Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In an embodiment an optoelectronic semiconductor component includes a semiconductor body including a first region, an active region configured to generate electromagnetic radiation, a starting region, a plurality of funnel-shaped openings and a second region, wherein the starting region is arranged between the first region and the active region, wherein the active region is arranged between the starting region and the second region, wherein the funnel-shaped openings extend from the starting region through the active region as far as the second region, wherein the semiconductor body is based on a nitride compound semiconductor material, wherein the first region comprises n-doping, wherein the second region comprises p-doping, wherein the funnel-shaped openings are filled with a material of the second region, and wherein the funnel-shaped openings have a pre-determinable density, the density of the funnel-shaped openings being decoupled from a density of dislocations inside the first region.
1. An optoelectronic semiconductor component comprising:
a semiconductor body comprising:
a first region;
an active region configured to generate electromagnetic radiation;
a starting region;
a plurality of funnel-shaped openings; and
a second region,
wherein the starting region is arranged between the first region and the active region,
wherein the active region is arranged between the starting region and the second region,
wherein the funnel-shaped openings extend from the starting region through the active region as far as the second region,
wherein the semiconductor body is based on a nitride compound semiconductor material,
wherein the first region comprises n-doping,
wherein the second region comprises p-doping,
wherein the funnel-shaped openings are filled with a material of the second region,
wherein the funnel-shaped openings have a pre-determinable density, the density of the funnel-shaped openings being decoupled from a density of dislocations inside the first region, and
wherein the density of the funnel-shaped openings is adjusted by an addition of indium,
a material proportion of indium in the starting region lying between 0.1% inclusive and 2% inclusive.
2. The optoelectronic semiconductor component of claim 1 , wherein the funnel-shaped openings are adapted for improved charge carrier injection from the second region into the active region.
3. The optoelectronic semiconductor component of claim 1 , wherein the density of the funnel-shaped openings is at least 10 6 cm −2 and at most 10 10 cm −2 .
4. The optoelectronic semiconductor component of claim 1 , wherein the density of the funnel-shaped openings is adjusted by a concentration of a dopant in the starting region, the dopant being silicon or germanium.
5. The optoelectronic semiconductor component of claim 4 , wherein a value of a dopant concentration is in a range from atoms per cubic centimeter inclusive to 1×10 20 atoms per cubic centimeter inclusive.
6. The optoelectronic semiconductor component of claim 1 , wherein the density of the funnel-shaped openings is adjusted by a growth temperature, the growth temperature lying in a range from 850° C. inclusive to 950° C. inclusive.
7. The optoelectronic semiconductor component of claim 1 , wherein the density of the funnel-shaped openings is adjusted by an addition of aluminum, a material proportion of aluminum in the starting region lying between 1% inclusive and io% inclusive.
8. An optoelectronic semiconductor component comprising:
a semiconductor body comprising:
a first region;
an active region configured to generate electromagnetic radiation;
a starting region;
a plurality of funnel-shaped openings; and
a second region,
wherein the starting region is arranged between the first region and the active region,
wherein the active region is arranged between the starting region and the second region,
wherein the funnel-shaped openings extend from the starting region through the active region as far as the second region,
wherein the semiconductor body is based on a nitride compound semiconductor material,
wherein the first region comprises n-doping,
wherein the second region comprises p-doping,
wherein the funnel-shaped openings are filled with a material of the second region,
wherein the funnel-shaped openings have a pre-determinable density, the density of the funnel-shaped openings being decoupled from a density of dislocations inside the first region, and
wherein the density of the funnel-shaped openings is adjusted by an addition of aluminum, a material proportion of aluminum in the starting region lying between 1% inclusive and 10% inclusive.
9. The optoelectronic semiconductor component of claim 8 , wherein the funnel-shaped openings are adapted for improved charge carrier injection from the second region into the active region.
10. The optoelectronic semiconductor component of claim 8 , wherein the density of the funnel-shaped openings is at least 10 6 cm −2 and at most low 10 10 cm −2 .
11. The optoelectronic semiconductor component of claim 8 , wherein the density of the funnel-shaped openings is adjusted by a concentration of a dopant in the starting region, the dopant being silicon or germanium.
12. The optoelectronic semiconductor component of claim 11 , wherein a value of a dopant concentration is in a range from o atoms per cubic centimeter inclusive to 1×10 20 atoms per cubic centimeter inclusive.
13. The optoelectronic semiconductor component of claim 8 , wherein the density of the funnel-shaped openings is adjusted by a growth temperature, the growth temperature lying in a range from 850° C. inclusive to 950° C. inclusive.