IP Library Granted Patent US 11,300,803
Granted Patent B2
US 11,300,803 · App. 16/740,812 · Granted Apr 12, 2022

Optical element driving mechanism

Inventors: Meng-Ting Lin (Taoyuan, TW); Sin-Jhong Song (Taoyuan, TW)
Assignee: TDK TAIWAN CORP.
G02B27/646G02B7/09G02B7/10G03B13/36H02K11/215H02K41/0356
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Quick Facts
Patent No.
US 11,300,803
App. No.
16/740,812
Granted
Apr 12, 2022
Kind
B2
Abstract

An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed part, a movable part, a driving assembly, and a sensing assembly. The fixed part has a main axis. The fixed part includes a case and a bottom. The case and the bottom are arranged along the main axis. The movable part moves relative to the fixed part. The movable part may hold an optical element with an optical axis. The driving assembly drives the movable part to move relative to the fixed part. The sensing assembly senses a movement condition of the movable part relative to the fixed part. The sensing assembly includes a sensor. The sensor is disposed on the bottom.

Claims (48)

1. An optical element driving mechanism, comprising:

a fixed part having a main axis, the fixed part comprising:

a case; and

a bottom, wherein the case and the bottom are arranged along the main axis;

a movable part moving relative to the fixed part, wherein the movable part may hold an optical element with an optical axis;

a driving assembly driving the movable part to move relative to the fixed part; and

a sensing assembly sensing a movement condition of the movable part relative to the fixed part, the sensing assembly comprising:

a sensor disposed on the bottom,

wherein the driving assembly drives the movable part to move relative to the fixed part along a direction that is parallel to the optical axis, the fixed part further comprises a circuit assembly electrically connected to the sensing assembly, and when viewed along the main axis, the driving assembly partially overlaps the circuit assembly,

wherein when viewed along a direction that is perpendicular to the main axis, the sensor partially overlaps the bottom,

wherein the bottom comprises a receiving portion for receiving the sensor, and when viewed along a direction that is perpendicular to the main axis, a bottom surface of the bottom is farther away from the case than a bottom surface of the sensing assembly in a direction of the main axis, and

wherein the optical element driving mechanism further comprises an adhesion element disposed in the receiving portion, and the adhesion element contacts the sensor and the circuit assembly.

2. The optical element driving mechanism as claimed in claim 1 , wherein the adhesion element is disposed between the circuit assembly and the bottom, and the adhesion element contacts the circuit assembly and the bottom.

3. The optical element driving mechanism as claimed in claim 1 , further comprising an outside-connection circuit member, wherein the sensor is electrically connected to the outside-connection circuit member via the circuit assembly.

4. An optical element driving mechanism, comprising:

a fixed part having a main axis, the fixed part comprising:

a case; and

a bottom, wherein the case and the bottom are arranged along the main axis;

a movable part moving relative to the fixed part, wherein the movable part may hold an optical element with an optical axis;

a driving assembly driving the movable part to move relative to the fixed part; and

a sensing assembly sensing a movement condition of the movable part relative to the fixed part, the sensing assembly comprising:

a sensor disposed on the bottom,

wherein the driving assembly drives the movable part to move relative to the fixed part along a direction that is parallel to the optical axis, the fixed part further comprises a circuit assembly electrically connected to the sensing assembly, and when viewed along the main axis, the driving assembly partially overlaps the circuit assembly,

wherein the optical element driving mechanism further comprises a loop member and an electrical connection piece, wherein a portion of the loop member is embedded in the bottom, and the circuit assembly is electrically connected to the loop member via the electrical connection piece.

5. The optical element driving mechanism as claimed in claim 4 , wherein a portion of the electrical connection piece is disposed on a surface of the circuit assembly that faces the bottom.

6. The optical element driving mechanism as claimed in claim 4 , wherein when viewed along a direction that is perpendicular to the main axis, the electrical connection piece is disposed between the bottom and the circuit assembly.

7. The optical element driving mechanism as claimed in claim 4 , wherein when viewed along a direction that is perpendicular to the main axis, the electrical connection piece partially overlaps the case.

8. The optical element driving mechanism as claimed in claim 4 , further comprising an adhesion element, wherein the adhesion element contacts the electrical connection piece and the case.

9. The optical element driving mechanism as claimed in claim 4 , wherein the bottom further comprises an opening, and a portion of the electrical connection piece is disposed on an edge of the opening.

10. The optical element driving mechanism as claimed in claim 9 , wherein when viewed along a direction that is perpendicular to the main axis, a portion of the bottom is located between the electrical connection piece and the case.

11. The optical element driving mechanism as claimed in claim 4 , further comprising an elastic element, wherein the movable part is movably connected to the fixed part via the elastic element, and the sensor is electrically connected to the driving assembly via the circuit assembly, the loop member, and the elastic element consecutively.

12. The optical element driving mechanism as claimed in claim 11 , wherein the electrical connection piece contacts the loop member, the elastic element, and the circuit assembly.

13. The optical element driving mechanism as claimed in claim 11 , wherein the bottom further comprises a supporting platform, the elastic element is disposed on the supporting platform, and the supporting platform is closer to the case than the circuit assembly in a direction of the main axis.

14. The optical element driving mechanism as claimed in claim 13 , wherein when viewed along the main axis, the supporting platform does not overlap the circuit assembly.

15. The optical element driving mechanism as claimed in claim 13 , wherein when viewed along the main axis, the supporting platform does not overlap the sensor.

16. An optical element driving mechanism, comprising:

a fixed part having a main axis, the fixed part comprising:

a case; and

a bottom, wherein the case and the bottom are arranged along the main axis;

a movable part moving relative to the fixed part, wherein the movable part may hold an optical element with an optical axis;

a driving assembly driving the movable part to move relative to the fixed part; and

a sensing assembly sensing a movement condition of the movable part relative to the fixed part, the sensing assembly comprising a sensor disposed on the bottom,

wherein the driving assembly drives the movable part to move relative to the fixed part along a direction that is parallel to the optical axis, the fixed part further comprises a circuit assembly electrically connected to the sensing assembly, and when viewed along the main axis, the driving assembly partially overlaps the circuit assembly, and

wherein the optical element driving mechanism further comprises an electronic element and an adhesion element, the electronic element is disposed on the circuit assembly, and the adhesion element contacts the electronic element and the circuit assembly.

17. The optical element driving mechanism as claimed in claim 16 , wherein when viewed along a direction that is perpendicular to the main axis, the sensor partially overlaps the bottom.

18. The optical element driving mechanism as claimed in claim 17 , wherein the bottom comprises a receiving portion for receiving the sensor, and when viewed along a direction that is perpendicular to the main axis, a bottom surface of the bottom is farther away from the case than a bottom surface of the sensing assembly in a direction of the main axis.

19. The optical element driving mechanism as claimed in claim 18 , wherein the adhesion element is disposed in the receiving portion, and the adhesion element contacts the sensor and the circuit assembly.

20. The optical element driving mechanism as claimed in claim 16 , further comprising an outside-connection circuit member, wherein the sensor is electrically connected to the outside-connection circuit member via the circuit assembly.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2026
From: TDK TAIWAN CORP.
To: ACTUTEK CORPORATION
Reel/Frame 074858/0498 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2020
From: LIN, MENG-TING; SONG, SIN-JHONG
To: TDK TAIWAN CORP.
Reel/Frame 051580/0445 →