System and method for vapor chamber directional heat dissipation for a piezoelectric keyboard assembly

1. An integrated heat dissipation system for a haptic piezoelectric keyboard of an information handling system comprising:

a base chassis formed of a C-cover affixed to a D-cover to house the haptic piezoelectric keyboard assembly, a processor, and a heat dissipating layer;

the heat dissipating layer thermally coupled to a haptic piezoelectric keyboard assembly and the processor to direct heat away from the keys of the piezoelectric keyboard of the C-cover and toward a vertical edge of the base chassis;

the piezoelectric keyboard assembly comprising:

a plurality of piezoelectric sensors disposed across a support plate;

a contact foil layer, for detecting deformation of one of the plurality of piezoelectric sensors and registering a keystroke, affixed to the plurality of piezoelectric sensors and the support plate and provide a haptic feedback control signal to generate a haptic response to the keys of the piezoelectric keyboard;

wherein the contact foil layer is affixed to a bottom surface of the C-cover.

2. The integrated heat dissipation system of claim 1 , wherein the thermally coupled heat dissipating layer of the haptic piezoelectric keyboard assembly is a vapor chamber serving as the support plate.

3. The integrated heat dissipation system of claim 2 , wherein the piezoelectric keyboard assembly further comprises:

a spacer plate with a plurality of cavity holes operatively coupled between vapor chamber and the piezoelectric elements to allow deformation of the piezoelectric elements into the cavity holes.

4. The integrated heat dissipation system of claim 2 , wherein the piezoelectric keyboard assembly further comprises:

a plurality of cavity holes debossed in a top surface of the vapor chamber and disposed under the piezoelectric elements to allow deformation of the piezoelectric elements into the cavity holes.

5. The integrated heat dissipation system of claim 1 , wherein the thermally coupled heat dissipating layer of the haptic piezoelectric keyboard assembly is a hydrophobic material layer injected between a coversheet of the haptic piezoelectric keyboard assembly and the C-cover.

6. The integrated heat dissipation system of claim 1 , wherein thermally coupled heat dissipating layer of the haptic piezoelectric keyboard assembly is a heat dissipating adhesive material layer to affix the contact foil layer to the plurality of piezoelectric sensors and the support plate.

7. The integrated heat dissipation system of claim 6 , wherein the heat dissipating adhesive material layer is a heat dissipating epoxy.

8. The integrated heat dissipation system of claim 1 , wherein the thermally coupled heat dissipating layer of the haptic piezoelectric keyboard assembly is a layer of phase-change material disposed between the contact foil layer and a coversheet of the piezoelectric keyboard assembly.

9. A method of assembling a heat dissipation system integrated with a haptic piezoelectric keyboard for an information handling system comprising:

disposing each of a plurality of piezoelectric sensors across one of a plurality of cavities formed between the piezoelectric sensors and a vapor chamber;

affixing a contact foil layer operably coupled to the plurality of piezoelectric sensors to fix the position of each of the plurality of piezoelectric sensors with respect to the contact foil layer and edges of the cavities supporting the piezoelectric sensors;

operably connecting a keyboard controller to each of the plurality of piezoelectric sensors via tracers on a surface of the contact foil layer to receive actuation signals and deliver return haptic feedback control signals to generate haptic events at keys of the haptic piezoelectric keyboard;

affixing the contact foil layer to a bottom surface of a coversheet of an assembly of the haptic piezoelectric keyboard;

affixing the vapor chamber to a base chassis formed of a C-cover and a D-cover to dissipate heat horizontally away from the coversheet and keys of the haptic piezoelectric keyboard; and

operably connecting the controller to a processor.

10. The method of claim 9 further comprising:

operatively coupling a spacer plate atop the vapor chamber and below the piezoelectric elements, with holes in the spacer plate to form the plurality of cavities formed between the piezoelectric sensors and a vapor chamber.

11. The method of claim 9 further comprising:

debossing the plurality of cavities into a top surface of the vapor chamber.

12. The method of claim 9 further comprising:

disposing a hydrophobic material between the coversheet of the assembly of the haptic piezoelectric keyboard and the C-cover top surface having a lattice through which key pedestals of the keys are disposed.

13. The method of claim 12 , wherein the hydrophobic material is a perfluoroalkyl.

14. The method of claim 9 further comprising:

affixing the contact foil layer to a bottom surface of a layer of phase change material; and

affixing the top surface of the layer of phase change material to a coversheet of the assembly of the haptic piezoelectric keyboard so the phase change material is disposed between the contact foil layer and the coversheet.

15. An integrated heat dissipation system for a haptic piezoelectric keyboard of an information handling system comprising:

a base chassis formed of a C-cover affixed to a D-cover to house the haptic piezoelectric keyboard assembly, a processor, and a vapor chamber support layer;

the vapor chamber support layer thermally coupled to a haptic piezoelectric keyboard assembly and the processor to direct heat away from keys of the piezoelectric keyboard of the C-cover and toward a vertical edge of the base chassis;

the piezoelectric keyboard assembly comprising:

a plurality of piezoelectric sensors disposed across the vapor chamber support layer;

a contact foil layer, for detecting deformation of one of the plurality of piezoelectric sensors and registering a keystroke, affixed to the plurality of piezoelectric sensors and the vapor chamber support layer and to provide a haptic feedback control signal to generate a haptic response to the keys of the piezoelectric keyboard;

wherein the contact foil layer is affixed to a bottom surface of the C-cover.

16. The integrated heat dissipation system of claim 15 , wherein the piezoelectric keyboard assembly further comprises:

a spacer plate with a plurality of cavity holes operatively coupled between vapor chamber support layer and the piezoelectric elements to allow deformation of the piezoelectric elements into the cavity holes.

17. The integrated heat dissipation system of claim 15 , wherein the piezoelectric keyboard assembly further comprises:

a plurality of cavity holes debossed into a top surface of the vapor chamber support layer and having edges supporting the piezoelectric elements to allow deformation of the piezoelectric elements into the cavity holes.

18. The integrated heat dissipation system of claim 15 , wherein the piezoelectric keyboard assembly further comprises:

a hydrophobic material layer disposed between a coversheet of the haptic piezoelectric keyboard assembly and a top surface of the C-cover having a lattice through which key pedestals of the keys are disposed.

19. The integrated heat dissipation system of claim 15 , wherein the piezoelectric keyboard assembly further comprises:

a layer of phase-change material disposed between the contact foil layer and a coversheet of the piezoelectric keyboard assembly.

20. The integrated heat dissipation system of claim 15 , wherein the piezoelectric keyboard assembly further comprises:

a heat dissipating fin structure thermally coupled to the vapor chamber support layer near an edge of the base chassis; and

a fan to exhaust heat from the heat dissipating fan structure from the base chassis.