Component assembly and method for producing components
A component assembly includes an intermediate carrier, a plurality of components and a plurality of anchoring elements. The components have at least two electrical devices and an insulating layer. At least one of the electrical devices is an optoelectronic semiconductor chip. The insulating layer is between the electrical devices of a same component. The at least two electrical devices of the same component are arranged next to one another and enclosed laterally by the insulating layer. The at least two electrical devices and the insulating layer of the same component are integral parts of a self-supporting and mechanically stable unit. The self-supporting and mechanically stable unit and the anchoring elements fix the positions of the components on the intermediate carrier. The components that are self-supporting and mechanically stable units are detachable from the intermediate carrier, and the anchoring elements release the components under mechanical load when the latter are removed.
1. A method for producing a plurality of printable components on a common intermediate carrier, the components each having at least two electrical devices and an insulating layer, wherein at least one of the electrical devices of the component is an optoelectronic semiconductor chip, having the following steps:
providing a plurality of electrical devices;
forming the insulating layer between the electrical devices of the same component, wherein the at least two electrical devices of the same component are arranged next to one another and each are laterally enclosed by the insulating layer, so that the at least two electrical devices and the insulating layer of the same component are formed as integral parts of a self-supporting and mechanically stable unit and form the self-supporting and mechanically stable unit; and
forming a plurality of anchoring elements which fix the positions of the components on the intermediate carrier and release them under mechanical load when the components are removed, so that the components formed as self-supporting and mechanically stable units are detachable from the intermediate carrier,
wherein
the anchoring elements comprise anchoring posts which are arranged in the vertical direction exclusively between the intermediate carrier and the components and are formed to be breakable or detachable under mechanical load when the components are removed,
the anchoring elements are located on at least two different vertical levels of the component assembly,
the anchoring elements are formed to be electrically conductive at least in places,
the components each have at least one connection pad on their front side facing away from the intermediate carrier, wherein the connection pad is configured to receive a test needle for current injection into the component during a quality test of the functionality of one associated component,
the components are formed such that their functionality can be tested via a cross-matrix circuit, the cross-matrix circuit comprising in places the anchoring elements which are formed to be electrically conductive,
after mechanical decoupling from the intermediate carrier, the components each have a vertical height, wherein at least 90 percent of the vertical height of the component are accounted for by a sum of a vertical layer thickness of the insulating layer and a vertical layer thickness of a carrier of one associated component, and wherein before the decoupling of the component, the carrier is arranged between the intermediate carrier and the electrical devices in the vertical direction, or
after mechanical decoupling from the intermediate carrier, the components each have a vertical height, wherein at least 80 percent of the vertical height of the component are accounted for by a vertical layer thickness of the insulating layer and the insulating layer thus serves as the only mechanically stabilizing layer of the respective component.
2. The method according to claim 1 ,
wherein the components are produced in an additive manner on the single common intermediate carrier, wherein the electrical devices are applied individually onto the intermediate carrier and the electrical devices of the same component are detachable from the intermediate carrier in groups.
3. The method according to claim 1 ,
wherein a carrier assembly is provided, which is fixed to the intermediate carrier by a connecting layer, wherein the carrier assembly is arranged in the vertical direction between the intermediate carrier and the electrical devices, and wherein the components each have a carrier from the carrier assembly.
4. A component assembly having an intermediate carrier, a plurality of components arranged thereon and a plurality of anchoring elements, wherein
the components each have at least two electrical devices and an insulating layer, at least one of the electrical devices of the component being an optoelectronic semiconductor chip,
the insulating layer is arranged in places between the electrical devices of the same component, the at least two electrical devices of the same component being arranged next to one another and each being enclosed laterally by the insulating layer, so that the at least two electrical devices and the insulating layer of the same component are formed as integral parts of a self-supporting and mechanically stable unit and form the self-supporting and mechanically stable unit,
the anchoring elements fix the positions of the components on the intermediate carrier, wherein the components formed as self-supporting and mechanically stable units are detachable from the intermediate carrier and the anchoring elements release the components under mechanical load when the latter are removed, and
the insulating layer directly adjoins the electrical devices, wherein the insulating layer and the electrical devices are formed as contiguous parts of the component.
5. The component assembly according to claim 4 ,
wherein each component has at least three electrical devices, wherein the at least three electrical devices are three optoelectronic semiconductor chips, and wherein the three optoelectronic semiconductor chips are a red light-emitting semiconductor chip, a green light-emitting semiconductor chip and a blue light-emitting semiconductor chip.
6. The component assembly according to claim 4 ,
wherein the anchoring elements comprise anchoring tethers which are formed at least in places sidewards to the components and are formed to be breakable or detachable under mechanical load when the components are removed.
7. The component assembly according to claim 4 ,
wherein the anchoring elements comprise anchoring posts which are arranged in the vertical direction exclusively between the intermediate carrier and the components and are formed to be breakable or detachable under mechanical load when the components are removed.
8. The component assembly according to claim 4 ,
wherein the anchoring elements are located on at least two different vertical levels of the component assembly.
9. The component assembly according to claim 4 ,
wherein the anchoring elements are formed to be electrically insulating.
10. The component assembly according to claim 4 ,
wherein the anchoring elements are formed to be electrically conductive at least in places.
11. The component assembly according to claim 10 ,
wherein with regard to their functionality, the components are formed such that they are testable in groups, wherein the components of the same group to be tested are electrically connected to one another via the electrically conductive anchoring elements and thus are formed so that they testable simultaneously.
12. The component assembly according to claim 4 ,
wherein the components each have at least one connection pad on their front side facing away from the intermediate carrier, wherein the connection pad is configured to receive a test needle for current injection into the component during a quality test of the functionality of one associated component.
13. The component assembly according to claim 4 ,
wherein the components are formed such that their functionality can be tested via a cross-matrix circuit, the cross-matrix circuit comprising in places the anchoring elements which are formed to be electrically conductive.
14. The component assembly according to claim 4 , wherein
the electrical devices are electrically connected to contact layers of one associated component, and
the contact layers are configured for external electrical contacting of the components, and
the contact layers are arranged between the intermediate carrier and the electrical devices such that the contact layers are freely accessible after the components have been detached from the intermediate carrier.
15. The component assembly according to claim 4 ,
wherein a removable sacrificial layer is arranged in the vertical direction between the components and the intermediate carrier, wherein the sacrificial layer forms a common boundary between the intermediate carrier and the components, and wherein after removal of the sacrificial layer, the components are held on the intermediate carrier solely by the anchoring elements.
16. The component assembly according to claim 4 ,
wherein a cavity is formed between adjacent components and/or between the components and the intermediate carrier, wherein the anchoring elements directly adjoin the cavity in places.
17. The component assembly according to claim 4 ,
wherein after mechanical decoupling from the intermediate carrier, the components each have a vertical height, wherein at least 90% of the vertical height of the component are accounted for by a sum of a vertical layer thickness of the insulating layer and a vertical layer thickness of a carrier of one associated component, and wherein before the decoupling of the component, the carrier is arranged between the intermediate carrier and the electrical devices in the vertical direction.
18. The component assembly according to claim 4 ,
wherein after mechanical decoupling from the intermediate carrier, the components each have a vertical height, wherein at least 80% of the vertical height of the component are accounted for by a vertical layer thickness of the insulating layer and the insulating layer thus serves as the only mechanically stabilizing layer of the respective component.
19. The component from the component assembly according to claim 4 , wherein the component is mechanically decoupled from the intermediate carrier.
20. A component assembly having an intermediate carrier, a plurality of components arranged thereon and a plurality of anchoring elements, wherein
the components each have at least two electrical devices and an insulating layer, at least one of the electrical devices of the component being an optoelectronic semiconductor chip,
the insulating layer is arranged in places between the electrical devices of the same component, the at least two electrical devices of the same component being arranged next to one another and each being enclosed laterally by the insulating layer, so that the at least two electrical devices and the insulating layer of the same component are formed as integral parts of a self-supporting and mechanically stable unit and form the self-supporting and mechanically stable unit, and
the anchoring elements fix the positions of the components on the intermediate carrier, wherein the components formed as self-supporting and mechanically stable units are detachable from the intermediate carrier and the anchoring elements release the components under mechanical load when the latter are removed,
wherein
the anchoring elements comprise anchoring posts which are arranged in the vertical direction exclusively between the intermediate carrier and the components and are formed to be breakable or detachable under mechanical load when the components are removed,
the anchoring elements are located on at least two different vertical levels of the component assembly,
the anchoring elements are formed to be electrically conductive at least in places
the components each have at least one connection pad on their front side facing away from the intermediate carrier, wherein the connection pad is configured to receive a test needle for current injection into the component during a quality test of the functionality of one associated component,
the components are formed such that their functionality can be tested via a cross-matrix circuit, the cross-matrix circuit comprising in places the anchoring elements which are formed to be electrically conductive,
after mechanical decoupling from the intermediate carrier, the components each have a vertical height, wherein at least 90 percent of the vertical height of the component are accounted for by a sum of a vertical layer thickness of the insulating layer and a vertical layer thickness of a carrier of one associated component, and wherein before the decoupling of the component, the carrier is arranged between the intermediate carrier and the electrical devices in the vertical direction, or
after mechanical decoupling from the intermediate carrier, the components each have a vertical height, wherein at least 80 percent of the vertical height of the component are accounted for by a vertical layer thickness of the insulating layer and the insulating layer thus serves as the only mechanically stabilizing layer of the respective component.