Elastomeric Conductive Composite Interconnect
An elastomeric conductive composite for use in a moldable interconnect is provided, said composite having a polymeric matrix containing a crosslinked polymer, a curing agent for catalyzing crosslinking of the polymeric matrix, conductive metal particles and nonconductive compressible rubber particles dispersed within the polymeric matrix. The nonconductive compressible rubber particles have a greater compressibility than an elastomeric conductive composite that is the same as the elastomeric conductive composite but is free of non-conductive compressible rubber particles. A moldable interconnect containing the elastomeric conductive composite is also provided. This interconnect can be used to provide electrical connection between two or more opposing contacts or arrays of contacts for establishing at least one electrical circuit.
1 . An elastomeric conductive composite for use in a moldable interconnect, said composite comprising:
a polymeric matrix comprising a crosslinked polymer, said polymer comprising an elastomer
a curing agent for catalyzing crosslinking of the polymeric matrix, and
conductive metal particles and non-conductive compressible rubber particles dispersed within the polymeric matrix, the non-conductive compressible rubber particles having a greater compressibility than an elastomeric conductive composite that is the same as the elastomeric conductive composite but is free of non-conductive compressible rubber particles.
2 . The elastomeric conductive composite of claim 1 , wherein the polymeric matrix comprises silicone.
3 . The elastomeric conductive composite of claim 1 wherein the polymeric matrix has a Shore A hardness of more than 20.
4 . The elastomeric conductive composite of claim 1 wherein the conductive metal particles are selected from the group consisting of silver, silver coated particles, gold, and gold coated particles.
5 . The elastomeric conductive composite of claim 1 wherein the conductive metal particles have an average size of less than 50 μm.
6 . The elastomeric conductive composite of claim 1 wherein the concentration of the conductive metal particles is 15 vol % to 40 vol % with respect to the polymer matrix.
7 . The elastomeric conductive composite of claim 1 wherein the non-conductive compressible rubber particles comprise silicone microspheres.
8 . The elastomeric conductive composite of claim 1 wherein the non-conductive compressible rubber particles have an average size of 0.1 to 1000 μm.
9 . The elastomeric conductive composite of claim 1 wherein the concentration of the non-conductive compressible rubber particles in the elastomeric conductive composite is of 1 vol % to 20 vol %.
10 . The elastomeric conductive composite of claim 1 wherein the concentration of the non-conductive compressible rubber particles in the elastomeric conductive composite is of 20 vol % to 60 vol %.
11 . A moldable interconnect comprising an elastomeric conductive composite for use in a moldable interconnect, said composite comprising:
a polymeric matrix comprising a crosslinked polymer, said polymer comprising an elastomer
a curing agent for catalyzing crosslinking of the polymeric matrix, and
conductive metal particles and non-conductive compressible rubber particles dispersed within the polymeric matrix, the non-conductive compressible rubber particles having a greater compressibility than an elastomeric conductive composite that is the same as the elastomeric conductive composite but is free of non-conductive compressible rubber particles.
12 . The moldable interconnect of claim 11 , wherein the elastomeric conductive composite is in the form of an array of elements held in an insulating substrate.
13 . The moldable interconnect of claim 12 , wherein the elements are pillars having opposite first and second ends, the pillars being conductive between the first and second ends.
14 . The moldable interconnect of claim 13 , wherein the resistance through each pillar is less than 1 Ohm
15 . The moldable interconnect of claim 14 , wherein the insulating substrate has opposite first and second outer surfaces, the first and second outer surfaces being planar and parallel to each other.
16 . The moldable interconnect of claim 11 , wherein when the elements are made of elastomeric conductive composite comprising at least 20 vol % of non-conductive compressible rubber particles, the compressibility of the elements is increased by at least 10% at a given applied force compared to the compressibility of the elements made of an elastomeric conductive composite similar to that of claim 1 that is free of non-conductive compressible rubber particles.
17 . Use of a moldable interconnect comprising an elastomeric conductive composite, said composite comprising:
a polymeric matrix comprising a crosslinked polymer, said polymer comprising an elastomer
a curing agent for catalyzing crosslinking of the polymeric matrix, and
conductive metal particles and non-conductive compressible rubber particles dispersed within the polymeric matrix, the non-conductive compressible rubber particles having a greater compressibility than an elastomeric conductive composite that is the same as the elastomeric conductive composite but is free of non-conductive compressible rubber particles for an electrical interconnect device used to provide electrical connection between two or more opposing arrays of contacts for establishing at least one electrical circuit.