IP Library Granted Patent US 11,081,130
Granted Patent B1
US 11,081,130 · App. 16/778,433 · Granted Aug 3, 2021

Suspension standoff arrangement for confining adhesive

Inventors: Pongsatorn Chawalitsittikul (Pathumthani, TH); Anucha Suvibua (Pathumthani, TH); Wanchai Sedklang (Pathumthani, TH)
Assignee: Western Digital Technologies, Inc.
G11B5/4826
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Quick Facts
Patent No.
US 11,081,130
App. No.
16/778,433
Granted
Aug 3, 2021
Kind
B1
Abstract

A head gimbal assembly for a data storage device is provided. The head gimbal assembly includes a suspension, and a slider mounting point on the suspension. The slider mounting point includes an adhesive pocket bounded by a plurality of dielectric standoffs.

Claims (41)

1. A head gimbal assembly for a data storage device, comprising:

a suspension; and

a slider mounting point on the suspension, the slider mounting point including an adhesive pocket, an adhesive spread region, and a plurality of dielectric standoffs comprising a first dielectric standoff, a second dielectric standoff, and a third dielectric standoff;

wherein:

the adhesive pocket is bounded by the first dielectric standoff and the second dielectric standoff;

the third dielectric standoff is disposed in the adhesive spread region between the first dielectric standoff and the second dielectric standoff;

the adhesive pocket includes a plurality of adhesive dots disposed on the suspension; and

the plurality of dielectric standoffs are configured to facilitate the plurality of adhesive dots merging to form a merged adhesive shape.

2. The head gimbal assembly of claim 1 , further comprising a slider coupled to the suspension.

3. The head gimbal assembly of claim 1 , wherein the plurality of dielectric standoffs are configured to limit a spread of the merged adhesive shape in the adhesive pocket.

4. The head gimbal assembly of claim 1 , wherein the first dielectric standoff has a generally V-type shape, and the second dielectric standoff that has a generally rectangular shape.

5. The head gimbal assembly of claim 1 , wherein the second dielectric standoff is distinct from the first dielectric standoff.

6. The head gimbal assembly of claim 1 , wherein one of the plurality of dielectric standoffs is disposed near an upper perimeter of the adhesive spread region.

7. The head gimbal assembly of claim 1 , wherein one of the plurality of dielectric standoffs is disposed in a central region of the adhesive spread region.

8. The head gimbal assembly of claim 1 , wherein each of the plurality of dielectric standoffs have a thickness of between about 5 μm and about 10 μm.

9. The head gimbal assembly of claim 1 , wherein each of the plurality of dielectric standoffs have a width of between about 50 μm and about 70 μm.

10. The head gimbal assembly of claim 1 , wherein each of the plurality of dielectric standoffs comprise polyimide.

11. A data recording device comprising:

a disk comprising a data surface of concentric data tracks;

a rotator for rotating the disk about an axis generally perpendicular to the disk;

a slider maintained in operative relationship with the data surface when the disk is rotating;

a suspension coupled to the slider with a plurality of adhesive dots disposed in an adhesive pocket on the suspension, the suspension comprising an adhesive spread region;

a plurality of dielectric standoffs comprising a first dielectric standoff, a second dielectric standoff, and a third dielectric standoff disposed on the suspension, the first dielectric standoff and the second dielectric standoff bounding the adhesive pocket, the third dielectric standoff disposed in the adhesive spread region between the first dielectric standoff and the second dielectric standoff, wherein the plurality of dielectric standoffs are configured to facilitate the plurality of adhesive dots merging to form a merged adhesive shape, and are configured to confine a spread of the adhesive shape;

a transducer attached to the slider for reading data from and writing data to the data surface;

an actuator for moving the slider generally radially to the disk to allow the transducer to access the data tracks; and

an electronics module for processing data read from and written to the data surface.

12. The data recording device of claim 11 , wherein the first dielectric standoff that has a generally V-type shape, and the second dielectric standoff has a generally rectangular shape.

13. The data recording device of claim 11 , wherein the second dielectric standoff is distinct from the first dielectric standoff.

14. The data recording device of claim 11 , wherein one of the plurality of dielectric standoffs is disposed near an upper perimeter of the adhesive spread region.

15. The data recording device of claim 11 , wherein one of the plurality of dielectric standoffs is disposed in a central region of the adhesive spread region.

16. The data recording device of claim 11 , wherein each of the plurality of dielectric standoffs have a thickness of between about 5 μm and about 10 μm.

17. The data recording device of claim 11 , wherein each of the plurality of dielectric standoffs comprise polyimide.

18. A head gimbal assembly for a data storage device, comprising:

a suspension;

a plurality of adhesive dots on the suspension;

a permissible adhesive spread region on the suspension, the permissible adhesive spread region defining outer limits in which the adhesive dots may spread without causing damage to the head gimbal assembly;

a first dielectric standoff disposed on the suspension, the first dielectric standoff comprising a shape that conforms to a shape of permissible adhesive spread region;

a second dielectric standoff disposed on the suspension, the second dielectric standoff disposed near an upper perimeter of the permissible adhesive spread region; and

a third dielectric standoff disposed on the suspension, the third dielectric standoff disposed between the first dielectric standoff and the second dielectric standoff in a central region of the permissible adhesive spread region,

wherein the first and second dielectric standoffs are configured to facilitate the plurality of adhesive dots merging to form a merged adhesive shape.

19. The head gimbal assembly of claim 18 , wherein the first dielectric standoff and the second dielectric standoff each comprise polyimide.

Assignments (5)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 058426 FRAME 0815 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0679 →
SECURITY INTEREST Recorded Dec 9, 2021
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 058426/0815 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2020
From: CHAWALITSITTIKUL, PONGSATORN; SUVIBUA, ANUCHA; SEDKLANG, WANCHAI
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 051686/0703 →