Optical film having antistatic layers, optical film manufacturing method, and organic light-emitting electronic device manufacturing method
The present application relates to an optical film, a method for preparing an optical film, and a method for manufacturing an organic light emitting electronic device.
1. An optical film comprising:
a base layer comprising a base film, a first antistatic layer and a second antistatic layer each provided on opposing surfaces of the base film; and
a protective layer comprising a protective film, a third antistatic layer and a fourth antistatic layer each provided on opposing surfaces of the protective film, and a release layer provided on a surface opposite to the surface facing the protective film of the third antistatic layer,
wherein the base layer and the protective layer are bonded by an adhesive layer so that the second antistatic layer and the release layer face each other;
surface resistance of the adhesive layer surface in contact with the release layer is greater than or equal to 10 9 Ω/sq and less than or equal to 5×10 12 Ω/sq; and
the adhesive layer has a relative dielectric constant of 3.5 or greater under 100 kHz.
2. The optical film of claim 1 , wherein the adhesive layer has a thickness of greater than or equal to 10 μm and less than or equal to 200 μm.
3. The optical film of claim 1 , wherein the adhesive layer has a metal ion content of 50 ppm or less.
4. The optical film of claim 1 , wherein the adhesive layer is a non-silicone-based adhesive layer.
5. The optical film of claim 1 , wherein peel strength of the adhesive layer for glass measured at a peel angle of 180° and a peel rate of 0.3 m/min is greater than or equal to 0.5 gf/in and less than or equal to 15 gf/in.
6. The optical film of claim 1 , wherein a wetting time of the adhesive layer for glass is from 1 second to 6 seconds.
7. An optical film comprising:
a base layer comprising a base film, a first antistatic layer and a second antistatic layer each provided on opposing surfaces of the base film; and
an adhesive layer provided on a surface of the second antistatic layer opposite to the surface facing the base film;
wherein peel strength of the adhesive layer for glass measured at a peel angle of 180° and a peel rate of 0.3 m/min is greater than or equal to 0.5 gf/in and less than or equal to 15 gf/in;
wherein the adhesive layer has surface resistance of greater than or equal to 10 9 Ω/sq and less than or equal to 5×10 12 Ω/sq; and
the adhesive layer has a relative dielectric constant of 3.5 or greater under 100 kHz.
8. The optical film of claim 7 , wherein a wetting time of the adhesive layer for glass is from 1 second to 6 seconds.
9. A method for preparing an optical film comprising:
forming a base layer comprising a base film, a first antistatic layer and a second antistatic layer each provided on opposing surfaces of the base film;
forming a protective layer comprising a protective film, a third antistatic layer and a fourth antistatic layer each provided on opposing surfaces of the protective film, and a release layer provided on a surface opposite to the surface facing the protective film of the third antistatic layer; and
bonding the base layer and the protective layer by an adhesive layer so that the second antistatic layer and the release layer face each other,
wherein surface resistance of the adhesive layer surface in contact with the release layer is greater than or equal to 10 9 Ω/sq and less than or equal to 5×10 12 Ω/sq; and
the adhesive layer has a relative dielectric constant of 3.5 or greater under 100 kHz.
10. A method for manufacturing an organic light emitting electronic device comprising:
removing the protective layer from the optical film of claim 1 ; and
attaching the adhesive layer of the optical film on an encapsulation layer of an organic light emitting device.
11. The method for manufacturing an organic light emitting electronic device of claim 10 , wherein the organic light emitting device comprises a back plate, a plastic substrate, a thin film transistor, an organic light emitting diode and an encapsulation layer, in a consecutive order.
12. The method for manufacturing an organic light emitting electronic device of claim 10 , further comprising:
peeling the optical film from the encapsulation layer; and
laminating a touch screen panel and a cover window on the encapsulation layer.