Method of manufacturing semiconductor device
The present disclosure provides a method of manufacturing a semiconductor device. The method includes steps of creating at least one trench in a substrate; forming a dielectric film on the substrate in the trench; depositing a first conductive layer on the dielectric film to partially fill the trench; depositing an insulative film on the first conductive layer; depositing a second conductive layer to bury the insulative film; and recessing the first conductive layer, until the insulative film is entirely removed. Due to the deposition of the insulative film on the first conductive layer, the etch depth of the superfluous first conductive layer can be accurately controlled.
1. A method of manufacturing a semiconductor device, comprising:
creating at least one trench in a substrate;
forming a dielectric film on the substrate in the at least one trench;
depositing a first conductive layer on the dielectric film to partially fill the at least one trench;
depositing an insulative film on the first conductive layer, wherein the insulative film, in the at least one trench, is surrounded by the first conductive layer;
depositing a second conductive layer on the insulative film, wherein the second conductive layer, in the at least one trench, is surrounded by the insulative layer; and
recessing the first conductive layer, until the insulative film is entirely removed, to form at least one word line.
2. The method of claim 1 , wherein a top surface of the word line is lower than an upper surface of the substrate.
3. The method of claim 1 , further comprising introducing dopants into the substrate to form a plurality of impurity regions separated by the at least one trench.
4. The method of claim 1 , further comprising depositing a capping layer to cover the word line.
5. The method of claim 4 , wherein the creating of the at least one trench comprises:
forming a sacrificial layer over the substrate;
creating at least one opening penetrating through the sacrificial layer; and
etching the substrate through the at least one opening to form the at least one trench.
6. The method of claim 5 , wherein the sacrificial layer is removed after the deposition of the capping layer.
7. The method of claim 5 , further comprising:
forming a buffer layer on the substrate before the forming of the sacrificial layer, and
removing the buffer layer after the sacrificial layer is removed, wherein the dielectric film and the buffer layer comprise the same material.
8. The method of claim 1 , wherein the second conductive layer is entirely removed concurrent with the recessing of the first conductive layer.
9. The method of claim 1 , further comprising:
depositing a diffusion barrier layer on the dielectric film before the deposition of the first conductive layer; and
recessing the diffusion barrier layer below a top surface of the word line after the recessing of the first conductive layer.
10. The method of claim 1 , wherein the second conductive layer completely fills the at least one trench.
11. The method of claim 1 , wherein the dielectric film is exposed through the substrate and the capping layer after the word line is formed.
12. The method of claim 1 , wherein the first conductive layer and the second conductive layer comprise the same material.