Low-particle gas enclosure systems and methods
A method comprises processing a substrate in a gas enclosure to form a film on one or more portions of the substrate. The method further comprises, while processing the substrate, circulating gas along a circulation path through the gas enclosure. Circulating the gas may comprise flowing gas through an exhaust housing enclosing a printhead assembly housed in the gas enclosure and filtering the gas flowing downstream of the printhead assembly from the exhaust housing.
1. A method of processing of a substrate, the method comprising:
depositing organic material from a printhead onto a substrate positioned in a gas enclosure enclosing a printing system comprising the printhead;
while depositing the organic material:
circulating gas along a circulation path in the gas enclosure;
flowing the gas along the circulation path past the printhead and through a first housing located in the gas enclosure, the first housing containing a service bundle operably coupled to the printing system, wherein the circulation path includes a first portion configured to flow the gas through a second housing containing the printhead and through the first housing containing the service bundle, and the substrate is located outside of the second housing containing the printhead and the first housing containing the service bundle; and
filtering particulate matter from the gas flowed through the housing containing the service bundle.
2. The method of claim 1 , wherein filtering the particulate matter comprises flowing the gas to a dead space.
3. The method of claim 1 , wherein circulating the gas further comprises circulating the gas through a gas purification loop external to the gas enclosure.
4. The method of claim 1 , wherein circulating the gas comprises flowing gas from proximate a substrate support positioned in the gas enclosure to housing containing the service bundle.
5. The method of claim 1 , wherein depositing the organic material comprises inkjet printing of the organic material on the substrate.
6. The method of claim 5 , wherein the organic material is an OLED material ink.
7. The method of claim 5 , wherein the organic material is a curable material used to form an encapsulation structure.
8. The method of claim 5 , further comprising curing the organic material deposited on the substrate.
9. The method of claim 1 , further comprising floating the substrate while depositing the organic material on the substrate.
10. The method of claim 1 , wherein the organic material is an OLED material ink.
11. The method of claim 1 , wherein the organic material is a curable material used to form an encapsulation structure.
12. A method of controlling an environment during processing of a substrate, the method comprising:
processing a substrate in a gas enclosure to form a film on one or more portions of the substrate;
while processing the substrate, circulating gas along a circulation path through the gas enclosure, the circulating the gas along the circulation path comprising:
flowing the gas from a region between the substrate and to an exhaust housing enclosing a printhead assembly housed in the gas enclosure, and
flowing the gas through the exhaust housing, wherein the substrate is located outside of the exhaust housing; and
filtering the gas flowing downstream of the printhead assembly from the exhaust housing.
13. The method of claim 12 , wherein circulating the gas comprises circulating the gas through a gas purification loop external to the gas enclosure.
14. The method of claim 12 , wherein processing the substrate comprises depositing ink on the substrate using the printhead assembly.
15. The method of claim 14 , wherein depositing the ink on the substrate using the printhead assembly comprises inkjet printing the ink on the substrate.
16. The method of claim 14 , wherein the ink is an OLED material ink.
17. The method of claim 14 , wherein the ink is a curable encapsulation material.
18. The method of claim 14 , further comprising curing the ink deposited on the substrate.
19. The method of claim 14 , further comprising floating the substrate while depositing ink on the substrate using the printhead assembly.
20. The method of claim 12 , wherein processing the substrate comprises depositing an organic material on the substrate.
21. The method of claim 20 , wherein the organic material is an OLED material ink.
22. The method of claim 20 , wherein the organic material is a curable material used to form an encapsulation structure.
23. The method of claim 20 , further comprising curing the organic material deposited on the substrate.