Polyimide precursor solution and polyimide film
A polyimide precursor solution contains resin particles and a polyimide precursor. The resin particles in the polyimide precursor solution have a volume particle size distribution with one or more peaks. The volume frequency of a peak having the highest volume frequency of the one or more peaks accounts for 90% to 100% of the total volume frequency of all peaks of the volume particle size distribution.
1. A polyimide precursor solution comprising:
resin particles;
a polyimide precursor; and
an aqueous solvent comprising water,
wherein the resin particles in the polyimide precursor solution have a volume particle size distribution with one or more peaks, and the volume frequency of a peak having the highest volume frequency of the one or more peaks accounts for 90% to 100% of the total volume frequency of all peaks of the volume particle size distribution,
wherein the resin particles are formed of a resin selected from the group consisting of polyester resins, urethane resins, vinyl resins, olefin resins, and fluorocarbon resins, (meth)acrylic resins, (meth)acrylate resins, styrene-(meth)acrylic resins, and polystyrene resins, and
wherein the resin particles have an average particle size of 0.25 to 0.5 μm.
2. The polyimide precursor solution according to claim 1 , wherein the resin particles in the polyimide precursor solution have a volume particle size distribution index of 1.30 or less.
3. A polyimide film obtained by applying the polyimide precursor solution according to claim 1 to form a coating and heating the coating.
4. The polyimide precursor solution according to claim 1 , wherein the resin particles are formed of a resin selected from the group consisting of polyester resins, urethane resins, vinyl resins, olefin resins, and fluorocarbon resins.
5. The polyimide precursor solution according to claim 1 , wherein the resin is selected from the group consisting of (meth)acrylic resins, (meth)acrylate resins, styrene-(meth)acrylic resins, and polystyrene resins.
6. The polyimide precursor solution according to claim 1 , wherein the polyimide precursor has not been imidized.
7. The polyimide precursor solution according to claim 1 , wherein the aqueous solvent comprises water in an amount of 50% by mass or more based on the total mass of the aqueous solvent.
8. The polyimide precursor solution according to claim 7 , wherein the aqueous solvent further comprises an aprotic solvent in an amount of 40% by mass or less based on the total mass of the aqueous solvent.
9. The polyimide precursor solution according to claim 1 , wherein the aqueous solvent comprises water in an amount of 70% by mass or more based on the total mass of the aqueous solvent.
10. The polyimide precursor solution according to claim 1 , wherein the aqueous solvent comprises water in an amount of 80% by mass or more based on the total mass of the aqueous solvent.
11. The polyimide precursor solution according to claim 1 , wherein the aqueous solvent further comprises an aprotic solvent in an amount of 40% by mass or less based on the total mass of the aqueous solvent.
12. The polyimide precursor solution according to claim 1 , wherein the aqueous solvent further comprises an aprotic solvent in an amount of 5% by mass to 200% by based on a total mass of the polyimide precursor in the polyimide solution.
13. The polyimide precursor solution according to claim 1 , wherein the resin particles do not dissolve in the aqueous solvent.
14. The polyimide precursor solution according to claim 1 , wherein the polyimide precursor is obtained by polymerization of a tetracarboxylic dianhydride and a diamine compound.
15. The polyimide precursor solution according to claim 1 , wherein the polyimide precursor is a polyamic acid.
16. The polyimide precursor solution according to claim 15 , wherein the wherein the polyamic acid represented by formula (I) is obtained by polymerization of a tetracarboxylic dianhydride and a diamine compound; the tetravalent organic group for A is the residue of the tetracarboxylic dianhydride used as a starting material, excluding the four carboxy groups; and the divalent organic group for B is the residue of the diamine compound used as a starting material, excluding the two amino groups.
17. The polyimide precursor solution according to claim 1 , wherein the polyimide precursor is a polyamic acid having a repeating unit represented by formula (I):
where A is a tetravalent organic group, and B is a divalent organic group.
18. The polyimide precursor solution according to claim 1 , wherein the polyimide precursor is present in an amount of 0.5% to 25% by mass based on a total mass of the polyimide precursor solution.