GRAPHITE ARTICLE
A graphite article which can be compressed by more three (3%) percent at a contact pressure of 100 KPa or less without damaging the graphite article reducing the thermal impedance exhibited by the article. Also a graphite article comprising graphitized polymer having a thickness of at least 75 microns. Preferably the graphite has a density of less than 1.50 g/cc and a compressibility of more than 3% at a contact pressure of 100 KPa. Also the article has a generally sheet like shape. These articles may be used in a thermal management system to dissipate heat from a heat source.
1 - 15 . (canceled)
16 . A compressible graphite article comprising a graphitized polymer sheet having a thickness of at least 200 microns, a density of less than 1.00 g/cc, and a thermal impedance of no more than 0.25 cm 2 ° C./W at a contact pressure of at least 700 kPa.
17 . The graphite article of claim 16 wherein the thickness comprises up to 500 microns.
18 . The graphite article of claim 16 having a resistivity of less than 0.019 (° C./W) at a contact pressure of at least 200 KPa.
19 . The graphite article of claim 16 , wherein as the contact pressure of the graphite article increases, the in-plane thermal conductivity increases.
20 . The graphite article of claim 16 , wherein as the contact pressure of the graphite article increases from 100 KPa to 700 KPa, the in-plane thermal conductivity increases by at least 1.25 times.
21 . The graphite article of claim 16 further comprising a graphitized polymer having no dopant.
22 . The graphite article of claim 16 wherein the thickness comprises up to 300 microns.
23 . An electronic device comprising the graphite article of claim 16 .
24 . The electronic device of claim 23 , whereby the graphite article in operative thermal contact with at least one of a heat source and a heat dissipation element.
25 . The electronic device of claim 24 , whereby the graphite article in compressed operative thermal contact with the at least one of a heat source and a heat dissipation element.
26 . A method of making a thermal management system comprising disposing the graphite article of claim 16 in operative thermal contact with a heat source.
27 . The method of claim 26 further comprising disposing the graphite article in operative thermal communication with a heat dissipation element.
28 . A method of making a thermal management system comprising compressing a compressible graphite article comprising a graphitized polymer sheet having a thickness of at least 200 microns, a density of less than 1.00 g/cc, and a thermal impedance of no more than 0.25 cm 2 ° C./W at a contact pressure of at least 700 kPa in operative thermal communication with a heat source.
29 . The method of claim 28 further comprising disposing the graphite article in operative thermal communication with a heat dissipation element.
30 . A method of making an electronic device comprising attaching a graphite article having a thickness of at least 200 microns, a density of less than 1.00 g/cc, and a thermal impedance of no more than 0.25 cm 2 ° C./W at a contact pressure of at least 700 kPa to an electronic component, whereby the graphite article in thermal communication with the electronic component.
31 . The method of claim 30 wherein the electronic component comprises at least one of a heat source or a heat dissipation element.