Optoelectronic modules having locking assemblies and methods for manufacturing the same
This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.
1. An optoelectronic module comprising:
an optical element assembly including an optical element mounted within an optical element housing;
an overmold assembly, the overmold assembly including an optoelectronic component mounted to a substrate via electrical connections, the optoelectronic component and electrical connections being encapsulated by an overmold and the overmold being laterally circumscribed by an overmold housing; and
the optical element assembly being mounted to the overmold assembly via a locking assembly such that lateral movement of the optical element assembly relative to the overmold assembly is substantially restrained
wherein the locking assembly includes an optical element housing protrusion extending from the optical element housing, the optical element housing protrusion being in contact with a first side of the overmold.
2. The optoelectronic module of claim 1 , wherein the optoelectronic component is operable to sense and/or emit a particular wavelength of electromagnetic radiation.
3. The optoelectronic module of claim 2 , wherein the overmold assembly housing is substantially transparent to the particular wavelength and the optical element housing is substantially non-transparent to the particular wavelength.
4. The optoelectronic module of claim 3 , wherein the optical element includes a diffuser, a refractive optical element, a diffractive optical element, a microlens array, and/or an optical filter.
5. The optoelectronic module of claim 1 , further including the optical element housing being in contact with the overmold housing via adhesive.
6. The optoelectronic module of claim 5 , wherein the locking assembly includes a locking edge incorporated into the overmold housing, the locking edge being disposed adjacent to the optical element housing protrusion and being configured to substantially restrain lateral movement of the optical element assembly relative to the overmold assembly.
7. The optoelectronic module of claim 5 , wherein the locking assembly includes:
a locking edge incorporated into the overmold housing, the locking edge being disposed adjacent to the optical element housing protrusion and being configured to substantially restrain lateral movement of the optical element assembly relative to the overmold assembly; and
an overmold trench disposed within the first side of the overmold, the optical element housing protrusion being in contact with the first side of the overmold via the overmold trench, the overmold trench being configured, together with the locking edge, to substantially restrain lateral movement of the optical element assembly relative to the overmold assembly.
8. The optoelectronic module of claim 7 , wherein the locking assembly includes an overmold protrusion extending from the first side of the overmold, the overmold protrusion, together with the overmold trench and locking edge, to substantially restrain lateral movement of the optical element assembly relative to the overmold assembly.
9. The optoelectronic module of claim 8 , further including the overmold protrusion being configured to substantially block the migration of the adhesive onto the first side of the overmold.
10. The optoelectronic module of claim 1 , in which the overmold housing extends into the substrate.
11. The optoelectronic module of claim 1 , in which the first side of the overmold can include an optical element.
12. The optoelectronic module of claim 11 , wherein the optical element can be formed into the first side of the overmold.
13. The optoelectronic module of claim 1 , in which the optoelectronic component includes an edge-emitting laser diode, a vertical-cavity surface-emitting laser, a light-emitting diode, a photodiode, a demodulation pixel, and/or an image sensor.