Fan out structure for light-emitting diode (LED) device and lighting system
Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.
1. A system comprising:
a silicon backplane having a top surface, a bottom surface, and side surfaces;
a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces;
at least one bond pad on the bottom surface of the substrate;
a metal layer on the bottom surface of the substrate and the bottom surface of the silicon backplane, the metal layer having a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad;
an array of metal connectors on the top surface of the silicon backplane; and
a light-emitting diode (LED) array electrically coupled to the array of the metal connectors on the top surface of the silicon backplane.
2. The system of claim 1 , further comprising at least one via through the substrate, the at least one via filled with a metal material and electrically coupled to the at least one bond pad.
3. The system of claim 2 , further comprising redistribution layers on the top surface of the silicon backplane and the top surface of the substrate, the redistribution layers comprising:
at least one first dielectric layer, and
at least one first metal layer,
the at least one first metal layer extending from the perimeter region of the silicon backplane toward the side surfaces of the substrate and having a least a portion exposed from the at least one first dielectric layer to form at least one other bond pad.
4. The system of claim 3 , wherein the at least one other bond pad is electrically coupled to the at least one via.
5. The system of claim 4 , further comprising at least one passive component electrically coupled to the at least one bond pad.
6. The system of claim 1 , wherein the LED array is a monolithic LED array comprising a plurality of rows and columns of emitters, each of the emitters having a width of 100 μm or less, and lanes between adjacent rows and columns having a width of 20 μm or less.
7. The system of claim 1 , wherein the array of the metal connectors is an array of copper pillar bumps.
8. The system of claim 1 , wherein the substrate comprises a molding material.
9. The system of claim 1 , wherein the silicon backplane is a complementary metal-oxide semiconductor (CMOS) integrated circuit.
10. A system comprising:
a silicon backplane having a top surface, a bottom surface, and side surfaces;
a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces;
a first metal layer electrically and thermally coupled to the bottom surface of the silicon backplane in a central region;
redistribution layers on the bottom surface of the silicon backplane and the bottom surface of the substrate, the redistribution layers comprising at least one dielectric layer and at least one second metal layer, the at least one second metal layer extending from a perimeter region of the silicon backplane toward the side surfaces of the substrate and having at least a portion exposed from the at least one dielectric layer to form at least one bond pad; and
an array of metal connectors on the top surface of the silicon backplane.
11. The system of claim 10 , further comprising at least one via through the substrate, the at least one via filled with a metal material and electrically coupled to the at least one bond pad.
12. The system of claim 11 , further comprising other redistribution layers on the top surface of the silicon backplane and the top surface of the substrate, the other redistribution layers comprising:
at least one other dielectric layer, and
at least one third metal layer,
the at least one third metal layer extending from the perimeter region of the silicon backplane toward the side surfaces of the substrate and having a least a portion exposed from the at least one other dielectric layer to form at least one other bond pad.
13. The system of claim 12 , wherein the at least one third metal layer is electrically coupled to the at least one via.
14. The system of claim 13 , further comprising at least one passive component electrically coupled to the at least one other bond pad.
15. The system of claim 10 , further comprising a light-emitting diode (LED) array electrically coupled to the array of the metal connectors on the top surface of the silicon backplane.
16. The system of claim 15 , wherein the LED array is a monolithic LED array comprising a plurality of rows and columns of emitters, each of the emitters having a width of 100 μm or less, and lanes between adjacent rows and columns having a width of 20 μm or less.
17. The system of claim 10 , wherein the array of the metal connectors is an array of copper pillar bumps.
18. The system of claim 10 , wherein the substrate comprises a molding material.
19. The system of claim 10 , wherein the silicon backplane is a complementary metal-oxide semiconductor (CMOS) integrated circuit.