IP Library Granted Patent US 11,591,497
Granted Patent B2
US 11,591,497 · App. 16/761,958 · Granted Feb 28, 2023

Pressure sensitive adhesive with broad damping temperature range

Inventors: Sara De Vrij (Turnhout, BE); Ingrid E. Geuens (Ranst, BE); Celine E. J. Huyskens (Turnhout, BE)
Assignee: Avery Dennison Corporation
C09J7/38C08G77/08C08G77/70C08K5/14C08L83/04C09J183/04C08G2350/00C08L2205/03C08L2205/22C08L2312/00C09J2203/354C09J2301/208C09J2301/408C09J2421/00C09J2433/00
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Quick Facts
Patent No.
US 11,591,497
App. No.
16/761,958
Granted
Feb 28, 2023
Kind
B2
Abstract

A damping-enhanced pressure-sensitive adhesive comprising a pressure-sensitive adhesive and a at least one damping additive. The pressure-sensitive adhesive comprises a silicone-based polymer and optionally, at least one catalyst and/or at least one initiator.

Claims (55)

1. A damping-enhanced pressure-sensitive adhesive comprising a mixture of:

(i) a silicone pressure-sensitive adhesive in an amount ranging about 50 wt % to about 99.9 wt %, based on the total dry weight of the damping-enhanced silicone pressure-sensitive adhesive;

wherein the silicone pressure sensitive adhesive comprises:

at least one silicone-based polymer;

a resin;

optionally at least one catalyst; and

optionally at least one initiator; and

(ii) at least one damping-additive in an amount ranging from about 0.1 wt % to about 50 wt %,

wherein the damping-additive is selected from the group consisting of an acrylic-based damping additive, a rubber-based damping additive, and combinations thereof; and wherein the damping enhanced silicone pressure sensitive adhesive has a modified damping temperature range of from −40 to 200° C. and a modified damping frequency range of from 10 to 10000 Hz.

2. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping-enhanced pressure-sensitive adhesive has a damping temperature ranging from about −40° C. to about 200° C.

3. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping-enhanced pressure-sensitive adhesive has a damping frequency ranging from about 10 Hz to about 10000 Hz.

4. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping-enhanced pressure-sensitive adhesive has a damping frequency ranging from about 100 Hz to about 8000 Hz.

5. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping % is at least about 2.5% and the damping surface (frequency range times temperature range) is at least 10% greater than the damping surface of a pressure-sensitive adhesive without at least one damping additive.

6. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping % is at least about 2.5% and the damping surface (frequency times temperature) is at least 20% greater than the damping surface of a pressure-sensitive adhesive without at least one damping additive.

7. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping % is at least about 3% and the damping surface (frequency range times temperature range) is at least about 50% greater than the damping surface of a pressure-sensitive adhesive without at least one damping additive.

8. The damping-enhanced pressure-sensitive adhesive of any of claim 1 , wherein the damping % is at least about 3% and the damping surface (frequency range times temperature range) is at least about 100% greater than the damping surface of a pressure-sensitive adhesive without at least one damping additive.

9. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein at least one damping additive is an acrylic-based damping additive resulting in damping enhanced pressure-sensitive adhesive with a damping temperature range between about −40° C. to about 150° C.

10. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein at least one damping additive is a rubber-based damping additive resulting in a damping enhanced pressure-sensitive adhesive with a damping temperature range from about −40° C. to about 150° C.

11. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping additive comprises particles having an average particle size ranging from about 1 micron to about 50 microns.

12. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping additive is suspended in the silicone pressure-sensitive adhesive.

13. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping additive is dissolved in the silicone pressure-sensitive adhesive.

14. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping-enhanced pressure-sensitive adhesive is a heterogeneous mixture of the silicone pressure-sensitive adhesive and at least one damping additive.

15. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the resin comprises an MQ resin.

16. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the pressure-sensitive adhesive further comprises a crosslinker.

17. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping additive is a powder or solid at a temperature range of about 20° C. to about 25° C.

18. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the damping additive is a liquid at a temperature range of about 20° C. to about 25° C.

19. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein at least one initiator is a peroxide.

20. The damping-enhanced pressure-sensitive adhesive of claim 19 , wherein peroxide is benzoyl peroxide (BPO).

21. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein at least one catalyst is a metal.

22. The damping-enhanced pressure-sensitive adhesive of claim 21 , wherein the metal is Pt, Rh, and Sn.

23. The damping-enhanced pressure-sensitive-adhesive of claim 1 , wherein the damping-enhanced pressure-sensitive adhesive comprises: 1) at least one adhesive layer comprising the silicone pressure-sensitive adhesive and 2) at least one damping additive layer comprising at least one damping additive.

24. The damping-enhanced pressure-sensitive adhesive of claim 23 , wherein the adhesive layer comprises at least one damping additive and the damping additive layer comprises at least one damping additive.

25. The damping-enhanced pressure-sensitive adhesive of claim 23 , wherein the adhesive layer and the damping additive layer comprise the same damping additive.

26. The damping-enhanced pressure-sensitive adhesive of claim 23 , wherein the damping-enhanced pressure-sensitive adhesive comprises a first adhesive layer comprising the silicone pressure-sensitive adhesive and at least one damping additive and a second adhesive layer comprising no damping additive.

27. A tape comprising the damping-enhanced pressure-sensitive adhesive of claim 1 .

28. The tape of claim 27 , wherein the tape is a transfer tape.

29. A method for modifying a silicone pressure-sensitive adhesive to improve damping characteristics, the method comprising:

providing the silicone pressure sensitive adhesive of claim 1 ;

adding at least one damping additive to the silicone pressure-sensitive adhesive; and

mixing;

thereby producing a damping enhanced silicone pressure sensitive adhesive having a modified damping temperature range from −40 to 200° C. and a modified damping frequency range of from 10 to 100000 Hz.

30. A method for modifying a silicone pressure-sensitive adhesive to improve damping characteristics, the method comprising:

providing a silicone pressure sensitive adhesive comprising

(a) at least one silicone-based polymer;

(b) a resin;

(c) optionally at least one catalyst; and

(d) optionally at least one initiator;

adding at least one damping additive and optionally the at least one catalyst to the at least one silicone-based polymer and

mixing;

thereby producing a damping enhanced silicone pressure sensitive adhesive having a modified damping temperature range from −40 to 200° C. and a modified damping frequency range of from 10 to 100000 Hz.

31. The method of claim 30 , further comprising:

determining an amount of the damping additive, based on a damping temperature range and a frequency range of the silicone pressure sensitive adhesive and the modified damping temperature range and the modified damping frequency range of the damping-enhanced silicone pressure sensitive adhesive.

32. The method of claim 30 , wherein at least one damping additive selected from the group comprising an acrylic-based damping additive, a rubber-based damping additive, and combinations thereof, present in an amount ranging from about 0.1 wt % to about 50 wt %, based on the total weight of the damping-enhanced pressure-sensitive adhesive.

33. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the acrylic-based damping additive and the silicone PSA are not polymerized.

34. The damping-enhanced pressure-sensitive adhesive of claim 1 , wherein the rubber-based damping additive and the silicone PSA are not be polymerized.

Assignments (2)
CHANGE OF CORPORATE ADDRESS Recorded Jul 9, 2024
From: AVERY DENNISON CORPORATION
To: AVERY DENNISON CORPORATION
Reel/Frame 068236/0440 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 2, 2022
From: GEUENS, INGRID E.; DE VRIJ, SARA; HUYSKENS, CELINE E. J.
To: AVERY DENNISON CORPORATION
Reel/Frame 059774/0947 →
Continuity (2)
Provisional Application 62598875 · Dec 14, 2017
Related Publication 20210179895A1 · Jun 17, 2021