Method and system for an optical coupler for silicon photonics devices
Methods and systems for an optical coupler for photonics devices are disclosed and may include a photonics transceiver comprising a silicon photonics die and a fiber connector for receiving optical fibers and including a die coupler and an optical coupling element. The die coupler may be bonded to a top surface of the photonics die and aligned above an array of grating couplers. The optical coupling element may be attached to the die coupler and the electronics die and the source module may be bonded to the top surface of the photonics die. Modulated optical signals may be received in the photonics die from optical fibers coupled to the fiber connector.
1. A method for communication, the method comprising:
receiving modulated optical signals from one or more optical fibers coupled to a multi-piece fiber connector;
redirecting the modulated optical signals through an optical coupling element of the multi-piece fiber connector;
coupling the modulated optical signals from the optical coupling element to one or more optical paths defined through a die coupler of the multi-piece fiber connector, wherein the die coupler is bonded to a top surface of a silicon photonics die, wherein the optical coupling element is bonded to the top surface around a perimeter of the die coupler, wherein when the die coupler and the optical coupling element are bonded to the top surface of the silicon photonics die, complementary alignment features at a top surface of the die coupler and of the optical coupling element are mated together to form an interface therebetween; and
coupling the modulated optical signals in a vertical direction from the die coupler to the silicon photonics die.
2. The method according to claim 1 , wherein coupling the modulated optical signals in a vertical direction from the die coupler to the silicon photonics die comprises:
receiving the modulated optical signals via grating couplers at the top surface of the silicon photonics die.
3. The method according to claim 1 , wherein the optical coupling element comprises an array of lenses.
4. The method according to claim 1 , wherein the optical coupling element comprises one or more guide holes for receiving the one or more optical fibers.
5. The method according to claim 1 , wherein the optical coupling element comprises a prism reflector.
6. The method according to claim 1 , wherein the optical coupling element comprises one or more optical fibers that are bent at a near right angle.
7. The method according to claim 6 , wherein the one or more optical fibers of the optical coupling element comprise multi-core fibers.
8. The method according to claim 1 , wherein the die coupler comprises an array of fiber stubs arranged in the one or more optical paths.
9. The method according to claim 1 , wherein the die coupler comprises an array of lenses arranged in the one or more optical paths.
10. The method according to claim 1 , wherein the one or more optical fibers comprise multi-core fibers.
11. The method according to claim 8 , wherein the array of fiber stubs comprises substantially straight optical fiber stubs that are directly molded into a matrix material.
12. The method according to claim 1 , wherein the optical coupling element comprises substantially curved optical fiber stubs that are directly molded into a matrix material.
13. A system comprising:
a silicon photonics die defining one or more grating couplers at a top surface; and
a fiber connector comprising:
a die coupler bonded to the top surface and providing one or more optical paths through the die coupler, wherein the one or more optical paths are optically coupled with the one or more grating couplers in a vertical direction;
an optical coupling element configured to:
receive one or more optical fibers into one or more predefined positions;
redirect one or more optical axes of the one or more optical fibers when in the one or more predefined positions; and
bond to the top surface around a perimeter of the die coupler; and
complementary alignment features at a top surface of the die coupler and of the optical coupling element, wherein when the die coupler and the optical coupling element are bonded to the top surface of the silicon photonics die, the complementary alignment features are mated together to form an interface between the die coupler and the optical coupling element, and wherein the redirected one or more optical axes are optically aligned with the one or more optical paths at the interface.
14. The system according to claim 13 , wherein the silicon photonics die comprises a photonics transceiver that is operable to receive modulated optical signals via the one or more grating couplers at the top surface of the photonics die.
15. The system according to claim 13 , wherein the optical coupling element comprises an array of lenses.
16. The system according to claim 13 , wherein the optical coupling element comprises one or more guide holes for receiving the one or more optical fibers into the one or more predefined positions.
17. The system according to claim 13 , wherein the optical coupling element comprises a prism reflector.
18. The system according to claim 13 , wherein the one or more optical fibers received in the optical coupling element are bent at a near right angle.
19. The system according to claim 13 , wherein the one or more optical fibers received in the optical coupling element comprise multi-core fibers.
20. The system according to claim 13 , wherein the die coupler comprises an array of fiber stubs arranged in the one or more optical paths.
21. The system according to claim 13 , wherein the die coupler comprises an array of lenses arranged in the one or more optical paths.
22. The system according to claim 20 , wherein the array of fiber stubs comprises substantially straight optical fiber stubs that are directly molded into a matrix material.
23. The system according to claim 13 , wherein the optical coupling element comprises substantially curved optical fiber stubs that are directly molded into a matrix material.
24. A method for manufacturing an optoelectronic device, the method comprising:
bonding a plurality of silicon complementary metal-oxide semiconductor (CMOS) electronics dies on a plurality of photonics dies in a silicon wafer, wherein each photonics die of the plurality of photonics dies defines a respective one or more grating couplers at a respective top surface;
bonding a plurality of die couplers to the respective top surfaces of the plurality of photonics dies, wherein each die coupler of the plurality of die couplers provides a respective one or more optical paths therethrough, wherein the respective one or more optical paths are optically coupled with a respective one or more grating couplers in a vertical direction, wherein each die coupler comprises, at a top surface, first alignment features that are configured to mate with second alignment features of an optical coupling element to form an interface between the die coupler and the optical coupling element, wherein the optical coupling element is configured to:
receive one or more optical fibers into one or more predefined positions;
redirect one or more optical axes of the one or more optical fibers when in the one or more predefined positions; and
bond to the top surface around a perimeter of the die coupler, wherein the first alignment features and the second alignment features mate when the die coupler and the optical coupling element are bonded to the top surface of the corresponding photonics die, and
wherein the redirected one or more optical axes are optically aligned with the one or more optical paths at the interface; and
dicing the silicon wafer to form individual packages each comprising a respective photonics die of the plurality of photonics dies and a respective die coupler of the plurality of die couplers.
25. A system comprising:
a photonics transceiver comprising:
a silicon photonics die defining one or more grating couplers at a top surface; and
a multi-piece fiber connector comprising:
an optical coupling element comprising first alignment features; and
a die coupler comprising:
a single molded piece with embedded optical fibers defining one or more optical paths through the single molded piece, wherein the one or more optical paths are optically coupled with the one or more grating couplers in a vertical direction, wherein a bottom surface of the single molded piece is bonded to the top surface of the silicon photonics die, wherein the optical coupling element is dimensioned to bond to the top surface around a perimeter of the single molded piece; and
second alignment features at a top surface of the single molded piece, wherein the second alignment features are configured to mate with the first alignment features, when the die coupler and the optical coupling element are bonded to the top surface of the silicon photonics die, to form an interface between the die coupler and the optical coupling element,
wherein the photonics transceiver is operable to:
receive modulated optical signals from one or more optical fibers coupled to the multi-piece fiber connector; and
redirect the modulated optical signals through the optical coupling element to couple the modulated optical signals with the one or more optical paths.