SEMICONDUCTOR DEVICE
A semiconductor device disclosed herein may include: a semiconductor element including a signal pad; and a signal terminal including a flat surface opposed to the signal pad, the flat surface being bonded to the signal pad with a spacer interposed therebetween. The flat surface may be larger than the signal pad in at least one direction parallel to the flat surface.
1 . A semiconductor device comprising:
a semiconductor element comprising a signal pad; and
a signal terminal comprising a flat surface opposed to the signal pad, the flat surface being bonded to the signal pad with a spacer interposed therebetween,
wherein
the flat surface is larger than the signal pad in at least one direction parallel to the flat surface.
2 . The semiconductor device according to claim 1 , wherein the signal pad is larger than the spacer in the at least one direction.
3 . The semiconductor device according to claim 1 , wherein
an end portion of the signal terminal extends along a first direction, the end portion including at least the flat surface, and
the at least one direction comprises the first direction.
4 . The semiconductor device according to claim 3 , wherein the at least one direction further comprises a second direction perpendicular to the first direction.
5 . The semiconductor device according to claim 1 , wherein the spacer has a pillar shape including one end surface opposed to the flat surface and another end surface opposed to the signal pad.
6 . The semiconductor device according to claim 1 , wherein the spacer has a spherical shape.
7 . The semiconductor device according to claim 1 , wherein the spacer comprises a bottom surface opposed to the signal pad and has a shape in which a cross sectional area of the spacer decreases continuously or stepwise toward the flat surface.
8 . The semiconductor device according to claim 1 , wherein
the flat surface is bonded to the signal pad via solder, and
the spacer is located within the solder.
9 . The semiconductor device according to claim 1 , wherein at least a part of the signal terminal is provided on an insulator substrate.