Optical film having antistatic layers, optical film preparation method and organic light-emitting electronic device preparation method
The present application relates to an optical film, a method for preparing an optical film, and a method for manufacturing an organic light emitting electronic device.
1. An optical film comprising:
a base layer comprising a base film, a first antistatic layer and a second antistatic layer each provided on opposing surfaces of the base film;
a protective layer comprising a protective film, a third antistatic layer and a fourth antistatic layer each provided on opposing surfaces of the protective film; and
a silicone-based adhesive layer provided between the base layer and the protective layer so that the second antistatic layer and the third antistatic layer face each other,
wherein the silicone-based adhesive layer is in direct contact with the third antistatic layer.
2. The optical film of claim 1 , wherein at least one of the first antistatic layer, the second antistatic layer, the third antistatic layer and the fourth antistatic layer comprises a conductive material.
3. The optical film of claim 1 , wherein:
the first antistatic layer has a thickness of greater than or equal to 10 nm and less than or equal to 400 nm,
the second antistatic layer has a thickness of greater than or equal to 10 nm and less than or equal to 400 nm,
the third antistatic layer has a thickness of greater than or equal to 10 nm and less than or equal to 400 nm, and
the fourth antistatic layer has a thickness of greater than or equal to 10 nm and less than or equal to 400 nm.
4. The optical film of claim 1 , wherein a peel strength of the silicone-based adhesive layer measured, when adhered to glass, at a peel angle of 180° and a peel rate of 0.3 m/min, is greater than or equal to 0.5 gf/in and less than or equal to 7 gf/in.
5. The optical film of claim 1 , wherein a wetting time of the silicone-based adhesive layer, when applied to glass, is longer than or equal to 1 second and shorter than or equal to 4 seconds.
6. The optical film of claim 1 , wherein a peeling static voltage of the silicone-based adhesive layer measured at an applying voltage of 10 kV is greater than or equal to 0 kV and less than or equal to 2 kV.
7. A method for preparing an optical film comprising:
forming a base layer comprising a base film, a first antistatic layer and a second antistatic layer each provided on opposing surfaces of the base film;
forming a protective layer comprising a protective film, a third antistatic layer and a fourth antistatic layer each provided on opposing surfaces of the protective film; and
bonding the base layer and the protective layer by a silicone-based adhesive layer,
wherein the second antistatic layer and the third antistatic layer face each other; and
the silicone-based adhesive layer is in direct contact with the third antistatic layer.
8. A method for manufacturing an organic light emitting electronic device comprising:
forming and optical film by:
forming a base layer comprising a base film, a first antistatic layer and a second antistatic layer each provided on opposing surfaces of the base film;
forming a protective layer comprising a protective film, a third antistatic layer and a fourth antistatic layer each provided on opposing surfaces of the protective film; and
bonding the base layer and the protective layer by a silicone-based adhesive layer,
wherein the second antistatic layer and the third antistatic layer face each other; and
the silicone-based adhesive layer is in direct contact with the third antistatic layer;
removing the protective layer from the optical film; and
attaching the silicone-based adhesive layer of the optical film on an encapsulation layer of the organic light emitting device.
9. The method for manufacturing an organic light emitting electronic device of claim 8 , wherein the organic light emitting device comprises a back plate, a plastic substrate, a thin film transistor, an organic light emitting diode and an encapsulation layer in a consecutive order.