Sealed electronic component rework patch
Approaches to patching a leaky hermetically-sealed device include the use of a laminate rework patch that includes an adhesive tape layer, an aluminum sheet layer, and an outer cover layer, and whereby a viscous adhesive is injected or otherwise applied between the patch and the device leak location, over a layer of primer material, to fill the leak and stop the leakage of gas from inside the device. The thickness of the viscous adhesive, and thus the curing time and temperature of the viscous adhesive, can be managed by way of the thickness of the adhesive tape layer.
1. A method of patching a leak in a hermetically-sealed electronic component, the method comprising:
applying primer material on and around a component leak location;
adhering a first portion of a patch onto the component over primer material and at a location for the patch to cover the leak;
injecting a viscous adhesive into a pool volume formed between the patch and the component; and
adhering a second portion of the patch onto the component for the patch to cover and for the adhesive to fill the leak.
2. The method of claim 1 , wherein the patch is a laminate composition comprising:
an adhesive tape layer configured to adhere the first portion and the second portion of the patch to the component,
an aluminum sheet layer, and
an outer cover layer.
3. The method of claim 2 , wherein injecting the adhesive includes injecting the viscous adhesive into the pool volume formed between the aluminum sheet layer of the patch and the component.
4. The method of claim 2 , wherein the patch further comprises an adhesive vent structure formed in the adhesive tape layer and configured to allow some of the viscous adhesive to exit the pool volume.
5. The method of claim 4 , further comprising:
wiping the patch to spread the viscous adhesive onto the component under the patch and to vent excess viscous adhesive from the pool volume through the adhesive vent structure.
6. The method of claim 2 , wherein a thickness of the adhesive tape layer of the patch is less than 50 μm (micrometers), the method further comprising:
wiping the patch to spread the viscous adhesive onto the component under the patch and to vent excess viscous adhesive from the pool volume through an adhesive vent structure; and
curing the viscous adhesive at a thickness less than 50 μm (micrometers).
7. The method of claim 1 , further comprising:
wiping the patch to spread the viscous adhesive onto the component under the patch and to vent excess viscous adhesive from the pool volume through an adhesive vent structure; and
curing the viscous adhesive at room temperature.
8. The method of claim 1 , wherein injecting the viscous adhesive comprises injecting an adhesive having a viscosity less than 1 Pa-s (pascal-second) to maximize capillary action efficacy of the viscous adhesive.
9. A hermetically-sealed hard disk drive product produced according to the method of claim 1 .
10. A hermetically-sealed data storage device hermetically-patched with a patch, the data storage device comprising:
an enclosure base assembly comprising an enclosure base part and having a leak hermetically-patched with the patch;
a primer applied to the enclosure base part over the leak;
the patch adhered over at least a portion of the primer, wherein the patch is a laminate composition comprising:
an adhesive tape layer configured to adhere to the enclosure base part,
an aluminum sheet layer over the adhesive tape layer, and
an outer cover layer over the aluminum sheet layer; and
a viscous adhesive spread between the patch and the enclosure base part, and at least in part filling the leak, thereby stopping leakage of gas from the leak from inside the base assembly.
11. The data storage device of claim 10 , wherein the patch further comprises an adhesive vent structure formed in the adhesive tape layer and configured to allow some of the viscous adhesive to exit a pool volume formed between the aluminum sheet layer and the enclosure base part.
12. The data storage device of claim 10 , further comprising:
a second cover laser welded to the enclosure base part over a first cover; and
wherein the leak is formed in a laser weld bead attaching the second cover to the enclosure base part.
13. The data storage device of claim 10 , wherein the leak is formed in the enclosure base part of the enclosure base assembly.
14. The data storage device of claim 10 , wherein:
a thickness of the adhesive tape layer of the patch is less than 50 μm (micrometers); and
a thickness of the viscous adhesive is less than 50 μm (micrometers).
15. The data storage device of claim 10 , wherein the outer cover layer is composed of polyethylene terephthalate (PET).
16. A hermetically-sealed data storage device, comprising:
means for preparing a material of which an enclosure base part is composed, over a leak location, for assisting with curing a means for adhering;
means for covering the leak location, for assisting with filling the leak with the means for adhering, including means for venting excess means for adhering; and
the means for adhering applied into a volume formed between the means for covering and the enclosure base part.