Heating system for heating a heat shrink component, heat shrink component, and method of assembling a heat shrink component
A heating system for heating a heat shrink layer of a heat shrink component during a heat shrink process includes a heating unit arranged in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit has a first heating zone and a second heating zone. The first heating zone has a different heating energy than the second heating zone for a period of time of the heat shrink process.
1. A heating system for heating a heat shrink layer of a heat shrink component during a heat shrink process, comprising:
a heating unit arranged in continuous contact with an exterior surface of the heat shrink layer about its circumference and heating the heat shrink layer to a heat shrink temperature, the heating unit has a first heating zone and a second heating zone in which the heat shrink process starts in the first heating zone and then advances along a longitudinal axis towards the second heating zone and to a plurality of peripheral ends, an electrically conductive lead is received within a plurality of formed recesses of the heat shrink layer, the heating unit is bonded to the heat shrink layer, the heat shrink layer includes a plurality of T-shaped projections around the circumference of the heat shrink layer which receive a plurality of leads of the heating unit therebetween in a form fit, and the first heating zone has a different heating energy than the second heating zone for a period of time of the heat shrink process.
2. The heating system of claim 1 , wherein the heating unit includes a first heating unit arranged in the first heating zone and a second heating unit arranged in the second heating zone, the first heating unit and the second heating unit are controllable to be heated differently.
3. The heating system of claim 1 , wherein the heating unit includes a first heating unit and a second heating unit arranged to be overlapping in an overlapping region, the overlapping region forms the first heating zone and a non-overlapping region forms the second heating zone.
4. The heating system of claim 1 , wherein the heating unit has the electrically conductive lead heated by an electrical current flowing through the electrically conductive lead.
5. The heating system of claim 4 , wherein the electrically conductive lead covers a larger area in the first heating zone than in the second heating zone.
6. The heating system of claim 4 , wherein the electrically conductive lead has a different cross-section in the first heating zone than in the second heating zone.
7. The heating system of claim 4 , wherein the electrically conductive lead has a different specific conductivity in the first heating zone than in the second heating zone.
8. The heating system of claim 4 , wherein the electrically conductive lead is in direct contact with the exterior surface of the heat shrink layer.
9. The heating system of claim 4 , wherein the electrically conductive lead is an electrically conductive film.
10. The heating system of claim 1 , wherein the heating unit further comprises a thermal insulation layer arranged in the first heating zone and/or in the second heating zone.
11. The heating system of claim 10 , wherein the entire thermal insulation layer is arranged between the heat shrink layer and the heating unit in the second heating zone in a radial direction with respect to the longitudinal axis of the heat shrink layer.
12. The heating system of claim 11 , wherein a thickness of the thermal insulation layer increases in the second heating zone in a direction away from the first heating zone.
13. The heating system of claim 10 , wherein the entire thermal insulation layer is arranged radially outside of and encompasses the heat shrink layer and the heating unit in the first heating zone.
14. The heating system of claim 1 , wherein the heating unit further comprises a heat spreading layer arranged between the exterior surface of the heat shrink layer and the heating unit.
15. The heating system of claim 14 , wherein the heating unit further comprises:
the electrically conductive lead, heated by an electrical current; and an embedding material on a side of the heat spreading layer opposite the heat shrink layer in which the conductive lead is at least partially embedded.
16. The heating system of claim 14 , wherein the heat spreading layer includes an insulating layer and a metal layer.
17. The heating system of claim 1 , wherein the heating unit further comprises:
the electrically conductive lead, heated by an electrical current; an embedding material in which the conductive lead is at least partially embedded; and a thermal insulation layer arranged on a side of the embedding material adjacent the heat shrink layer.
18. A heat shrink component, comprising:
a heat shrink sleeve with a heat shrink layer; and
a heating system including at least one first heating unit and at least one second heating unit arranged in mechanical and thermal contact with at least a part of the heat shrink sleeve and heating the heat shrink layer to a heat shrink temperature, the heat shrink component having first dimensions in an expanded state and second dimensions in a shrunken state, a plurality of T-shaped projections are disposed around a circumference of the heat shrink layer heat shrink component which receive a plurality of leads of the heating unit therebetween in a form fit, at least one of the first dimensions being larger than a corresponding one of the second dimensions, the heating unit has a first heating zone and a second heating zone in which a heat shrink process starts in the first heating zone and then advances along a longitudinal axis towards the second heating zone and to a plurality of peripheral ends, the first heating zone has a same or a different heating energy than the second heating zone for a period of time during the heating, the heating unit having an electrically conductive lead heated by an electrical current flowing through the electrically conductive lead and a heat spreading layer arranged between an exterior surface of the heat shrink layer and the electrically conductive lead, the heat spreading layer circumferentially distributing a heat generated by the electrically conductive lead, the heating unit is bonded to the heat shrink layer, the heat shrink sleeve having an essentially tube shaped form with a longitudinal axis, and the heating unit radially encompasses the heat shrink component, the first and second heating zones being arranged along the longitudinal axis.
19. The heat shrink component of claim 18 , further comprising a compressing element, the electrically conductive lead arranged between the compressing element and the heat shrink layer, the compressing element pressing the heat spreading layer into contact with the exterior surface of the heat shrink layer during heating of the heat shrink layer.
20. The heat shrink component of claim 18 , wherein the heating unit further comprises an embedding material on a side of the heat spreading layer opposite the heat shrink layer in which the conductive lead is at least partially embedded.