IP Library Granted Patent US 11,305,378
Granted Patent B2
US 11,305,378 · App. 16/773,759 · Granted Apr 19, 2022

Wafer alignment with restricted visual access

Inventor: Thomas Pass (San Jose, CA)
Assignee: SunPower Corporation
B23K26/032H01L21/67259H01L21/681H01L31/14H01L31/18G03F9/7084G03F9/7088H01L31/022491
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,305,378
App. No.
16/773,759
Granted
Apr 19, 2022
Kind
B2
Abstract

Wafer alignment with restricted visual access has been disclosed. In an example, a method of processing a substrate for fabricating a solar cell involves supporting the substrate over a stage. The method involves forming a substantially opaque layer over the substrate. The substantially opaque layer at least partially covers edges of the substrate. The method involves performing fit-up of the substantially opaque layer to the substrate. The method involves illuminating the covered edges of the substrate with light transmitted through the stage, and capturing a first image of the covered edges of the substrate based on the light transmitted through the stage. The method further includes determining a first position of the substrate relative to the stage based on the first image of the covered edges. The substrate may be further processed based on the determined first position of the substrate under the substantially opaque layer.

Claims (33)

1. A non-transitory machine-accessible storage medium storing instructions executable by a computing device to perform:

supporting a substrate over a stage;

forming a substantially opaque layer over the substrate, the substantially opaque layer at least partially covering edges of the substrate, wherein forming the substantially opaque layer over the substrate comprises placing a metal sheet over the substrate;

performing fit-up of the substantially opaque layer to the substrate, wherein the substantially opaque layer extends beyond the edges of the substrate outside of a perimeter of the substrate following the fit-up, wherein performing fit-up comprises applying pressure to the metal sheet;

illuminating the at least partially covered edges of the substrate with light transmitted through the stage;

capturing a first image of the at least partially covered edges of the substrate based on the light transmitted through the stage;

determining a first position of the substrate relative to the stage based on the first image of the at least partially covered edges;

processing the substrate based on the determined first position of the substrate under the substantially opaque layer, wherein processing the substrate based on the determined first position comprises applying a laser to at least the metal sheet or a metal layer of the substrate;

capturing a second image of the at least partially covered edges of the substrate after said applying the laser; and

determining a second position of the substrate relative to the stage based on the second image of the at least partially covered edges.

2. The non-transitory machine-accessible storage medium of claim 1 , wherein capturing the first image of the at least partially covered edges of the substrate comprises capturing the first image through one or more substantially transparent windows in the stage.

3. The non-transitory machine-accessible storage medium of claim 1 , wherein capturing the first image of the at least partially covered edges of the substrate comprises capturing the first image through the stage.

4. The non-transitory machine-accessible storage medium of claim 1 , wherein capturing the first image of the at least partially covered edges comprises capturing the first image with an image sensor located below the stage.

5. The non-transitory machine-accessible storage medium of claim 1 , wherein illuminating the at least partially covered edges of the substrate with light transmitted through the stage comprises illuminating with dark field illumination.

6. The non-transitory machine-accessible storage medium of claim 1 , wherein illuminating the at least partially covered edges of the substrate comprises illuminating the at least partially covered edges with one or more light sources located in the stage.

7. The non-transitory machine-accessible storage medium of claim 1 , wherein illuminating the at least partially covered edges of the substrate comprises illuminating the at least partially covered edges with one or more light sources located below the stage.

8. The non-transitory machine-accessible storage medium of claim 1 , wherein capturing the first image comprises capturing an image of each of the at least partially covered edges of the substrate.

9. The non-transitory machine-accessible storage medium of claim 1 , wherein capturing the first image comprises capturing an image of each of a plurality of comers of the substrate.

10. A non-transitory machine-accessible storage medium storing instructions executable by a computing device to perform:

supporting a substrate over a stage;

forming a substantially opaque layer over the substrate, the substantially opaque layer at least partially covering edges of the substrate, wherein forming the substantially opaque layer over the substrate comprises placing a metal sheet over the substrate;

performing fit-up of the substantially opaque layer to the substrate, wherein the substantially opaque layer extends beyond the edges of the substrate outside of a perimeter of the substrate following the fit-up, wherein performing fit-up comprises applying pressure to the metal sheet;

illuminating the at least partially covered edges of the substrate with light transmitted through the stage;

capturing a first image of the at least partially covered edges of the substrate based on the light transmitted through the stage;

determining a first position of the substrate relative to the stage based on the first image of the at least partially covered edges;

processing the substrate based on the determined first position of the substrate under the substantially opaque layer, wherein processing the substrate based on the determined first position comprises applying a laser to at least the metal sheet or a metal layer of the substrate;

patterning the metal sheet;

capturing a second image of the at least partially covered edges of the substrate after patterning the metal sheet;

determining a second position of the substrate relative to the stage based on the second captured image of the at least partially covered edges; and

trimming the patterned metal sheet.

11. The non-transitory machine-accessible storage medium of claim 10 , wherein capturing the first image of the at least partially covered edges of the substrate comprises capturing the first image through one or more substantially transparent windows in the stage.

12. The non-transitory machine-accessible storage medium of claim 10 , wherein capturing the first image of the at least partially covered edges of the substrate comprises capturing the first image through the stage.

13. The non-transitory machine-accessible storage medium of claim 10 , wherein capturing the first image of the at least partially covered edges comprises capturing the first image with an image sensor located below the stage.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2025
From: TOTALENERGIES SE; TOTALENERGIES SOLAR INTL
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 073059/0081 →
SECURITY INTEREST Recorded Jun 27, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067924/0062 →
SECOND LIEN SECURITY INTEREST AGREEMENT Recorded Jun 26, 2024
From: MAXEON SOLAR PTE. LTD
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 071343/0553 →
SECURITY INTEREST Recorded Jun 5, 2024
From: MAXEON SOLAR PTE. LTD.
To: DB TRUSTEES (HONG KONG) LIMITED
Reel/Frame 067637/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2023
From: SUNPOWER CORPORATION
To: MAXEON SOLAR PTE. LTD.
Reel/Frame 062699/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2020
From: PASS, THOMAS
To: SUNPOWER CORPORATION
Reel/Frame 051640/0179 →