Alignment mechanisms sensor systems employing piezoresistive materials
Methods and apparatus are described that improve the reliability and configurability of sensor systems.
1. A sensor system, comprising:
a first substrate having a plurality of conductive traces thereon;
a plurality of pieces of piezoresistive material, each piece of piezoresistive material being positioned to contact a corresponding set of sections of the conductive traces within a corresponding region defined by an area of overlap of the first substrate by that piece of piezoresistive material when viewed along an axis perpendicular to the first substrate and thereby form a sensor therewith, wherein, for each set of sections of the conductive traces:
that set of sections of the conductive traces has at least a corresponding first section of one of the conductive traces and a corresponding second section of another of the conductive traces, and
both the corresponding first section and the corresponding second section of that set of sections of the conductive traces are, within the corresponding region, separated from each other within the first substrate; and
a second substrate, the second substrate including a plurality of depressions in a surface thereof, and a plurality of posts extending from the surface through corresponding apertures in the first substrate, thereby aligning each sensor with a corresponding one of the depressions.
2. The sensor system of claim 1 , wherein at least one depression in the surface of the second substrate is configured such that there is a space between the corresponding piece of piezoresistive material and the second substrate when there is no force exerted on the sensor system.
3. The sensor system of claim 1 , wherein at least one depression in the surface of the second substrate is configured such that the corresponding piece of piezoresistive material is in contact with the second substrate when there is no force exerted on the sensor system.
4. The sensor system of claim 1 , wherein at least one depression in the surface of the second substrate is configured such that substantially no force is registered by the corresponding sensor when there is no force exerted on the sensor system.
5. The sensor system of claim 1 , wherein at least one depression in the surface of the second substrate is configured to determine a dynamic range of the corresponding sensor.
6. The sensor system of claim 1 , wherein at least one depression in the surface of the second substrate is configured to allow the corresponding piece of piezoresistive material to decompress after force is exerted on the sensor system.
7. The sensor system of claim 1 , wherein the piezoresistive material is a fabric.
8. The sensor system of claim 1 , wherein at least one of the pieces of piezoresistive material is secured to the first substrate with an adhesive element, each adhesive element having an aperture through which the corresponding piece of piezoresistive material contacts the corresponding set of traces.
9. The sensor system of claim 1 , wherein the second substrate is a molded foam rubber material.
10. The sensor system of claim 1 , further comprising a third substrate, the third substrate including an adhesive configured to secure the first substrate to the second substrate, the third substrate including apertures aligned with the posts and depressions of the second substrate.
11. The sensor system of claim 1 , further comprising a third substrate, the third substrate including an adhesive configured to secure the first substrate to the second substrate and to enclose the first substrate and the sensors between the second and third substrates.
12. The sensor system of claim 1 , wherein the first section and the second section of at least one of the sets of sections of the conductive traces are interdigitated with one another.
13. The sensor system of claim 1 , wherein the posts are configured to counteract shear forces acting on the sensor system.
14. The sensor system of claim 1 , wherein all of the conductive traces are disposed on one side of the first substrate.
15. The sensor system of claim 1 , wherein portions of at least one of the conductive traces are disposed on both sides of the first substrate.