THERMALLY-INSULATED MODULES AND RELATED METHODS
Provided are thermally insulated modules that comprise a first shell and a first component having a first sealed evacuated insulating space therebetween and a current carrier configured to give rise to inductive heating. Also provided are methods of utilizing the disclosed thermally insulated modules in a variety of applications, including additive manufacturing and other applications.
1 - 49 . (canceled)
50 . An insulating module, comprising:
a first shell;
a first component,
the first shell being disposed about the first component,
(a) the first shell comprising a sealed evacuated insulating space, (b) the first shell and first component having a first sealed evacuated insulating space therebetween, (c) the first component comprising a sealed evacuated insulating space, or any one or more of (a), (b), and (c); and
a current carrier configured to give rise to inductive heating,
the current carrier being disposed within the first component or within the first sealed evacuated insulating space.
51 . The insulating module of claim 50 , wherein at least one of the first shell and the first component is non-conducting.
52 . The insulating module of claim 50 , further comprising a second sealed evacuated space disposed about the first shell, the second sealed evacuated space being configured to contain heat evolved by the current carrier.
53 . The insulating module of claim 50 , wherein the current carrier is disposed within the first component.
54 . The insulating module of claim 50 , wherein the current carrier contacts the first component.
55 . The insulating module of claim 50 , wherein the current carrier extends through an aperture formed in the first component.
56 . The insulating module of claim 50 , wherein at least one of the first shell and the first component comprises a ceramic.
57 . The insulating module of claim 50 , wherein the current carrier extends through an aperture formed in the first shell.
58 . The insulating module of claim 50 , wherein at least one of the first shell and the first component is essentially resistant to evolving inductive heat.
59 . The insulating module of claim 50 , further comprising a shield that is at least partially opaque to a magnetic field.
60 . The insulating module of claim 59 , wherein one or both of the first shell and the first component comprises the shield that is at least partially opaque to a magnetic field.
61 . The insulating module of claim 50 , wherein the current collector is operable at a frequency of from about 100 kHz to about 400 kHz.
62 . The insulating module of claim 50 , wherein the current collector is operable at a frequency of greater than about 400 kHz
63 . The insulating module of claim 50 , further comprising an element configured to be inductively heated by the current carrier.
64 . The insulating module of claim 63 , wherein the element is disposed within the first component.
65 . A method, comprising:
operating the current carrier of an insulating module, the insulating module comprising:
a first shell;
a first component;
the first shell being disposed about the first component,
(a) the first shell comprising a sealed evacuated insulating space, (b) the first shell and first component having a first sealed evacuated insulating space therebetween, (c) the first component comprising a sealed evacuated insulating space, or any one or more of (a), (b), and (c); and
a current carrier configured to give rise to inductive heating,
the current carrier being disposed within the first component or within the first sealed evacuated insulating space; and
the operating being performed so as to increase, by inductive heating, the temperature of a working material disposed within the inner shell of the insulating module.
66 . The method of claim 65 , wherein the operating is performed so as to heat the working material without burning the working material.
67 . An insulating module, comprising: a first shell, the first shell comprising a sealed evacuated insulating space; a first component, the first component being disposed within the first shell and the first component comprising a material that is sensitive to inductive heating, the first component being disposed within the first shell, the first component being configured to receive a consumable; an induction heating coil, the induction heating coil being configured to give rise to inductive heating of the first component.
68 . The insulating module of claim 67 , wherein the first component comprises a flat bottom portion.
69 . The insulating module of claim 68 , wherein the induction heating coil is disposed on the flat bottom portion.