METHODS AND SYSTEMS FOR ALIGNMENT TO EMBEDDED PATTERNS IN SEMICONDUCTOR DEVICE PROCESSING

1 . A method of alignment, comprising:

emitting an incident light toward a semiconductor layer of a semiconductor device, wherein the incident light is a sub-bandgap light substantially transparent to the semiconductor layer;

detecting a reflected light generated from the incident light penetrating through the semiconductor layer of the semiconductor device and reflecting off of a portion of the semiconductor device;

identifying a macroscopic feature underneath the semiconductor layer based on the reflected light, wherein the macroscopic feature corresponds to the portion of the semiconductor device and is visible to the naked eye; and

performing an alignment procedure by using the identified macroscopic feature as a reference for the alignment procedure.

2 . The method of claim 1 , further comprising performing one or more processing steps on the semiconductor device after performing the alignment procedure, the one or more processing steps including one or more deposition steps, one or more printing steps, one or more cutting steps, one or more etching steps, one or more probing steps, or a combination thereof.

3 . The method of claim 1 , wherein performing an alignment procedure further includes maintaining a detector that detects the reflected light stationary in relation to a stage having the semiconductor device.

4 . The method of claim 1 , wherein the incident light has a center wavelength longer than 1000 nm.

5 . The method of claim 1 , wherein the semiconductor layer includes at least one of gallium arsenide, gallium arsenide phosphide, gallium phosphide, aluminum gallium arsenide, aluminum gallium nitride, aluminum gallium indium phosphide, aluminum gallium indium nitride, aluminum gallium, aluminum phosphide, aluminum nitride, zinc selenide, indium gallium nitride, indium gallium arsenide, or silicon carbide.

6 . The method of claim 1 , wherein the semiconductor device further includes at least one of a carrier, a plurality of bottom electrodes, a dielectric layer, or a plurality of vias.

7 . The method of claim 1 , wherein the macroscopic feature includes at least one of a contour, an outline, a delineation, a shape, an array, a pattern, or a border of at least one of a carrier, a plurality of bottom electrodes, a dielectric layer, and a plurality of vias in the semiconductor device.

8 . The method of claim 1 , wherein the plurality of vias includes two or more adjacent vias.

9 . The method of claim 1 , wherein the macroscopic feature is larger than 1 centimeter.

10 . The method of claim 1 , wherein the macroscopic feature is a linear feature larger than 1 millimeter or a combination of linear features larger than 1 millimeter.

11 . The method of claim 1 , further comprises performing a pre-alignment procedure prior to emitting the incident light.

12 . The method of claim 1 , wherein detecting the reflected light further comprises detecting the incident light reflected off of a plurality of sidewalls of a plurality of vias.

13 . An alignment system, comprising:

a stage;

one or more light sources configured to emit an incident light toward a semiconductor layer of a semiconductor device positioned on the stage, wherein the incident light is a sub-bandgap light substantially transparent to the semiconductor layer;

a detector configured to detect a reflected light generated from the incident light penetrating through the semiconductor layer of the semiconductor device and reflecting off of a portion of the semiconductor device;

an optical controller configured to identify a macroscopic feature underneath the semiconductor layer based on the reflected light, wherein the macroscopic feature corresponds to the portion of the semiconductor device and is visible to the naked eye; and

a stage controller configured to perform an alignment procedure by using the identified macroscopic feature as a reference for the alignment procedure.

14 . The alignment system of claim 13 , a deposition system configured to perform one or more processing steps on the semiconductor device after performing the alignment procedure, the one or more processing steps including one or more deposition steps, one or more printing steps, one or more cutting steps, one or more etching steps, one or more probing steps, or a combination thereof.

15 . The alignment system of claim 13 , wherein the stage controller is further configured to perform the alignment procedure by maintaining the detector stationary in relation to the stage having the semiconductor device.

16 . The alignment system of claim 13 , further comprising at least one of a linear actuator for translating the stage or a rotational actuator for rotating the stage.

17 . The alignment system of claim 13 , wherein the one or more light sources are further configured to emit the incident light having a center wavelength longer than 1000 nanometer.

18 . The alignment system of claim 13 , wherein the detector is further configured to detect the reflected light having a wavelength longer than 1000 nanometer.

19 . A system for alignment, comprising:

means for emitting an incident light toward a semiconductor layer of a semiconductor device, wherein the incident light is a sub-bandgap light substantially transparent to the semiconductor layer;

means for detecting a reflected light generated from the incident light penetrating through the semiconductor layer of the semiconductor device and reflecting off of a portion of the semiconductor device;

means for identifying a macroscopic feature underneath the semiconductor layer based on the reflected light, wherein the macroscopic feature corresponds to the portion of the semiconductor device and is visible to the naked eye; and

means for performing an alignment procedure by using the identified macroscopic feature as a reference for the alignment procedure.

20 . The method of claim 19 , wherein means for performing an alignment procedure further includes means for translating or rotating a stage having the semiconductor device.

21 - 23 . (canceled)