Low-dielectric adhesive composition
The present invention aims to provide an adhesive composition which exhibits high adhesive property not only to the conventional polyimide and polyester film but also to a metal substrate, can achieve high solder heat resistance and exhibits excellent low-dielectric characteristics. According to the present invention, there is provided an adhesive composition containing an acid-modified polyolefin (a), an oligo-phenylene ether (b) having a number-average molecular weight of 3000 or less, and an epoxy resin (c), wherein the adhesive composition satisfies the following requirement(s) (A) and/or (B): (A) The adhesive composition contains more than 20 parts by mass and 60 parts by mass or less of the epoxy resin (c) to 100 parts by mass of the acid-modified polyolefin (a); (B) The adhesive composition further contains a polycarbodiimide (d).
1. An adhesive composition of varnish type comprising an acid-modified polyolefin (a), an oligo-phenylene ether (b) having a number-average molecular weight of 3000 or less, an epoxy resin (c), and an organic solvent, wherein the adhesive composition comprises 0.05 to 100 part(s) by mass of the oligo-phenylene ether (b) to 100 parts by mass of the acid-modified polyolefin (a); and
wherein the adhesive composition satisfies the following requirement (B) and optionally further satisfies the following requirement (A):
(A) the adhesive composition comprises more than 20 parts by mass and 60 parts by mass or less of the epoxy resin (c) to 100 parts by mass of the acid-modified polyolefin (a);
(B) the adhesive composition comprises 0.5 to 20 part(s) by mass of a polycarbodiimide (d) to 100 parts by mass of the acid-modified polyolefin (a) and 0.5 to 60 part(s) by mass of the epoxy resin (c) to 100 parts by mass of the acid-modified polyolefin (a).
2. The adhesive composition according to claim 1 , wherein the acid value of the acid-modified polyolefin (a) is 5 to 40 mg KOH/g.
3. The adhesive composition according to claim 1 , wherein the oligo-phenylene ether (b) having a number-average molecular weight of 3000 or less has a structural unit of the following formula (I) and/or a structural unit of the following formula (II):
wherein, in the formula (I), R 1 , R 2, R 3 and R 4 each independently represents a hydrogen atom, an alkyl group which may be optionally substituted, an alkenyl group which may be optionally substituted, an alkynyl group which may be optionally substituted, an aryl group which may be optionally substituted, an aralkyl group which may be optionally substituted, or an alkoxy group which may be optionally substituted;
wherein, in the formula (II), R 11 , R 12, R 13, R 14, R 15, R 16, R 17 and R 18 each independently represents a hydrogen atom, an alkyl group which may be optionally substituted, an alkenyl group which may be optionally substituted, an alkynyl group which may be optionally substituted, an aryl group which may be optionally substituted, an aralkyl group which may be optionally substituted, or an alkoxy group which may be optionally substituted; and A is a linear, branched or cyclic divalent hydrocarbon group having a number of carbon atoms of 20 or less, or oxygen.
4. The adhesive composition according to claim 1 , wherein the adhesive composition has a relative dielectric constant (ε c ) at 1 GHz of 3.0 or less and a dielectric tangent (tan δ) at 1 GHz of 0.02 or less.
5. An adhesive sheet which comprises the adhesive composition according to claim 1 .
6. A laminate which comprises the adhesive composition according to claim 1 .
7. A printed-circuit board which comprises the laminate according to claim 6 as a constituting element.
8. The adhesive composition according to claim 1 , comprising 0.05 to 50 part(s) by mass of the oligo-phenylene ether (b) to 100 parts by mass of the acid-modified polyolefin (a).
9. The adhesive composition according to claim 1 , wherein the adhesive composition further satisfies requirement (A).