System and method for enhanced cooling

1. An electronic device, comprising:

a packaged device, comprising:

a component that generates thermal energy,

a package that encapsulates the component, and

an interconnect that forms a portion of a high thermal conduction path between the component and a circuit card; and

a thermal dissipater adapted to:

obtain the thermal energy via the high thermal conduction path using the circuit card; and

radiate the thermal energy, wherein the thermal dissipater adds less than 10% to a height of the packaged device measured from the circuit card;

wherein the circuit card comprises a second high thermal conduction path that connects the high thermal conduction path to the thermal dissipater, and

wherein the high thermal conduction path comprises a continuous metal path that directly connects the packaged device to a metal portion of the thermal dissipater.

2. The electronic device of claim 1 , wherein the second high thermal conduction path comprises a ground line of the circuit card.

3. The electronic device of claim 1 , wherein the thermal dissipater is thermally connected to the component by a low thermal conduction path.

4. The electronic device of claim 3 , wherein the low thermal conduction path comprises an air gap between a portion of the package and a portion of the thermal dissipater.

5. The electronic device of claim 3 , wherein the low thermal conduction path comprises:

the package, and

a thermal interface material that physically connects the portion of the thermal dissipater and the package.

6. The electronic device of claim 1 , wherein the thermal dissipater comprises:

a body, and

standoffs adapted to separate the body from the circuit card by a separation distance.

7. The electronic device of claim 6 , wherein the separation distance is based on a thickness of the packaged device.

8. The electronic device of claim 6 , wherein the body comprises a planar sheet.

9. The electronic device of claim 8 , wherein the standoffs comprise a wall that extends along an edge of the planar sheet.

10. A thermal dissipater for dissipating thermal energy generated by a packaged device, comprising:

a body; and

standoffs adapted to obtain the thermal energy by a thermal conduction path between the standoffs and the packaged device,

wherein the thermal conduction path does not include a package of the packaged device that encapsulates a component of the packaged device that generates the thermal energy,

wherein the thermal conduction path includes a circuit card,

wherein the thermal conduction path comprises a continuous metal path that directly connects the packaged device to the standoffs, and

wherein the thermal dissipater adds less than 10% to a height of the packaged device measured from the circuit card.

11. The thermal dissipater of claim 10 , wherein the thermal conduction path includes an interconnect between the component and the circuit card.

12. The thermal dissipater of claim 11 , wherein the interconnect is an electrical interconnect.

13. The thermal dissipater of claim 10 , wherein the standoffs comprise:

a wall that runs along an edge of the body.

14. The thermal dissipater of claim 10 , wherein the body is adapted to obtain the thermal energy by a second thermal conduction path.

15. The thermal dissipater of claim 14 , wherein the thermal conduction path has a first thermal resistance, wherein the second thermal conduction path has a second thermal resistance, wherein the second thermal resistance is larger than the first thermal resistance.

16. The thermal dissipater of claim 14 , wherein the second thermal conduction path comprises the package.

17. The thermal dissipater of claim 16 , wherein the second thermal conduction path further comprises an air gap between the package and the body.

18. The thermal dissipater of claim 16 , wherein the second thermal conduction path further comprises a thermal interface material that physically connects the body and the package.