Cost-efficient fingerprint sensor component and manufacturing method

1. A method of manufacturing a fingerprint sensor component having a component outline for integration into an electronic device, the method comprising the steps of:

providing a fingerprint sensor package including:

a fingerprint sensor integrated circuit (IC) covered by a protective coating having a sensing surface, and

a package substrate having a die support side, supporting the fingerprint sensor IC, and an external connection side opposite the die support side, the external connection side of the package substrate providing a connection surface of the fingerprint sensor package having connectors for allowing electrical connection of the fingerprint sensor component to said electronic device;

arranging said fingerprint sensor package on a temporary carrier with said connection surface facing said temporary carrier; and

adding, while the fingerprint sensor package is arranged on the temporary carrier, material at least around sides of said fingerprint sensor package connecting the sensing surface and the connection surface of the fingerprint sensor package, while leaving the connection surface of said fingerprint sensor package uncovered.

2. The method according to claim 1 , wherein the step of adding material comprises the step of:

applying a dielectric material to cover at least the sides of said fingerprint sensor package.

3. The method according to claim 2 , wherein:

the dielectric material is applied to cover the sides and the sensing surface of said fingerprint sensor package; and

the method further comprises the step of at least partly removing said dielectric material, at least over said fingerprint sensor package.

4. The method according to claim 3 , wherein a sufficient thickness of said dielectric material is removed to expose the sensing surface of said fingerprint sensor package.

5. The method according to claim 4 , wherein, while said dielectric material is at least partly removed, said fingerprint sensor package is thinned down in such a way that a new sensing surface is formed.

6. The method according to claim 1 , wherein the step of adding material comprises the step of:

arranging at least one spacing member on said temporary carrier to at least partly surround said fingerprint sensor package.

7. The method according to claim 6 , wherein said at least one spacing member comprises a frame surrounding said fingerprint sensor package.

8. The method according to claim 1 , further comprising the step of:

removing material around said fingerprint sensor package in such a way that said component outline is achieved.

9. The method according to claim 1 , comprising the steps of:

providing a plurality of fingerprint sensor packages, each having a sensing surface, a connection surface opposite the sensing surface, and sides connecting the sensing surface and the connection surface, the connection surface having connectors for allowing electrical connection of the fingerprint sensor component to said electronic device;

arranging each fingerprint sensor package in said plurality of fingerprint sensor packages on a temporary carrier with said connection surface facing said temporary carrier; and

adding material at least around the sides of each fingerprint sensor package in said plurality of fingerprint sensor packages to achieve said component outline, while leaving the connection surface of said fingerprint sensor package uncovered.

10. A fingerprint sensor component having a component outline for integration into an electronic device, said fingerprint sensor component comprising:

a fingerprint sensor package including:

a fingerprint sensor integrated circuit (IC) covered by a protective coating having a sensing surface, and

a package substrate having a die support side, supporting the fingerprint sensor IC, and an external connection side opposite the die support side, the external connection side of the package substrate providing a connection surface of the fingerprint sensor package having connectors for allowing electrical connection of the fingerprint sensor component to said electronic device, said fingerprint sensor package having a fingerprint sensor package outline, different from said component outline; and

material added at least around the sides of said fingerprint sensor package, while leaving the connection surface of said fingerprint sensor package uncovered, said material defining the component outline of said fingerprint sensor component.

11. The fingerprint sensor component according to claim 10 , wherein said material comprises a molding compound or an adhesive.

12. The fingerprint sensor component according to claim 10 , wherein said material comprises at least one spacing member arranged to at least partly surround said fingerprint sensor package.

13. An electronic device comprising:

processing circuitry; and

the fingerprint sensor component according to claim 10 , electrically coupled to said processing circuitry through the connectors on the connection surface of the fingerprint sensor package comprised in said fingerprint sensor component.