Overmolded optical circuits
A method of preparing an overmolded optical fiber assembly comprising: (a) placing at least one flexible optical circuit in a bottom mold, said bottom mold defining a bottom overmold cavity having a bottom surface, said at least one flexible optical circuit having a substrate and a plurality of fibers adhered to said substrate, said substrate being disposed within said bottom overmold cavity to define a first space between said substrate and said bottom surface; (b) flowing a polymer in at least said first space; (c) placing a top mold over said substrate, said top mold defining a top overmold cavity and a top surface and a port defined in said top surface to access said top overmold cavity, said substrate defining a second space between said top surface and said substrate; (d) flowing a polymer in at least a portion of said second space; and (e) removing said bottom and top molds to release said overmolded optical circuit.
1. A method of preparing an overmolded optical fiber assembly comprising:
(a) flowing a self-leveling fluoropolymer in a bottom mold, said bottom mold defining a bottom overmold cavity having a bottom surface, wherein flowing said self-leveling fluoropolymer in said bottom mold does not involve injection molding;
(b) placing at least one flexible optical circuit in said bottom mold, said at least one flexible optical circuit having a substrate and a plurality of fibers adhered to said substrate, said substrate being suspended over said bottom surface to define a first space between said substrate and said bottom surface;
(c) placing a top mold over said substrate, said top mold defining a top overmold cavity and a top surface and a port defined in said top surface to access said top overmold cavity, said substrate defining a second space between said top surface and said substrate;
(d) flowing a self-leveling fluoropolymer through said port to fill at least a portion of said second space, wherein flowing said self-leveling fluoropolymer through said port does not involve injection molding; and
(e) removing said bottom and top molds to release said overmolded optical circuit, wherein said overmolded optical circuit is flexible.
2. The method of claim 1 , wherein at least said bottom mold defines fiber cavities contiguous with said bottom overmold cavity.
3. The method of claim 1 , wherein said bottom mold comprises standoffs protruding from said bottom surface to maintain said first space between said substrate and said bottom surface.
4. The method of claim 1 , wherein said top mold comprises standoffs for maintaining said second space.
5. The method of claim 4 , wherein said standoffs are discrete from said top mold.
6. The method of claim 4 , wherein said standoffs are integrated with said top mold to define said second space.
7. The method of claim 1 , further comprising standoffs on at least one of said bottom mold or said top mold to define said first and second spaces, respectively, wherein said standoffs are discrete from said bottom and top molds, and are integral with said overmolded optical circuit after step (e).
8. The method of claim 1 , wherein said first and said second spaces have a thickness of greater than 0.05 in.
9. The method of claim 8 , wherein said first and second spaces have a thickness of at least 0.07 in.
10. The method of claim 1 , wherein said fluoropolymer has a viscosity less than 80 Pa-s.
11. The method of claim 1 , wherein said fluoropolymer is a fluorosilicone or a fluoroelastomer.
12. The method of claim 11 , wherein said fluoropolymer is at least one of CF1-3510, SIFEL 2614, SIFEL 3405 or SIFEL 3590-N.
13. The method of claim 1 , wherein step (a) is performed before step (b).
14. The method of claim 1 , wherein step (a) is performed simultaneously with step (d).
15. The method of claim 1 , wherein step (a) is performed before step (c).
16. The method of claim 1 , wherein step (a) is performed after step (b).
17. The method of claim 13 , wherein said polymer in said first space is precured before step (b).
18. An overmolded optical circuit prepared by the method of claim 1 .