Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device

1. A curable resin composition containing:

(A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the multifunctional benzoxazine compound being at least one multifunctional benzoxazine compound selected from

(1) a multifunctional benzoxazine compound having a structural unit of formula (1)

wherein R represents a linear alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms, or an aryl group having 6 to 14 carbon atoms, where the aryl group optionally has halogen or a linear alkyl group having 1 to 12 carbon atoms, as a substituent, and each Z represents hydrogen, a hydrocarbon group having 1 to 8 carbon atoms and/or a linking group and is optionally the same or different, wherein at least one Z represents a linking group, and benzoxazine rings are linked by the linking group; and

(2) a multifunctional benzoxazine compound represented by a structure of formula (2)

wherein L represents a divalent organic group having 1 to 5 aromatic rings or an alkylene group having 2 to 10 carbon atoms, and the organic group and the alkylene group optionally comprise oxygen and/or sulfur,

(B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, wherein the epoxy compound is at least one compound selected from

(C) a trisphenolmethane type epoxy compound, and

(D) a curing agent,

wherein the curable resin composition has a compounding ratio between component (A) and a total of component (B) and component (C) of 5 parts by mass or more and 150 parts by mass or less, where the compounding ratio is determined by the total of component (B) and component (C) based on 100 parts by mass of component (A), and

wherein the curable resin composition has an epoxy equivalent ratio of 0.5 or more and 1.5 or less, where the epoxy equivalent ratio is determined by [total number of epoxy groups in components (B) and (C)]/[number of cyanato groups in component (A)+number of hydroxyl groups in component (D)].

2. The curable resin composition according to claim 1 , wherein (C) the trisphenolmethane type epoxy compound is an epoxy compound represented by a structure of formula (3):

wherein, in the formula (3), substituents R each independently represents an alkyl group having 1 to 6 carbon atoms, an allyl group or a phenyl group; m represents the number of the substituent(s) R and is an integer of 0 to 3; and n represents an average value, satisfying 0<n <10.

3. The curable resin composition according to claim 2 , further containing (E) an inorganic filler.

4. The curable resin composition according to claim 2 , further containing (F) a curing accelerator.

5. A cured product obtained by curing the curable resin composition according to claim 2 .

6. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 2 .

7. The curable resin composition according to claim 1 , further containing (E) an inorganic filler.

8. The curable resin composition according to claim 7 , further containing (F) a curing accelerator.

9. A cured product obtained by curing the curable resin composition according to claim 7 .

10. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 7 .

11. The curable resin composition according to claim 1 , further containing (F) a curing accelerator.

12. A cured product obtained by curing the curable resin composition according to claim 11 .

13. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 11 .

14. A cured product obtained by curing the curable resin composition according to claim 1 .

15. A semiconductor device, wherein a semiconductor element is disposed in a cured product obtained by curing the curable resin composition according to claim 1 .

16. A method of producing a curable resin composition, the method comprising the steps of:

mixing

(A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the multifunctional benzoxazine compound being at least one multifunctional benzoxazine compound selected from

(1) a multifunctional benzoxazine compound having a structural unit of formula (1)

wherein R represents a linear alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms, or an aryl group having 6 to 14 carbon atoms, where the aryl group optionally has halogen or a linear alkyl group having 1 to 12 carbon atoms, as a substituent, and each Z represents hydrogen, a hydrocarbon group having 1 to 8 carbon atoms and/or a linking group and is optionally the same or different, wherein at least one Z represents a linking group, and benzoxazine rings are linked by the linking group; and

(2) a multifunctional benzoxazine compound represented by a structure of formula (2)

wherein L represents a divalent organic group having 1 to 5 aromatic rings or an alkylene group having 2 to 10 carbon atoms, and the organic group and the alkylene group optionally comprise oxygen and/or sulfur,

(B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, wherein the epoxy compound is at least one compound selected from

(C) a trisphenolmethane type epoxy compound, and

(D) a curing agent, to obtain a mixture; and

processing the mixture into a powdery, pelletized, or granular curable resin composition,

wherein the curable resin composition has a compounding ratio between component (A) and a total of component (B) and component (C) of 5 parts by mass or more and 150 parts by mass or less, where the compounding ratio is determined by the total of component (B) and component (C) based on 100 parts by mass of component (A), and

wherein the curable resin composition has an epoxy equivalent ratio of 0.5 or more and 1.5 or less, where the epoxy equivalent ratio is determined by [total number of epoxy groups in components (B) and (C)]/[number of cyanato groups in component (A)+number of hydroxyl groups in component (D)].

17. The production method according to claim 16 , wherein (C) the trisphenolmethane type epoxy compound is an epoxy compound represented by formula (3):

wherein, in the formula (3), substituents R each independently represents an alkyl group having 1 to 6 carbon atoms, an allyl group or a phenyl group; m represents the number of the substituent(s) R and is an integer of 0 to 3; and n represents an average value, satisfying 0<n <10.

18. The production method according to claim 17 , wherein the step of obtaining a mixture comprises further mixing (E) an inorganic filler and/or (F) a curing accelerator to obtain a mixture.

19. The production method according to claim 16 , wherein the step of obtaining a mixture comprises further mixing (E) an inorganic filler and/or (F) a curing accelerator to obtain a mixture.

20. A method of producing a cured product, the method comprising a step of heating the curable resin composition produced by the method according to claim 16 at 150 to 300° C. for 20 seconds to 1 hour for curing.