Semiconductor device and method of manufacturing a semiconductor device
A semiconductor device includes a substrate, a wiring formed on the substrate, an anti-reflection film of titanium nitride formed on the wiring, and a silicon oxide film formed on the anti-reflection film. A pad portion which exposes the wiring is formed at a place where a first opening portion and a second opening portion overlap with each other. A metal nitride region containing fewer dangling bonds is formed from a metal nitride film containing fewer dangling bonds than in the anti-reflection film in at least a part of one or both of an opposed surface of the anti-reflection film which faces the silicon oxide film above the anti-reflection film, and an exposed surface of the anti-reflection film which is exposed in the second opening portion.
1. A method of manufacturing a semiconductor device, comprising:
forming a wiring on a substrate;
forming an anti-reflection film from titanium nitride on the wiring by reactive sputtering that uses argon gas and nitrogen gas;
forming a metal nitride film that contains fewer dangling bonds than in the anti-reflection film on the anti-reflection film by reactive sputtering in which a proportion of nitrogen gas to argon gas is set higher than a proportion of nitrogen gas to argon gas that is used when the anti-reflection film is formed;
forming a silicon oxide film on the metal nitride film containing fewer dangling bonds than in the anti-reflection film; and
forming an opening that penetrates the silicon oxide film, the metal nitride film containing fewer dangling bonds than in the anti-reflection film, and the anti-reflection film, and that exposes the wiring at a bottom of the opening.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein the step of manufacturing a metal nitride film that contains fewer dangling bonds than in the anti-reflection film includes forming a titanium nitride film by reactive sputtering that uses a target containing titanium.
3. A method of manufacturing a semiconductor device, comprising:
forming a wiring on a substrate;
forming an anti-reflection film from titanium nitride on the wiring;
forming a metal nitride film that contains fewer dangling bonds than in the anti-reflection film by performing a nitridation process on a surface of the anti-reflection film;
forming a silicon oxide film on the metal nitride film containing fewer dangling bonds than in the anti-reflection film; and
forming an opening that penetrates the silicon oxide film, the metal nitride film containing fewer dangling bonds than in the anti-reflection film, and the anti-reflection film, and that exposes the wiring at a bottom of opening.
4. The method of manufacturing a semiconductor device according to claim 3 , wherein the nitridation process is one of heat treatment in a nitrogen-containing gas atmosphere and plasma treatment that uses a nitrogen-containing gas.
5. The method of manufacturing a semiconductor device according to claim 1 , further comprising a protection film forming step of forming a protection film from a silicon nitride film on the silicon oxide film after the oxide film forming step,
wherein the opening portion forming step includes forming the opening that penetrates the protection film and exposes the wiring at the bottom.
6. The method of manufacturing a semiconductor device according to claim 2 , further comprising a protection film forming step of forming a protection film from a silicon nitride film on the silicon oxide film after the oxide film forming step,
wherein the opening portion forming step includes forming the opening that penetrates the protection film and exposes the wiring at the bottom.
7. The method of manufacturing a semiconductor device according to claim 3 , further comprising a protection film forming step of forming a protection film from a silicon nitride film on the silicon oxide film after the oxide film forming step,
wherein the opening portion forming step includes forming the opening that penetrates the protection film and exposes the wiring at the bottom.