Submount for semiconductor laser device on heat assisted recording device
A submount includes a substrate, the substrate including: a first surface; a second surface that is perpendicular to the first surface; a third surface that is perpendicular to the first surface and the second surface; a fourth surface that is perpendicular to the first surface and the second surface, and is opposed to the third surface; a fifth surface that is perpendicular to the second surface and the third surface, and is opposed to the first surface; a sixth surface that is opposed to the second surface; a first notch part that is provided in a portion at which the second surface and the third surface are adjacent to each other; and a second notch part that is provided in a portion at which the second surface and the fourth surface are adjacent to each other, the first notch part and the second notch part each having a recessed surface.
1. A submount comprising a substrate including a first surface on which an element is mounted, wherein
the substrate includes:
a second surface that is disposed in a first direction in an in-plane direction of the first surface and substantially perpendicular to the first surface;
a third surface that is substantially perpendicular to the first surface and the second surface;
a fourth surface that is substantially perpendicular to the first surface and the second surface and is opposed to the third surface;
a fifth surface that is substantially perpendicular to the second surface, the third surface, and the fourth surface and is opposed to the first surface;
a sixth surface that is opposed to the second surface;
a first notch part that is provided in a portion at which the second surface and the third surface are adjacent to each other; and
a second notch part that is provided in a portion at which the second surface and the fourth surface are adjacent to each other, wherein
the first notch part and the second notch part have a recessed surface that includes a curved surface, and
the radius of the curved surface is 5 μm or more in a cross section of the curved surface parallel to the first surface.
2. The submount according to claim 1 , wherein
the first notch part has a seventh surface that is substantially parallel to the second surface in proximity to the third surface.
3. The submount according to claim 1 , wherein
a shape of a cross section of the curved surface parallel to the first surface is an arc shape having a radius of 5 μm or more in the first notch part.
4. The submount according to claim 1 , wherein
in the first surface, a side on a third surface side is spaced apart by 10 μm or more, and a side on a second surface side is spaced apart by 20 μm or more from an intersection of an extension line of the third surface and an extension line of the second surface when seen in a plan view from a first surface side.
5. The submount according to claim 1 , wherein
the third surface comprises a peripheral surface and an inner surface inside the peripheral surface wherein the peripheral surface is adjacent to the first notch part, the fifth surface, and the sixth surface, and a surface roughness of the peripheral surface is smaller than a surface roughness of the inner surface.
6. The submount according to claim 1 , wherein
the fifth surface has a surface roughness Ra of 0.2 μm or less, and a material included in the substrate is exposed.
7. The submount according to claim 1 , wherein
the second surface is inclined with respect to a normal direction of the fifth surface, and
an angle between the first surface and the second surface is an acute angle.
8. The submount according to claim 7 , comprising:
a second metal film that is disposed on the second surface, wherein
a film thickness of the second metal film increases from the first surface toward the fifth surface.
9. A semiconductor laser device, comprising:
the submount according to claim 1 ; and
a semiconductor laser chip bonded onto the first surface of the submount via a solder film, wherein
an emission surface of the semiconductor laser chip is disposed on a second surface side.
10. The semiconductor laser device according to claim 9 , wherein
the semiconductor laser chip is disposed across at least one of the first notch part or the second notch part when seen in a plan view from a first surface side.
11. A semiconductor laser device, comprising:
the submount according to claim 7 , the submount including a solder film that is disposed on the first surface and a second metal film that is disposed on the second surface; and
a semiconductor laser chip bonded to the first surface of the submount via the solder film, wherein
an emission surface of the semiconductor laser chip is disposed on a second surface side, and
the surface of the second metal film and the emission surface are substantially parallel.
12. The semiconductor laser device according to claim 11 , wherein
a thickness of the solder film changes along the first direction.
13. The semiconductor laser device according to claim 12 , wherein
the thickness of the solder film on the second surface side is smaller than a thickness of the solder film on the sixth surface side.
14. A heat assisted hard disk device, comprising:
the semiconductor laser device according to claim 9 ; and
a slider on which the semiconductor laser device is mounted.
15. The submount according to claim 1 , further comprising:
a solder film that is disposed on the first surface, wherein
the solder film has a plurality of strip-shaped portions disposed in parallel.
16. The submount according to claim 15 , wherein
the plurality of strip-shaped portions are separated from each other.
17. The submount according to claim 15 , wherein
the plurality of strip-shaped portions extend in a direction parallel to the first direction.
18. A submount comprising a substrate including a first surface on which an element is mounted, wherein the substrate includes:
a second surface that is disposed in a first direction in an in-plane direction of the first surface and substantially perpendicular to the first surface;
a third surface that is substantially perpendicular to the first surface and the second surface;
a fourth surface that is substantially perpendicular to the first surface and the second surface and is opposed to the third surface;
a fifth surface that is substantially perpendicular to the second surface, the third surface, and the fourth surface and is opposed to the first surface;
a sixth surface that is opposed to the second surface;
a first notch part that is provided in a portion at which the second surface and the third surface are adjacent to each other; and
a second notch part that is provided in a portion at which the second surface and the fourth surface are adjacent to each other, and
wherein the first notch part and the second notch part have a recessed surface that includes a curved surface, and
in the first surface, a side on a third surface side is spaced apart by 10 μm or more, and a side on a second surface side is spaced apart by 20 μm or more from an intersection of an extension line of the third surface and an extension line of the second surface when seen in a plan view from a first surface side.
19. A semiconductor laser device comprising:
a submount including:
a substrate including:
a first surface on which an element is mounted;
a second surface that is disposed in a first direction in an in-plane direction of the first surface and substantially perpendicular to the first surface;
a third surface that is substantially perpendicular to the first surface and the second surface;
a fourth surface that is substantially perpendicular to the first surface and the second surface and is opposed to the third surface;
a fifth surface that is substantially perpendicular to the second surface, the third surface, and the fourth surface and is opposed to the first surface;
a sixth surface that is opposed to the second surface;
a first notch part that is provided in a portion at which the second surface and the third surface are adjacent to each other;
a second notch part that is provided in a portion at which the second surface and the fourth surface are adjacent to each other; and
a solder film that is disposed on the first surface and a second metal film that is disposed on the second surface, and
a semiconductor laser chip bonded to the first surface of the submount via the solder film,
wherein the first notch part and the second notch part have a recessed surface that includes a curved surface,
the second surface is inclined with respect to a normal direction of the fifth surface,
an angle between the first surface and the second surface is an acute angle,
an emission surface of the semiconductor laser chip is disposed on a second surface side, and
the surface of the second metal film and the emission surface are substantially parallel.
20. The semiconductor laser device according to claim 19 , wherein
the solder film has a plurality of strip-shaped portions disposed in parallel.