Aligning a collimator assembly with LED arrays
Disclosed herein are techniques for aligning a collimator assembly with an array of LEDs. According to certain embodiments, a method includes using lithography to form a first plurality of contact pads and a second plurality of contact pads on a backplane; bonding a plurality of dies to the first plurality of contact pads, wherein each of the plurality of dies comprises a plurality of light emitting diodes; forming a first plurality of features on the second plurality of contact pads; and aligning a plurality of lenses on an assembly with the plurality of dies by coupling a second plurality of features on the assembly with the first plurality of features on the second plurality of contact pads.
1. A method comprising:
using lithography to form a first plurality of contact pads on a backplane and a second plurality of contact pads on the backplane;
bonding a plurality of dies to the first plurality of contact pads, wherein each of the plurality of dies comprises a plurality of light emitting diodes;
forming a first plurality of features on the second plurality of contact pads; and
aligning a plurality of lenses on an assembly with the plurality of dies after the plurality of dies have been bonded to the first plurality of contact pads, wherein the aligning of the plurality of lenses includes coupling a second plurality of features on the assembly with the first plurality of features on the second plurality of contact pads.
2. The method of claim 1 , wherein the first plurality of features are balls comprising a fusible material, wherein the assembly is a collimator assembly, and wherein the second plurality of features are recesses in the collimator assembly, the recesses being formed through shaping a material of the collimator assembly.
3. The method of claim 2 , wherein each of the balls has a spherical shape.
4. The method of claim 2 , wherein each of the balls has an oblong shape.
5. The method of claim 2 , wherein the recesses have cross-sections that match the balls.
6. The method of claim 1 , wherein the first plurality of contact pads and the second plurality of contact pads are formed simultaneously.
7. The method of claim 1 , wherein each of the plurality of lenses is a collimating lens.
8. A method comprising:
using lithography to form a plurality of contact pads on a backplane and a plurality of openings in the backplane;
bonding a plurality of dies to the plurality of contact pads, wherein each of the plurality of dies comprises a plurality of light emitting diodes; and
aligning a plurality of lenses on an assembly with the plurality of dies after the plurality of dies have been bonded to the plurality of contact pads, wherein the aligning of the plurality of lenses includes coupling a plurality of features on the assembly with the plurality of openings in the backplane, wherein the plurality of features on the assembly are protrusions, and wherein the coupling of the plurality of features on the assembly with the plurality of openings in the backplane includes inserting the protrusions into the plurality of openings.
9. The method of claim 8 , wherein the plurality of openings extend through a redistribution layer of the backplane.
10. The method of claim 8 , wherein the backplane further comprises a metal sidewall for each of the plurality of openings.
11. The method of claim 8 , wherein each of the plurality of lenses is a collimating lens.
12. The method of claim 8 , wherein the plurality of contact pads and the plurality of openings are formed simultaneously.
13. The method of claim 8 , wherein the assembly is a collimator assembly.