Fan out structure for light-emitting diode (LED) device and lighting system
LED lighting systems and vehicle headlamp systems are described. An LED lighting system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces. First redistribution layers are provided on the top surface of the silicon backplane and the top surface of the substrate. Second redistribution layers are provided on the bottom surface of the silicon backplane and the bottom surface of the substrate. At least one via extends through the substrate between the first redistribution layers and the second redistribution layers and is filled with a metal material.
1. A system comprising:
a silicon backplane having a top surface, a bottom surface, and side surfaces;
an array of metal connectors on the top surface of the silicon backplane;
a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces;
first redistribution layers on the top surface of the silicon backplane and the top surface of the substrate;
second redistribution layers on the bottom surface of the silicon backplane and the bottom surface of the substrate; and
at least one via extending through the substrate between the first redistribution layers and the second redistribution layers and filled with a metal material.
2. The system of claim 1 , wherein the first redistribution layers comprise:
at least one first dielectric layer, and
at least one first metal layer,
the at least one first metal layer extending from a perimeter region of the silicon backplane toward the side surfaces of the substrate and having a least a portion exposed from the at least one dielectric layer to form at least one bond pad.
3. The system of claim 2 , further comprising at least one passive component electrically coupled to the at least one bond pad.
4. The system of claim 1 , wherein the second redistribution layers comprise:
at least one second dielectric layer, and
at least one second metal layer,
the at least one second metal layer extending from a perimeter region of the silicon backplane toward the side surfaces of the substrate and having at least a portion exposed from the at least one dielectric layer to form at least one bond pad.
5. The system of claim 4 , further comprising a metal layer electrically and thermally coupled to the bottom surface of the silicon backplane in a central region, the metal layer spaced apart from the second redistribution layers.
6. The system of claim 1 , wherein the array of metal connectors is an array of copper pillar bumps.
7. The system of claim 1 , further comprising a light-emitting diode (LED) array electrically coupled to the array of metal connectors.
8. The system of claim 7 , wherein the LED array is a monolithic LED array.
9. The system of claim 8 , wherein the monolithic LED array comprises a plurality of emitters, each of the plurality of emitters having a width of 100 μm or less.
10. The system of claim 9 , wherein the plurality of emitters are arranged in rows and columns, and lanes between adjacent rows and columns have a width of 20 μm or less.
11. The system of claim 1 , wherein the substrate comprises a molding material.
12. The system of claim 1 , wherein the silicon backplane is a complementary metal-oxide semiconductor (CMOS) integrated circuit.
13. The system of claim 1 , wherein the silicon backplane is an application specific integrated circuit (ASIC).
14. A vehicle headlamp system comprising:
at least one sensor;
a controller communicatively coupled to the at least one sensor;
a light emitting diode (LED) driver; and
an active headlamp, communicatively coupled to the controller and electrically coupled to the LED driver, the active headlamp comprising:
a silicon backplane having a top surface, a bottom surface, and side surfaces,
a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface, and side surfaces,
redistribution layers on the top surface of the silicon backplane and the top surface of the substrate, the redistribution layers comprising at least one dielectric layer and at least one metal layer, the at least one metal layer extending from a perimeter region of the silicon backplane toward the side surfaces of the substrate and having a least a portion exposed from the at least one dielectric layer to form at least one bond pad,
an LED array on the top surface of the silicon backplane.
15. The system of claim 14 , wherein at least one of the at least one sensor, the controller and the driver comprises at least one passive component, and the at least one passive component is electrically coupled to the at least one bond pad.
16. The system of claim 14 , wherein:
the active headlamp further comprises a metal layer electrically and thermally coupled to the bottom surface of the silicon backplane, and
the system further comprises a circuit board electrically and thermally coupled to the metal layer.
17. The system of claim 16 , wherein the at least one passive component comprises a plurality of passive components, and at least one of the plurality of passive components is on the circuit board.
18. The system of claim 14 , wherein the LED array is a monolithic LED array comprising a plurality of emitters, each of the plurality of emitters having a width of 100 μm or less.
19. The system of claim 18 , wherein the plurality of emitters are arranged in rows and columns, and lanes between adjacent rows and columns have a width of 20 μm or less.