Radiation curable thermistor encapsulation
A medical temperature monitoring system includes an electrical wire set having a thermistor at a distal end of the wire set configured to sense temperatures to which the thermistor is exposed; an electronic circuit in electrical communication with the wire set and the thermistor and configured to convert the temperatures sensed by the thermistor to temperature display signals; a display in electrical communication with the electronic circuit for receiving the temperature display signals and displaying temperatures corresponding to the temperature display signals; and a bead of cured protective material encapsulating the thermistor. The protective material is a radiation curable adhesive applied to the thermistor in an uncured state and then cured to encapsulate the thermistor. The bead of cured protective material electrically isolates the conductor sufficient to pass a Hi-Pot test at 500 VAC, <0.1 mA.
1. A medical temperature monitoring system, comprising:
a thermistor comprising an electrical wire set having a conductor at a distal end of the wire set configured to sense temperatures to which the thermistor is exposed;
an electronic circuit in electrical communication with the wire set and the thermistor and configured to convert the temperatures sensed by the thermistor to temperature display signals;
a display in electrical communication with the electronic circuit for receiving the temperature display signals and displaying temperatures corresponding to the temperature display signals; and
a bead of cured protective material encapsulating the thermistor, the bead of cured protective material comprising a radiation curable adhesive applied to the distal end of the wire set and the conductor in an uncured state so that the conductor and adjacent portions of the distal end of the wire set are coated with the protective material in the uncured state and the protective material is then cured to encapsulate the conductor and the adjacent portions of the distal end of the wire set, wherein the bead of cured protective material electrically isolates the conductor sufficient to pass a Hi-Pot test at 500 VAC, <0.1 mA.
2. The temperature monitoring system of claim 1 , wherein the bead has a largest diameter of about 0.09 inches or less.
3. The temperature monitoring system of claim 1 , wherein the radiation curable adhesive has a viscosity of from about 9,000 cP to about 18,000 cP in the uncured state.
4. The temperature monitoring system of claim 1 , wherein the radiation curable adhesive comprises an aliphatic urethane acrylate and monomer blend.
5. The temperature monitoring system of claim 1 , wherein the radiation curable adhesive is curable by exposure to light.
6. A thermistor, comprising:
an electrical wire set having a pair of wires with a conductor at a distal end of the wires configured to sense temperatures to which the conductor is exposed; and
a bead of protective material encapsulating the conductor, the protective material comprising a radiation curable adhesive applied to the conductor in an uncured state and then cured to encapsulate the conductor as the bead and isolate the conductor sufficient to pass a Hi-Pot test at 500 VAC, <0.1 mA.
7. The thermistor of claim 6 , wherein the bead has a largest diameter of about 0.09 inches or less.
8. The thermistor of claim 6 , wherein the radiation curable adhesive has a viscosity of from about 9,000 cP to about 18,000 cP in the uncured state.
9. The thermistor of claim 6 , wherein the radiation curable adhesive comprises an aliphatic urethane acrylate and monomer blend.
10. The thermistor of claim 6 , wherein the radiation curable adhesive is curable by exposure to light.
11. A method of making a temperature sensor, comprising the steps of:
providing an electrical wire set having a thermistor at a distal end of the wire set configured to sense temperatures to which the thermistor is exposed;
providing a protective material comprising a radiation curable adhesive in a liquid uncured state having a viscosity;
dipping the thermistor into the protective material at a speed selected for the viscosity of the protective material in liquid uncured state to uniformly coat the thermistor with the protective material;
withdrawing the coated thermistor from the protective material at a speed selected for the viscosity of the protective material in the uncured state while maintaining the thermistor oriented downward to allow for flow of the protective material as coated on the thermistor to be formed into and retained on the thermistor in the configuration of a bead;
maintaining the coated thermistor in the downward orientation at a temperature selected to maintain adequate viscosity of the protective material forming the bead to prevent dripping of the bead; and
curing the bead of the protective material by exposing the bead to radiation.
12. The method of claim 11 , wherein the bead after curing has a largest diameter of about 0.09 inches or less.
13. The method of claim 11 , wherein the protective material has a viscosity in the uncured state of from about 9,000 cP to about 18,000 cP.
14. The method of claim 11 , wherein the protective material comprises an aliphatic urethane acrylate and monomer blend.
15. The thermistor of claim 11 , wherein after curing the bead of protective material electrically isolates the conductor sufficient to pass a Hi-Pot test at 500 VAC, <0.1 mA.
16. The method of claim 11 , wherein the step of curing the bead of the protective material by exposing the bead to radiation comprises exposing the bead to light.
17. The method of claim 11 , wherein the step of dipping the thermistor into the protective material comprises dipping the thermistor with a multi-directional motion.