IP Library Granted Patent US 11,579,182
Granted Patent B1
US 11,579,182 · App. 16/788,213 · Granted Feb 14, 2023

Probe card for efficient screening of highly-scaled monolithic semiconductor devices

Inventors: Daniel Brodoceanu (Cork, IE); Christopher Percival (Cork, IE); Zheng Sung Chio (Cork, IE); Chao Kai Tung (Cork, IE)
Assignee: Meta Platforms Technologies, LLC
G01R31/27G01R1/07342G01R31/2601G01R31/2635H01L22/20H01L33/36G02B6/0016G02B6/0036H01L33/46H01L33/58H01L2933/0033
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Quick Facts
Patent No.
US 11,579,182
App. No.
16/788,213
Granted
Feb 14, 2023
Kind
B1
Abstract

Enhanced probe cards, for testing unpackaged semiconductor die including numerous discrete devices (e.g., LEDs), are described. The die includes anodes and cathodes for the LEDs. Via a single touchdown event, the probe card may simultaneously operate each of the LEDs. The LEDs' optical output is measured and the performance of the die is characterized. The probe card includes a conductive first contact and another contact that are fabricated from a conformal sheet or film. Upon the touchdown event, the first contact makes contact with each of the die's anodes and the other contact makes contact with each of the die's cathodes. The vertical and sheet resistance of the contacts are sufficient such that the voltage drop across the vertical dimension of the contacts is approximately an order of magnitude greater than the operating voltage of the LEDs and current-sharing between adjacent LEDs is limited by the sheet resistance.

Claims (23)

1. A non-transitory computer-readable storage medium having instructions stored thereon that when executed by a processor of a computing device, the computing device perform actions comprising:

positioning an electrically-conductive first contact comprising a film that is at least one of conformal and elastic and characterized by a horizontal electrical resistance and a vertical electrical resistance such that the first contact is in parallel-contact with each of a plurality of anodes on a semiconductor die having a plurality of semiconductor devices, wherein each of the plurality of semiconductor devices includes an anode of the plurality of anodes and a corresponding cathode of a plurality of cathodes on the semiconductor die;

positioning one or more electrically-conductive other contacts such that the one or more other contacts is in parallel-contact with each of the plurality of cathodes;

applying a parallel voltage across the first contact and the one or more other contacts; and

observing a plurality of signals, wherein each of the plurality of signals is generated by a corresponding semiconductor device of the plurality of semiconductor devices and is in response to the applied parallel voltage.

2. The computer-readable storage medium of claim 1 , wherein the first contact is comprised of an electrically-conductive polymer film with a thickness that is less than seven microns.

3. The computer-readable storage medium of claim 1 , wherein the parallel voltage applied across the first contact and the one or more other contacts is between 17 and 30 volts and an operating voltage of each of the plurality of semiconductor devices is between 2.3 and 3.5 volts.

4. The computer-readable storage medium of claim 1 , wherein a pitch between adjacent anodes of the plurality of anodes is between a half a micron and four microns.

5. The computer-readable storage medium of claim 1 , wherein each of the plurality of signals includes an optical output from the corresponding semiconductor device and the actions further comprise:

capturing an image of the optical output of each of the plurality of semiconductor devices; and

employing the image of the optical output of each of the plurality of semiconductor devices to determine a relative external quantum efficiency of each of the plurality of semiconductor devices.

6. A system comprising:

an electrically-conductive first contact;

one or more electrically-conductive other contacts;

a processor device; and

a computer-readable storage medium, coupled with the processor device, having instructions stored thereon, which, when executed by the processor device, perform actions comprising:

positioning the electrically-conductive first contact comprising a film that is at least one of conformal and elastic and characterized by a horizontal electrical resistance and a vertical electrical resistance such that the first contact is in parallel-contact with each of a plurality of anodes on a semiconductor die having a plurality of semiconductor devices, wherein each of the plurality of semiconductor devices includes an anode of the plurality of anodes and a corresponding cathode of a plurality of cathodes on the semiconductor die;

positioning the one or more electrically-conductive other contacts such that the one or more other contacts is in parallel-contact with each of the plurality of cathodes;

applying a parallel voltage across the first contact and the one or more other contacts; and

observing a plurality of signals, wherein each of the plurality of signals is generated by a corresponding semiconductor device of the plurality of semiconductor devices and is in response to the applied parallel voltage.

7. The system of claim 6 , wherein an electrical resistance of the first contact is substantially isotropic.

8. The system of claim 6 , further comprising:

a continuous electrode, wherein the first contact covers at least a portion of a surface of the continuous electrode and when the first contact is in parallel-contact with each of the plurality of anodes, the continuous electrode is common to each of the plurality of anodes.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE TYPOGRAPHICAL ERROR IN THE RECEIVING PARTY NAME, IT SHOULD READ AS "META PLATFORMS TECHNOLOGIES, LLC" PREVIOUSLY RECORDED AT REEL: 060440 FRAME: 0994. ASSIGNOR(S) HEREBY CONFIRMS THE NAME CHANGE. Recorded Nov 4, 2022
From: FACEBOOK TECHNOLOGIES, LLC
To: META PLATFORMS TECHNOLOGIES, LLC
Reel/Frame 061881/0595 →
CHANGE OF NAME Recorded Jun 24, 2022
From: FACEBOOK TECHNOLOGIES, LLC
To: META PLATFORMS TECHNONLOGIES, LLC
Reel/Frame 060440/0994 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2020
From: BRODOCEANU, DANIEL; PERCIVAL, CHRISTOPHER; CHIO, ZHENG SUNG; TUNG, CHAO KAI
To: FACEBOOK TECHNOLOGIES, LLC
Reel/Frame 052836/0726 →