IP Library Granted Patent US 11,350,054
Granted Patent B2
US 11,350,054 · App. 16/783,492 · Granted May 31, 2022

Dual gain imaging digital pixel memory

Inventor: Allen W. Hairston (Andover, MA)
Assignee: BAE Systems Information and Electronic Systems Integration Inc.
H04N5/378G05F3/205G11C11/417H01L27/14609
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Quick Facts
Patent No.
US 11,350,054
App. No.
16/783,492
Granted
May 31, 2022
Kind
B2
Abstract

Techniques and architectures for simultaneous readout and integration of image data from pixels while increasing their sensitivity and reducing required data rates for moving information off of the chip using pixels configured to conduct Analog-to-Digital Conversions (ADCs) of image data, wherein each pixel operates in a rolling Integrate While Read (IWR) mode using SRAM in place of traditional latches for in-pixel storage.

Claims (43)

1. An imaging apparatus comprising:

a focal plane array, said focal plan array comprising:

a plurality of pixels, wherein said pixels are arranged into groups of equal numbers of one or more pixels, each pixel comprising:

a photodetector configured to receive electromagnetic energy; and

a readout integrated circuit comprising an analog portion and a digital portion, the digital portion comprising at least one latch comprising random access memory,

wherein the readout integrated circuit comprises at least two direct injection integration bias transistors; and

wherein the readout integrated circuit is configured to perform analog to digital conversion.

2. The imaging apparatus of claim 1 wherein the random access memory is static random access memory.

3. The imaging apparatus of claim 1 wherein the random access memory comprises at least one foundry-generated memory cell, static random access memory, or dynamic random access memory, and wherein the memory cell is configured for dedicated access.

4. The imaging apparatus of claim 2 wherein said static random access memory is configured to act as a digital sample and hold.

5. The imaging apparatus of claim 1 wherein the readout integrated circuit of each group of pixels further comprises:

a binning selection switch connected between a first output of the photodetector and the digital portion of the readout integrated circuit;

a readout integration capacitor configured to convert charge produced by the photodetector to a voltage, wherein the readout integration capacitor is in electrical communication with a VRSI reference or ramp;

a comparator with two inputs, a threshold voltage input and a second input in electrical communication with the readout integration capacitor;

an enable count latch in electrical communication with an output of the comparator and in further electrical communication with a clock that itself is in switched electrical communication with a counter or latch via a readout connection, the enable count latch also being in switched electrical communication with the counter or latch;

a latch module connected to the counter or latch;

a select latch write in operative communication with the latch module;

a select latch read in operative communication with the latch module;

a counter reset in operative communication with the counter or latch;

at least two direct injection integration bias transistors disposed between the comparator and the photodetector;

a stop integration switch configured for residue conversion and disposed between the comparator and the photodetector;

an event detect connected to the comparator output;

and a reset clock or event bias disposed between the comparator output and the second input of the comparator.

6. The imaging apparatus of claim 1 wherein said readout integrated circuit is configured to perform in-pixel single slope analog to digital conversion.

7. The imaging apparatus of claim 1 wherein said readout integrated circuit is configured to perform in-pixel two-stage analog to digital conversion.

8. The imaging apparatus of claim 1 wherein said photodetector is a two-color photodetector.

9. The imaging apparatus of claim 8 wherein the readout integrated circuit further comprises a select detector configured to allow parallel, two-color conversion.

10. The imaging apparatus of claim 1 wherein the at least two direct injection integration bias transistors are one NFET and one PFET.

11. The imaging apparatus of claim 1 wherein the latch is configured to allow one counter to be shared among a group of pixels.

12. The imaging apparatus of claim 11 wherein the latch is configured to store coarse count data corresponding to a previously-captured subframe from at least one photodetector while a different photodetector is using the counter to count a subframe in the process of being captured and then, for each photodetector, to load a counter value stored in the latch for that detector and the count data for the next detector from previous subframes to continue the integration for that detector in the next subframe.

13. The imaging apparatus of claim 1 wherein the latch comprises a plurality of latches, each latch having the same number of bits as the counter shared among the group of pixels.

14. The imaging apparatus of claim 13 wherein the number of latches is equal to the number of pixels in the group of pixels.

15. An imaging apparatus comprising:

a plurality of groups of pixels, each group comprising at least one pixel;

wherein each pixel comprises a photodetector,

wherein each pixel in a group of pixels shares a plurality of components with other pixels in said group of pixels,

wherein each of said groups of pixels is configured to perform in-pixel analog to digital conversion of electromagnetic energy collected by said photodetectors within that group of pixels using circuitry common to said group of pixels;

wherein the circuitry common to said group of pixels comprises at least two direct injection integration bias transistors; and

wherein each of said groups of pixels comprises random access memory.

16. The imaging apparatus of claim 15 wherein said static random access memory is configured to act as a digital sample and hold.

17. The imaging apparatus of claim 16 wherein said circuitry common to said group of pixels comprises a readout integrated circuit.

18. The imaging apparatus of claim 17 wherein said readout integrated circuit comprises at least one latch, the latch being in operative communication with at least one select latch write and at least one select latch read, and wherein said latch module comprises static random access memory and is in operative communication with a counter.

19. The imaging apparatus of claim 18 wherein said readout integrated circuit is configured to perform in-pixel single slope ADC.

Assignments (2)
CONFIRMATORY LICENSE Recorded Jul 9, 2021
From: BAE SYSTEMS
To: THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
Reel/Frame 056817/0505 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2020
From: HAIRSTON, ALLEN W.
To: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
Reel/Frame 051790/0794 →
Continuity (2)
Continuation In Part 15985237 · May 21, 2018
Related Publication 20200177833A1 · Jun 4, 2020