ELECTRONIC CONTROL DEVICE
An electronic control device includes a substrate, a heat generating component mounted on the substrate, a heat dissipation unit thermally coupled to a surface of the heat generating component located on a side opposite to the substrate side, and a cooling mechanism thermally coupled to the heat dissipation unit. The heat dissipation unit includes a porous thermal conductor and a semi-cured resin which includes a heat conductive filler and is formed between at least the porous thermal conductor and the surface of the heat generating component.
1 . An electronic control device comprising:
a substrate;
a heat generating component mounted on the substrate;
a heat dissipation unit thermally coupled to a surface of the heat generating component located on a side opposite to the substrate side; and
a cooling mechanism thermally coupled to the heat dissipation unit, wherein
the heat dissipation unit includes:
a porous thermal conductor; and
a semi-cured resin which includes a heat conductive filler and is formed between at least the porous thermal conductor and the surface of the heat generating component.
2 . The electronic control device according to claim 1 , wherein
the heat dissipation unit further includes a semi-cured resin which includes a heat conductive filler and is formed between the porous thermal conductor and the cooling mechanism.
3 . The electronic control device according to claim 1 , wherein
the heat dissipation unit further includes a solder layer formed between the porous thermal conductor and the cooling mechanism.
4 . The electronic control device according to claim 1 , wherein
a semi-cured resin including a heat conductive filler is filled in a pore of the porous thermal conductor.
5 . The electronic control device according to claim 1 , wherein
the porous thermal conductor covers an entire region of the surface of the heat generating component.
6 . The electronic control device according to claim 1 , wherein
a protruding portion surrounding an outer periphery of the porous thermal conductor and extending to the substrate side is provided on a surface of the cooling mechanism on the heat generating component side.
7 . The electronic control device according to claim 6 , wherein
the heat generating component includes a lower back portion having a thickness smaller than that of a central portion on a peripheral portion on the surface side, and
a semi-cured resin including a heat conductive filler is formed between a top surface of the protruding portion and the lower back portion of the heat generating component.
8 . The electronic control device according to claim 7 , wherein
the top surface of the protruding portion is disposed closer to the lower back portion side than the surface of the central portion of the heat generating component.
9 . The electronic control device according to claim 6 , wherein
the protruding portion is formed to cover an outer periphery of the heat generating component, and a semi-cured resin including a heat conductive filler is formed between a top surface of the protruding portion and a peripheral portion of the heat generating component.
10 . The electronic control device according to claim 9 , wherein
the top surface of the protruding portion is disposed closer to the substrate side than the surface of the heat generating component.
11 . The electronic control device according to claim 7 , wherein
an inner region of the protruding portion is formed to be thicker than an outer periphery side region of the protruding portion.