Secure integrated-circuit systems
A method of making a secure integrated-circuit system comprises providing a first integrated circuit in a first die having a first die size and providing a second integrated circuit in a second die. The second die size is smaller than the first die size. The second die is transfer printed onto the first die and connected to the first integrated circuit, forming a compound die. The compound die is packaged. The second integrated circuit is operable to monitor the operation of the first integrated circuit and provides a monitor signal responsive to the operation of the first integrated circuit. The first integrated circuit can be constructed in an insecure facility and the second integrated circuit can be constructed in a secure facility.
1. A secure integrated-circuit system, comprising:
a first integrated circuit in a first die having a first die size;
a second integrated circuit in a second die having a second die size smaller than the first die size, wherein the second integrated circuit comprises an electronic monitor circuit comprising transistors, wherein the electronic monitor circuit is operable to monitor operation of the first integrated circuit and to provide a monitor signal responsive to the operation of the first integrated circuit; and
a fractured or separated tether protruding from only a portion of a side of the second die,
wherein the second die is non-native to the first die and the second integrated circuit is connected to the first integrated circuit, such that the first die and the second die together form a compound die, and
wherein the compound die is disposed in a package.
2. The secure integrated-circuit system of claim 1 , wherein the first die is a common first die and comprising two or more second dies directly disposed on the common first die, the two or more second dies connected together to form a monitor circuit.
3. The secure integrated-circuit system of claim 1 , wherein the second integrated circuit does not comprise a malicious circuit.
4. The secure integrated-circuit system of claim 1 , wherein the first die has an area that is at least ten times larger than an area of the second die.
5. The secure integrated-circuit system of claim 1 , wherein the second die has a length and a width that are both no more than 200 microns.
6. The secure integrated-circuit system of claim 1 , wherein the second integrated circuit is electrically connected to the first integrated circuit with at least one wire bond, at least one surface wire, or at least one connection post.
7. The secure integrated-circuit system of claim 1 , wherein the second integrated circuit is connected to the first integrated circuit by one or more of an electrical connection, an optical connection, and an electro-optic connection.
8. The secure integrated-circuit system of claim 1 , wherein the first integrated circuit comprises a malicious circuit.
9. The secure integrated-circuit system of claim 1 , wherein the second die is disposed on or in contact with the first die.
10. A secure integrated-circuit system, comprising:
a first integrated circuit in a first die having a first die size;
a second integrated circuit in a second die having a second die size smaller than the first die size, wherein the second integrated circuit is operable to monitor the operation of the first integrated circuit and to provide a monitor signal responsive to the operation of the first integrated circuit; and
a fractured or separated tether protruding from only a portion of a side of the second die,
wherein the second die is non-native to the first die and the second integrated circuit is connected to the first integrated circuit, such that the first die and the second die together form a compound die, wherein the compound die is disposed in a package.
11. The secure integrated-circuit system of claim 10 , wherein the second die is disposed on or in contact with the first die.