Method for manufacturing an optical sensor and optical sensor
A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided.
1. A method for manufacturing an optical sensor, the method comprising:
providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at a side of the at least two optical sensor elements facing away from the carrier,
forming a trench between two of the at least two optical sensor elements in a vertical direction which is perpendicular to a main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier,
coating the trench with an opaque material,
forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the at least two optical sensor elements,
forming at least one optical sensor by dicing the optical sensor arrangement along the trench, where
each optical sensor comprises an optical sensor element,
the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements,
a handling substrate is arranged at the back side of the carrier during forming the trench and during coating the trench with the opaque material,
the handling substrate is a tape that is expanded in a lateral direction during the manufacturing, where the lateral direction is parallel to the main plane of extension of the carrier, and
the tape is expanded in the lateral direction after forming the trench and before applying the opaque material.
2. The method for manufacturing an optical sensor according to claim 1 , wherein side surfaces of the trench are coated with the opaque material.
3. The method for manufacturing an optical sensor according to claim 1 , wherein the trench is coated by a molding process.
4. The method for manufacturing an optical sensor according to claim 1 , wherein the trench is completely filled with the opaque material.
5. The method for manufacturing an optical sensor according to claim 1 , wherein the optical sensor is formed by dicing after the trench is coated with the opaque material.
6. The method for manufacturing an optical sensor according to claim 1 , wherein at least one electrically conductive via is formed in the carrier.
7. The method for manufacturing an optical sensor according to claim 1 , wherein after forming the optical sensor by dicing a thickness of the opaque material in a lateral direction amounts to less than 20% of a thickness of one optical sensor in the lateral direction which is parallel to the main plane of extension of the carrier.
8. The method for manufacturing an optical sensor according to claim 1 , wherein the carrier comprises an opaque material.
9. The method for manufacturing an optical sensor according to claim 1 , wherein at least one cover element is arranged at the side of the at least two optical sensor elements which faces away from the carrier.
10. The method for manufacturing an optical sensor according to claim 1 , wherein the trench extends through the whole carrier in the vertical direction.