Semiconductor device
A semiconductor device includes a first semiconductor body including a substrate having a first thickness, wherein the first semiconductor body includes a first active zone that generates or receives radiation, and a second semiconductor body having a second thickness smaller than the first thickness and including a tear-off point is arranged on the substrate and connected in an electrically conducting manner to the first semiconductor body, wherein the second semiconductor body includes a second active zone that generates or receives radiation, and the second active zone generates radiation and the first active zone detects the radiation, and the first semiconductor body includes contacts on its underside for connection to the semiconductor device.
1. A semiconductor device comprising:
a first semiconductor body comprising a substrate having a first thickness, wherein
the first semiconductor body comprises a first active zone that generates or receives radiation,
a second semiconductor body having a second thickness smaller than the first thickness and comprising a tear-off point is arranged on the substrate and connected in an electrically conducting manner to the first semiconductor body, and
a depression in the substrate into which the second semiconductor body is inserted in an at least partly sunk manner,
wherein the first active zone is arranged at a raised portion of the substrate, and the raised portion laterally delimits the depression,
the second semiconductor body comprises a second active zone that generates or receives radiation,
the second active zone generates radiation and the first active zone detects the radiation, and
the first semiconductor body comprises contacts on its underside for connection to the semiconductor device, side walls of the depression are mirrored, and the depression comprises a mirror coating at the mirrored side walls that reduces crosstalk to the first active zone and replaces an optical barrier.
2. The semiconductor device according to claim 1 , wherein the first semiconductor body has a top side at which the first active zone is arranged and on or at which the second semiconductor body is arranged.
3. The semiconductor device according to claim 1 , wherein the second semiconductor body comprises contacts connected to contacts of the first semiconductor body by flip-chip contacting.
4. The semiconductor device according to claim 1 , wherein the first thickness is less than or equal to 200 μm.
5. The semiconductor device according to claim 1 , wherein the first semiconductor body is a silicon chip.
6. The semiconductor device according to claim 1 , wherein the second semiconductor body comprises a radiation-transmissive electrically conductive layer on a side remote from the first semiconductor body.
7. The semiconductor device according to claim 1 , wherein a conductor structure extends from the first semiconductor body to a side of the second semiconductor body remote from the first semiconductor body.
8. The semiconductor device according to claim 1 , wherein the second semiconductor body comprises a web-shaped extension having the tear-off point at its end.
9. The semiconductor device according to claim 1 , wherein the second semiconductor body is a thin-film LED.
10. A sensor comprising a semiconductor device according to claim 1 , wherein the sensor is a proximity, gesture, heart rate or body function sensor.