRISTOPHER A.
To: DELL PRODUCTS L.P.
Reel/Frame 051455/0545 →