IP Library Granted Patent US 11,691,924
Granted Patent B2
US 11,691,924 · App. 16/798,016 · Granted Jul 4, 2023

CVI matrix densification process

Inventors: Ying She (East Hartford, CT); Nitin Garg (West Hartford, CT); Andrew J. Lazur (Laguna Beach, CA); Olivier H. Sudre (Glastonbury, CT)
Assignee: RAYTHEON TECHNOLOGIES CORPORATION
C04B35/80C04B35/62863C04B35/62884C23C16/045C23C16/45557C04B2235/3826C04B2235/5244C04B2235/5252C04B2235/614
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,691,924
App. No.
16/798,016
Granted
Jul 4, 2023
Kind
B2
Abstract

Disclosed herein is a chemical vapor infiltration method including flowing ceramic precursors through a preform and depositing a matrix material on the preform at a first gas infiltration pressure, increasing the gas filtration pressure to a second gas infiltration pressure, and lowering the gas infiltration pressure to a third gas infiltration pressure which is intermediate to the first and second gas infiltration pressures.

Claims (28)

1. A chemical vapor infiltration method comprising:

flowing ceramic precursors through a preform in a reactor and depositing a matrix material on the preform at a first gas infiltration pressure of the reactor,

increasing the gas filtration pressure to a second gas infiltration pressure, and

lowering the gas infiltration pressure to a third gas infiltration pressure which is intermediate to the first and second gas infiltration pressures;

wherein the first pressure is less than or equal to 1 torr, and wherein the first pressure is 1 to 20% of the second pressure;

wherein the second pressure is greater than 1 torr, and wherein the second pressure is maintained until infiltration gas diffusion rate rather than deposition rate controls matrix densification rate; and

wherein the third pressure is 25 to 75% of the second pressure, and wherein the third pressure maintains matrix densification under reaction control rather than diffusion control.

2. The method of claim 1 , wherein the first pressure is maintained at the first pressure for one minute to 60 minutes.

3. The method of claim 1 , wherein the first pressure is 0.01 torr to 1 torr.

4. The method of claim 1 , wherein the second pressure is greater than 1 torr to 100 torr.

5. The method of claim 1 , further comprising a fourth pressure intermediate to the first and third pressures.

6. The method of claim 1 , wherein the increase in gas infiltration pressure from the first gas infiltration pressure to the second gas infiltration pressure is based on a reduction in pore size, and the decrease in gas infiltration pressure from the second gas infiltration pressure to the third gas infiltration pressure is based on a decrease in a rate of weight increase.

7. The method of claim 1 , wherein the preform comprises Al 2 O 3 —SiO 2 , SiC, silicon dioxide (SiO 2 ), aluminum silicate, aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), zirconium silicate, silicon nitride, boron nitride (BN), carbon (C), and combinations thereof.

8. The method of claim 1 , wherein the matrix comprises metal oxides, borides, carbides, nitrides, silicides, and mixtures and combinations thereof.

9. The method of claim 8 , wherein the matrix comprises silicon carbide (SiC), silicon oxide (SiO 2 ), boron nitride (BN), boron carbide (B 4 C), aluminum oxide (Al 2 O 3 ), zirconium oxide (ZrO 2 ), zirconium boride (ZrB 2 ), zinc oxide (ZnO 2 ) molybdenum disulfide (MoS 2 ), silicon nitride (Si 3 N 4 ), and combinations thereof.

10. The method of claim 1 , further comprising modifying the temperature, precursor flow rate or both.

11. A chemical vapor infiltration method comprising:

flowing SiC ceramic precursors through a SiC preform in a reactor and depositing a SiC matrix material on the preform at a first gas infiltration pressure of the reactor,

increasing the gas filtration pressure to a second gas infiltration pressure, and

lowering the gas infiltration pressure to a third gas infiltration pressure which is intermediate to the first and second gas infiltration pressures;

wherein the first pressure is less than or equal to 1 torr, and wherein the first pressure is 1 to 20% of the second pressure;

wherein the second pressure is greater than 1 torr, and wherein the second pressure is maintained until infiltration gas diffusion rate rather than deposition rate controls matrix densification rate; and

wherein the third pressure is 25 to 75% of the second pressure, and wherein the third pressure maintains matrix densification under reaction control rather than diffusion control.

12. The method of claim 11 , wherein the first pressure is 0.01 torr to 1 torr.

13. The method of claim 11 , wherein the second pressure is greater than 1 torr to 100 torr.

14. The method of claim 11 , wherein the increase in gas infiltration pressure from the first gas infiltration pressure to the second gas infiltration pressure is based on a reduction in pore size, and the decrease in gas infiltration pressure from the second gas infiltration pressure to the third gas infiltration pressure is based on a decrease in a rate of weight increase.

15. The method of claim 11 , wherein the first pressure is maintained at the first pressure for one minute to 60 minutes.

16. The method of claim 11 , further comprising a fourth pressure intermediate to the first and third pressures.

Assignments (3)
CHANGE OF NAME Recorded Jul 27, 2023
From: RAYTHEON TECHNOLOGIES CORPORATION
To: RTX CORPORATION
Reel/Frame 064714/0001 →
CHANGE OF NAME Recorded Aug 30, 2021
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 057350/0649 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2020
From: SHE, YING; GARG, NITIN; LAZUR, ANDREW J.; SUDRE, OLIVIER H.
To: UNITED TECHNOLOGIES CORPORATION
Reel/Frame 052387/0678 →
Continuity (1)
Related Publication 20210261469A1 · Aug 26, 2021