Inverter device
Dew condensation in a housing of an inverter device can be prevented. The inverter device includes: a housing accommodating a power electronic element and an electrolytic capacitor; an opening formed in the housing; a thermal insulator disposed along a periphery of the opening; and a water jacket having a body portion, and a flow-in pipe and a discharge pipe for cooling water, the water jacket being disposed such that a first surface of the body portion closes the opening from an outside of the housing, with the thermal insulator interposed therebetween. The power electronic element is mounted on the first surface of the body portion, and the electrolytic capacitor is mounted in the housing so as to be in contact with an inner surface of the housing.
1. An inverter device comprising:
a processor;
a housing accommodating a power electronic element and an electrolytic capacitor;
an opening formed in the housing;
a thermal insulator disposed along a periphery of the opening; and
a water jacket having a body portion, and a flow-in pipe and a discharge pipe for cooling water, wherein
the power electronic element is mounted on a first surface of the body portion, and
the electrolytic capacitor is mounted in the housing so as to be in contact with an inner surface of the housing,
wherein the processor is configured to control an amount of supply of cooling water to the water jacket according to a temperature of the power electronic element, wherein the processor is further configured to both water-cool the power electronic element when an inverter device output power is high and to avoid an air-cooling of the electrolytic capacitor below a dew point.
2. The inverter device according to claim 1 , wherein the thermal insulator is formed of resin or ceramic.
3. The inverter device according to claim 2 , wherein the body portion is formed of materials that are different in thermal conductivity, and the power electronic element is mounted on a part, of the body portion, that is formed of the material having a higher thermal conductivity.
4. The inverter device according to claim 2 , wherein a metallic cooling plate having a size that does not exceed a size of the power electronic element is disposed in a part, of the body portion, on which the power electronic element is mounted.
5. The inverter device according to claim 2 , wherein a fin for heat dissipation is formed on an outer surface of the housing.
6. The inverter device according to claim 5 , wherein the fin has a shape of a plate or a circular column.
7. The inverter device according to claim 1 , wherein the thermal insulator is an air space.
8. The inverter device according to claim 7 , wherein the body portion is formed of materials that are different in thermal conductivity, and the power electronic element is mounted on a part, of the body portion, that is formed of the material having a higher thermal conductivity.
9. The inverter device according to claim 7 , wherein a metallic cooling plate having a size that does not exceed a size of the power electronic element is disposed in a part, of the body portion, on which the power electronic element is mounted.
10. The inverter device according to claim 7 , wherein a fin for heat dissipation is formed on an outer surface of the housing.
11. The inverter device according to claim 10 , wherein the fin has a shape of a plate or a circular column.
12. The inverter device according to claim 1 , wherein the body portion is formed of materials that are different in thermal conductivity, and the power electronic element is mounted on a part, of the body portion, that is formed of the material having a higher thermal conductivity.
13. The inverter device according to claim 1 , wherein a metallic cooling plate having a size that does not exceed a size of the power electronic element is disposed in a part, of the body portion, on which the power electronic element is mounted.
14. The inverter device according to claim 1 , wherein a fin for heat dissipation is formed on an outer surface of the housing.
15. The inverter device according to claim 14 , wherein the fin has a shape of a plate or a circular column.
16. The inverter device according to claim 1 , wherein supply of cooling water is stopped or the amount of the supply is reduced if the temperature of the power electronic element becomes lower than an outside air temperature.
17. The inverter device according to claim 1 , wherein the electrolytic capacitor is mounted on an inside face of a first portion of the body, wherein an outside face of the first portion of the body includes a plurality of fins, and wherein the plurality of fins are configured to assist in air-cooling the electrolytic capacitor to a temperature near ambient temperature.
18. The inverter device according to claim 17 , wherein the body includes an eave, and the eave is disposed near the plurality of fins and without touching the plurality of fins.
19. The inverter device according to claim 1 , wherein the processor is further configured to control the supply of cooling water so as to avoid a short circuit within the housing due to an undesired dew formation on the electrolytic capacitor.
20. An inverter device comprising:
a housing accommodating a power electronic element and an electrolytic capacitor;
an opening formed in the housing;
a thermal insulator disposed along a periphery of the opening; and
a water jacket having a body portion, and a flow-in pipe and a discharge pipe for cooling water, wherein
the power electronic element is mounted on a first surface of the body portion, and
the electrolytic capacitor is mounted in the housing so as to be in contact with an inner surface of the housing,
wherein a fin for heat dissipation is formed on an outer surface of the housing, and
an eave portion is formed so as to extend from the body portion and cover the fin without being in contact with either of the fin and the housing.
21. The inverter device according to claim 20 , wherein the fin has a shape of a plate or a circular column.