Current sensor packages
View Patent ↗A sensor package includes a semiconductor die including at least one current sensor. The semiconductor die includes a first pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die. The semiconductor package further includes a second pass through hole extending from one side of the sensor package to an opposite side of the sensor package. The second pass through hole is aligned with the first pass through hole and is configured to receive a current-carrying conductor. The at least one current sensor senses current flow in the current-carrying conductor received in the second pass through hole. An end of the current-carrying conductor is coupled to a terminal on a circuit board in the sensor package.
1. A sensor package comprising:
a semiconductor die including at least one current sensor, the semiconductor die including a first pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die;
a second pass through hole extending from one side of the sensor package to an opposite side of the sensor package, the second pass through hole being aligned with the first pass through hole and configured to receive a current-carrying conductor,
the at least one current sensor being configured to sense current flow in the current-carrying conductor received in the second pass through hole; and
a circuit board having a first terminal on a first side coupled to an end of the current-carrying conductor.
2. The sensor package of claim 1 , wherein the first terminal is formed by solder material disposed on a contact pad on the first side of the circuit board.
3. The sensor package of claim 1 , wherein the current-carrying conductor extends from the first terminal through an opening or hole in the circuit board to a second side of the circuit board.
4. The sensor package of claim 1 , wherein the current-carrying conductor is an insulated electrical wire with an insulating wire jacket or cover made of insulating materials.
5. The sensor package of claim 1 further comprising, a lead frame coupled to the semiconductor die, wherein the lead frame extends from inside of the sensor package to a free end outside the sensor package and is configured to carry signals from the semiconductor die to the outside the sensor package.
6. The sensor package of claim 5 , wherein the free end of the lead frame is attached to a second terminal formed on the circuit board.
7. The sensor package of claim 6 , wherein one or more of a gap, a slot or a cut is disposed in the circuit board between the first terminal and the second terminal to increase a creepage distance along the circuit board between the first terminal and the second terminal.
8. The sensor package of claim 1 , wherein the at least one current sensor includes one or more of an inductive sensor, a horizontal Hall effect sensor, and a vertical Hall effect sensor.
9. A sensor package comprising:
a semiconductor die including at least one current sensor, the semiconductor die including a first pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die;
a second pass through hole extending from one side of the sensor package to an opposite side of the sensor package, the second pass through hole being aligned with the first pass through hole and configured to receive a current-carrying conductor,
the at least one current sensor being configured to sense current flow in the current-carrying conductor received in the second pass through hole; and
a lead frame coupled to the semiconductor die and configured to carry signals from the semiconductor die to outside the sensor package.
10. The sensor package of claim 9 , wherein the free end of lead frame is attached to a terminal formed on a circuit board.
11. The sensor package of claim 10 , wherein the second pass through hole extending from one side of the sensor package to an opposite side of the sensor package is axially aligned with the current-carrying conductor received in the second pass through hole and is generally perpendicular to the circuit board, and wherein the lead frame extending from inside of the sensor package to the free end outside the sensor package is geometrically bent for attachment to the terminal formed on the circuit board.
12. The sensor package of claim 11 , wherein one or more of a gap, a slot or a cut is disposed in the circuit board to increase a creepage distance along the circuit board between the terminal and the current-carrying conductor received in the second pass through hole.
13. The sensor package of claim 12 , wherein the at least one current sensor includes one or more of an inductive sensor, a horizontal Hall effect sensor, and a vertical Hall effect sensor.
14. A current sensor package comprising:
a current sensor disposed in a semiconductor die, the current sensor configured to sense current flow in a current carrying conductor that is disposed at least partially through a hole in the current sensor package,
the current sensor sensing the current flow being configured to detect at least one of a Hall effect voltage in a sensor element or an induced voltage in an inductive coil; and
a solder bump coupling a first contact pad on a first side of the semiconductor die to a first contact pad on a circuit board, the solder bump configured to carry a signal from the semiconductor die to outside of the sensor package.
15. The current sensor package of claim 14 , wherein the semiconductor die includes conductive material disposed in a hole through the semiconductor die, the conductive material in the hole bounded by an upper contact pad and a lower contact pad, and wherein a solder bump connects the lower contact pad to a second contact pad on the circuit board.
16. The current sensor package of claim 15 , wherein the current carrying conductor is attached to upper contact pad using solder material, and a current path from the current carrying conductor through the conductive material disposed in the hole is completed by the solder bump connecting the lower contact pad to the second contact pad on the circuit board.
17. The current sensor package of claim 14 , wherein the current sensor includes one or more of an inductive sensor, a horizontal Hall effect sensor, and a vertical Hall effect sensor.
18. A current sensor package mounted on a circuit board, current sensor package comprising:
a semiconductor die packaged in a molding, the semiconductor die including a first pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die, the semiconductor die including at least one current sensor configured to sense current flow in a current carrying conductor, the current carrying conductor being disposed at least partially through a hole in the current sensor package aligned with the first pass through hole; and
a solder bump coupling a first contact pad on a first side of the semiconductor die to a contact pad on the circuit board, the solder bump configured to carry signals from the semiconductor die to outside of the sensor package.
19. The current sensor package of claim 18 , wherein the semiconductor die includes a second contact pad on a second side of the semiconductor die, and wherein a magnetic field transducer or a concentrator coil is coupled to the second set of contact pads.
20. The current sensor package of claim 18 , wherein the at least one current sensor configured to sense current flow in a current carrying conductor is configured to detect at least one of a Hall effect voltage in a sensor element or an induced voltage in an inductive coil.