IP Library Granted Patent US 11,201,270
Granted Patent B2
US 11,201,270 · App. 16/773,543 · Granted Dec 14, 2021

Method for increasing the light output of microLED devices using quantum dots

Inventor: Ernest C. Lee (Palo Alto, CA)
Assignee: Nanosys, Inc.
H01L33/60C09K11/025C09K11/883F21V9/20H01L23/5387H01L25/0753H05B33/14B82Y20/00B82Y40/00H01L33/44H01L33/502H01L33/507H01L2933/0041H01L2933/0058H01L2933/0083Y10S977/774Y10S977/818Y10S977/819Y10S977/824Y10S977/892Y10S977/95
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Quick Facts
Patent No.
US 11,201,270
App. No.
16/773,543
Granted
Dec 14, 2021
Kind
B2
Abstract

Illumination devices based on quantum dot technology and methods of making such devices are described. An illumination device includes a substrate having a plurality of microLEDs, a beam splitter, and a film having a plurality of quantum dots. The beam splitter includes a plurality of layers and is disposed between the substrate and the film having the plurality of quantum dots.

Claims (28)

1. A method of fabricating an illumination device, the method comprising:

forming a plurality of microLEDs on a substrate;

disposing a continuous layer of beam splitter in physical contact with top and side surfaces of the plurality of microLEDs, wherein continuous layer of the beam splitter comprises a plurality of stacked layers; and

disposing a film comprising a plurality of quantum dots in physical contact with the continuous layer of beam splitter.

2. The method of claim 1 , wherein each of the plurality of microLEDs is configured to emit light only in a blue wavelength range.

3. The method of claim 1 , wherein the disposing the continuous layer of beam splitter comprises disposing a compound laminate structure that includes the plurality of layers.

4. The method of claim 1 , wherein the plurality of stacked film layers are formed from an extruded polymer.

5. The method of claim 1 , wherein the disposing continuous layer of the beam splitter comprises depositing layers of material using chemical vapor deposition (CVD).

6. The method of claim 5 , wherein the material includes titanium dioxide, tantalum pentoxide, or silicon dioxide.

7. The method of claim 1 , wherein the disposing the continuous layer of beam splitter comprises depositing layers of material using atomic layer deposition (ALD).

8. The method of claim 7 , wherein the material includes titanium dioxide, tantalum pentoxide, or silicon dioxide.

9. The method of claim 1 , wherein the disposing the film comprises disposing a first layer, a second layer, and an adhesive material between the first layer and the second layer, the adhesive material comprising the plurality of quantum dots.

10. The method of claim 1 , wherein the plurality of layers are disposed such that the continuous layer of beam splitter transmits at least 90% of light having a wavelength between 400 nm and 480 nm and reflects at least 90% of light having a wavelength between 500 nm and 800 nm.

11. The method of claim 1 , wherein the forming the plurality of microLEDs comprises forming the plurality of microLEDs in an array.

12. The method of claim 1 , wherein the disposing the film comprises disposing the film having a first group of quantum dots of the plurality of quantum dots configured to emit light in a green wavelength range and a second group of quantum dots of the plurality of quantum dots configured to emit light in a red wavelength range.

13. A method of fabricating a display device, comprising:

forming a plurality of microLEDs on a substrate;

disposing a continuous layer of beam splitter in physical contact with top and side surfaces of the plurality of microLEDs to transmit light from the plurality of microLEDs; and

disposing a plurality of quantum dots on the continuous layer of beam splitter.

14. The method of claim 13 , wherein the disposing the continuous layer of beam splitter comprises disposing a plurality of layers on the top and side surfaces of the plurality of microLEDs.

15. The method of claim 13 , wherein the disposing the continuous layer of beam splitter comprises disposing a first portion of the continuous layer of beam splitter on the substrate and disposing a second portion of the continuous layer of beam splitter on the top and side surfaces of the plurality of microLEDs.

16. The method of claim 13 , wherein forming the plurality of microLEDs comprises forming each microLED of the plurality of microLEDs to emit light only in a blue wavelength range.

17. The method of claim 13 , wherein the disposing the continuous layer of beam splitter comprises disposing a plurality of layers with refractive indices different from each other.

18. The method of claim 13 , further comprising:

disposing a first layer and a second layer on the continuous layer of beam splitter; and

disposing an adhesive material between the first layer and the second layer, wherein the adhesive material comprises the plurality of quantum dots.

19. The method of claim 13 , wherein the disposing the continuous layer of beam splitter comprises disposing the continuous layer of beam splitter such that at least 90% of light having a wavelength between 400 nm and 480 nm is transmitted and at least 90% of light having a wavelength between 500 nm and 800 nm is reflected.

20. The method of claim 13 , wherein the disposing the plurality of quantum dots comprises disposing a first group of quantum dots of the plurality of quantum dots configured to emit light in a green wavelength range and disposing a second group of quantum dots of the plurality of quantum dots configured to emit light in a red wavelength range.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE ASSIGNEE TO BE: 2-1-1, NISHI-SHINJUKU SHINJUKU-KU TOKYO, JAPAN 163-0043 PREVIOUSLY RECORDED AT REEL: 065114 FRAME: 0769. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Oct 9, 2023
From: NANOSYS, INC.
To: SHOEI CHEMICAL INC.
Reel/Frame 065271/0540 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2023
From: NANOSYS, INC.
To: SHOEI CHEMICAL INC.
Reel/Frame 065114/0769 →
TERMINATION AND RELEASE OF PATENT SECURITY AGREEMENT RECORDED AT REEL 059569 / FRAME 0840 Recorded Sep 7, 2023
From: FORTRESS CREDIT CORP.,
To: NANOSYS, INC.
Reel/Frame 064836/0263 →
SECURITY INTEREST Recorded Apr 1, 2022
From: NANOSYS, INC.
To: FORTRESS CREDIT CORP., AS AGENT
Reel/Frame 059569/0840 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2020
From: LEE, ERNEST C.
To: NANOSYS, INC.
Reel/Frame 051660/0414 →