SEMICONDUCTOR PACKAGE WITH CHAMFERED CORNERS AND RELATED METHODS
Implementations of image sensors may include a die having either a rounded corner or a chamfered corner edge, and an optically transmissive cover coupled to the die. The optically transmissive cover may include either a rounded corner or a chamfered corner edge that corresponds with either the rounded corner or the chamfered corner edge of the die.
1 . An image sensor comprising:
a die comprising a die sidewall and a rounded corner or a chamfered corner edge; and
an optically transmissive cover coupled to the die, the optically transmissive cover comprising an optically transmissive cover sidewall;
wherein a surface of the die sidewall and a surface of the optically transmissive cover sidewall are comprised within a same plane.
2 . The image sensor of claim 1 , wherein the rounded corner or the chamfered corner edge of the die is convexly rounded.
3 . The image sensor of claim 1 , wherein the rounded corner or the chamfered corner edge of the die is concavely rounded.
4 . The image sensor of claim 1 , wherein the optically transmissive cover comprises glass.
5 . The image sensor of claim 1 , wherein the rounded corner or the chamfered corner edge of the die are formed through etching.
6 . The image sensor of claim 1 , wherein two or more optically transmissive cover sidewalls of the optically transmissive cover are aligned with two or more die sidewalls of the die.
7 . An image sensor comprising:
a die comprising a rounded corner or a chamfered corner edge; and
an optically transmissive cover coupled to the die;
wherein the optically transmissive cover comprises a rounded corner or a chamfered corner edge; and
wherein a perimeter of the optically transmissive cover is the same size as a perimeter of the die.
8 . The image sensor of claim 7 , wherein the rounded corner or the chamfered corner edge of the die is convexly rounded.
9 . The image sensor of claim 7 , wherein the rounded corner or the chamfered corner edge of the die is concavely rounded.
10 . The image sensor of claim 7 , wherein the optically transmissive cover comprises glass.
11 . The image sensor of claim 7 , wherein the rounded corner or the chamfered corner edge of the die are formed through etching.
12 . The image sensor of claim 7 , wherein a sidewall of the die comprises a surface comprised in the same plane as a surface of a sidewall of the optically transmissive cover.
13 . An image sensor comprising:
a die comprising a die sidewall and a rounded corner or a chamfered corner edge; and
an optically transmissive cover coupled to the die, the optically transmissive cover comprising an optically transmissive cover sidewall;
wherein the optically transmissive cover comprises a rounded corner or a chamfered corner edge; and
wherein a surface of the die sidewall and a surface of the optically transmissive cover sidewall are comprised within a same plane.
14 . The image sensor of claim 13 , wherein the rounded corner or the chamfered corner edge of the die is convexly rounded.
15 . The image sensor of claim 13 , wherein the rounded corner or the chamfered corner edge of the die is concavely rounded.
16 . The image sensor of claim 13 , wherein the optically transmissive cover comprises glass.
17 . The image sensor of claim 13 , wherein the rounded corner or the chamfered corner edge of the die are formed through etching.
18 . The image sensor of claim 13 , wherein the rounded corner or the chamfered corner edge of the optically transmissive cover lines up with the rounded corner or the chamfered corner edge of the die.