IP Library Granted Patent US 11,258,993
Granted Patent B2
US 11,258,993 · App. 16/764,474 · Granted Feb 22, 2022

Solid-state imaging device and electronic apparatus

Inventor: Kozo Hoshino (Tokyo, JP)
Assignee: Sony Semiconductor Solutions Corporation
H04N9/04551H04N5/35581H04N5/36961
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Quick Facts
Patent No.
US 11,258,993
App. No.
16/764,474
Granted
Feb 22, 2022
Kind
B2
Abstract

The present technology relates to a solid-state imaging device and an electronic apparatus that enable simultaneous acquisition of a signal for generating a high dynamic range image and a signal for detecting a phase difference. The solid-state imaging device includes a plurality of pixel sets each including color filters of the same color, for a plurality of colors, each pixel set including a plurality of pixels. Each pixel includes a plurality of photodiodes PD. The present technology can be applied, for example, to a solid-state imaging device that generates a high dynamic range image and detects a phase difference, and the like.

Claims (42)

1. A solid-state imaging device comprising:

a plurality of pixel sets respectively including color filters of a same color, for a plurality of colors, each pixel set including four pixels, each of the four pixels including two photoelectric conversion parts, each pixel set further including a charge holding part that is coupled to the two photoelectric conversion parts of all of the four pixels in the pixel set.

2. The solid-state imaging device according to claim 1 , wherein

each pixel includes the two photoelectric conversion parts disposed symmetrically in a vertical direction or a horizontal direction, and

orientations of the two photoelectric conversion parts of the respective pixels are in a same direction.

3. The solid-state imaging device according to claim 2 , wherein

the orientations of the photoelectric conversion parts of the pixels are in the same direction in all the pixel sets.

4. The solid-state imaging device according to claim 1 , wherein

each pixel includes the two photoelectric conversion parts disposed symmetrically in a vertical direction or a horizontal direction, and

orientations of the two photoelectric conversion parts of two of the pixels that are in the horizontal direction in each pixel set are in a same direction.

5. The solid-state imaging device according to claim 1 , wherein

each pixel includes the two photoelectric conversion parts disposed symmetrically in a vertical direction or a horizontal direction, and

orientations of the photoelectric conversion parts of two of the pixels that are arranged in the horizontal direction in each pixel set are in orthogonal directions.

6. The solid-state imaging device according to claim 1 , wherein the two photoelectric conversion parts of each pixel are isolated from each other by an insulating layer.

7. The solid-state imaging device according to claim 1 , wherein the two photoelectric conversion parts of each pixel are isolated from each other by an impurity layer of a conductivity type opposite to a conductivity type of the two photoelectric conversion parts.

8. The solid-state imaging device according to claim 7 , wherein

the impurity layer forms a potential barrier lower than a potential barrier at pixel boundaries.

9. The solid-state imaging device according to claim 1 , wherein

a light-shielding film is formed at some of the plurality of pixel sets, the light-shielding film partly shielding all the pixels in each pixel set from light.

10. The solid-state imaging device according to claim 1 , wherein

a light-shielding film is formed at some of the plurality of pixel sets, the light-shielding film entirely shielding some of the pixels in each pixel set from light.

11. The solid-state imaging device according to claim 1 , wherein the charge holding part is configured to add and output charges generated in the two photoelectric conversion parts of all of the four pixels.

12. The solid-state imaging device according to claim 1 , wherein

of the two photoelectric conversion parts of the four pixels included in each pixel set, a first photoelectric conversion part and a second photoelectric conversion part are exposed for different exposure times.

13. The solid-state imaging device according to claim 12 , further comprising:

a control unit that performs control to output charges of light received by each photoelectric conversion part as a pixel signal,

the control unit outputting a first pixel signal of the first photoelectric conversion part exposed for a first exposure time, and outputting a second pixel signal of the second photoelectric conversion part exposed for a second exposure time.

14. The solid-state imaging device according to claim 1 , wherein

pixel signals generated in the two photoelectric conversion parts of at least some of the four pixels included in each pixel set are output separately.

15. The solid-state imaging device according to claim 1 , wherein

of the four pixels included in each pixel set, the photoelectric conversion parts of a first pixel are exposed for a first exposure time, the photoelectric conversion parts of a second pixel are exposed for a second exposure time shorter than the first exposure time, and pixel signals generated in the plurality of photoelectric conversion parts of the second pixel exposed for the second exposure time are output separately.

16. The solid-state imaging device according to claim 1 , wherein

of the four pixels included in each pixel set, the photoelectric conversion parts of a first pixel are exposed for a first exposure time, the photoelectric conversion parts of a second pixel are exposed for a second exposure time shorter than the first exposure time, the photoelectric conversion parts of a third pixel are exposed for a third exposure time shorter than the second exposure time, and pixel signals generated in the plurality of photoelectric conversion parts of the second pixel exposed for the second exposure time are output separately.

17. The solid-state imaging device according to claim 1 , wherein

the color filters in the pixel sets are arranged in a Bayer array.

18. An electronic apparatus comprising:

a solid-state imaging device including

a plurality of pixel sets respectively including color filters of a same color, for a plurality of colors, each pixel set including four pixels, each of the four pixels including two photoelectric conversion parts, each pixel set further including a charge holding part that is coupled to the two photoelectric conversion parts of all of the four pixels in the pixel set.

19. The electronic apparatus according to claim 18 , wherein

each pixel includes the two photoelectric conversion parts disposed symmetrically in a vertical direction or a horizontal direction, and

orientations of the photoelectric conversion parts of two of the pixels that are arranged in the horizontal direction in each pixel set are in orthogonal directions.

20. The electronic apparatus according to claim 18 , wherein the charge holding part is configured to add and output charges generated in the two photoelectric conversion parts of all of the four pixels.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2020
From: HOSHINO, KOZO
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 054104/0473 →
Priority Claims (1)
JP JP2017-224138 · Nov 22, 2017 · national
Continuity (1)
Related Publication 20200358989A1 · Nov 12, 2020
Cited By (5)
US 12,192,644 US 12,513,381 US 12,543,386 US 12,568,697 US 12,684,265