Multilayer ceramic capacitor including conductive vias
The present invention is directed to a multilayer ceramic capacitor. The capacitor comprises a top surface, a bottom surface, and at least one side surface connecting the top surface and the bottom surface. The capacitor comprises a main body containing a plurality of alternating dielectric layers and internal electrode layers comprising a first plurality of internal electrode layers and a second plurality of internal electrode layers. A first through-hole conductive via electrically connects the first plurality of internal electrode layers to a first external terminal on the top surface and a first external terminal on the bottom surface of the capacitor. A second through-hole conductive via electrically connects the second plurality of internal electrode layers to a second external terminal on the top surface and a second external terminal on the bottom surface of the capacitor. The at least one side surface does not include an external terminal.
1. A multilayer ceramic capacitor comprising:
a top surface, a bottom surface, and at least one side surface connecting the top surface and the bottom surface,
a main body containing a plurality of alternating dielectric layers and internal electrode layers comprising a first plurality of internal electrode layers and a second plurality of internal electrode layers,
wherein the first plurality of internal electrode layers comprises a first active electrode and a first anchor electrode,
wherein the second plurality of internal electrode layers comprises a second active electrode,
a first through-hole conductive via electrically connecting the first active electrode of the first plurality of internal electrode layers to a first external terminal on the top surface and a first external terminal on the bottom surface of the capacitor, and
a second through-hole conductive via electrically connecting the second active electrode of the second plurality of internal electrode layers to a second external terminal on the top surface and a second external terminal on the bottom surface of the capacitor, wherein the second through-hole conductive via contacts the first anchor electrode, and
wherein the at least one side surface does not include an external terminal.
2. The multilayer ceramic capacitor according to claim 1 , wherein the second plurality of internal electrode layers further comprises a second anchor electrode.
3. The multilayer ceramic capacitor according to claim 2 , wherein the first through-hole conductive via contacts the second anchor electrode.
4. The multilayer ceramic capacitor according to claim 1 , wherein the main body further includes a shield electrode layer.
5. The multilayer ceramic capacitor according to claim 4 , wherein the main body includes a shield electrode layer above and below the internal electrode layers.
6. The multilayer ceramic capacitor according to claim 1 , wherein an electrically insulated gap is formed between the first through-hole conductive via and the second plurality of internal electrode layers.
7. The multilayer ceramic capacitor according to claim 1 , wherein an electrically insulated gap is formed between the second through-hole conductive via and the first plurality of internal electrode layers.
8. The multilayer ceramic capacitor according to claim 1 , wherein the average length of the first through-hole conductive via is 10 times or less to 0.01 times or more the average pitch between the first through-hole conductive via and an adjacent second through-hole conductive via.
9. The multilayer ceramic capacitor according to claim 1 , wherein the average pitch between a first through-hole conductive via and a second through-hole conductive via is from 0.1 mm to 2 mm.
10. The multilayer ceramic capacitor according to claim 1 , wherein the dielectric layers comprise a ceramic.
11. The multilayer ceramic capacitor according to claim 10 , wherein the ceramic comprises a titanate.
12. The multilayer ceramic capacitor according to claim 1 , wherein the internal electrode layers comprise a conductive metal.
13. The multilayer ceramic capacitor according to claim 12 , wherein the conductive metal comprises nickel or an alloy thereof.
14. The multilayer ceramic capacitor according to claim 1 , wherein the external terminals are electroplated layers.
15. The multilayer ceramic capacitor according to claim 1 , wherein the external terminals are electroless plated layers.
16. The multilayer ceramic capacitor according to claim 1 , wherein the external terminals comprise a conductive metal.
17. The multilayer ceramic capacitor according to claim 16 , wherein the conductive metal comprises silver, gold, palladium, platinum, tin, nickel, chrome, titanium, tungsten, or combinations or alloys thereof.
18. The multilayer ceramic capacitor according to claim 16 , wherein the conductive metal comprises copper or an alloy thereof.
19. A circuit board containing the multilayer ceramic capacitor of claim 1 .
20. The circuit board of claim 19 , wherein the board further comprises an integrated circuit package.
21. The circuit board of claim 20 , wherein the capacitor is positioned between the circuit board and the integrated circuit package in a vertical direction such that the circuit board, the capacitor, and the integrated circuit package are present in a stacked arrangement.
22. The circuit board of claim 20 , wherein the capacitor is directly connected to the circuit board and the integrated circuit package.
23. A communications device comprising the circuit board of claim 19 .
24. The communications device of claim 23 , wherein the device includes an Ethernet system, a wireless network router, a fiber optic communications system, or a storage device.