IP Library Granted Patent US 11,666,918
Granted Patent B2
US 11,666,918 · App. 16/811,778 · Granted Jun 6, 2023

Microfluidic chip, head, and dispensing device for dispensing fluids containing an acidic component

Inventors: David L. Bernard (Lexington, KY); Sean T. Weaver (Florence, KY)
Assignee: FUNAI ELECTRIC CO., LTD.
B01L3/52B01L3/502707B01L2200/12B01L2200/16B01L2300/06B01L2300/0819B01L2300/0858B01L2300/12
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Quick Facts
Patent No.
US 11,666,918
App. No.
16/811,778
Granted
Jun 6, 2023
Kind
B2
Abstract

A microfluidic ejection chip includes a silicon substrate having a fluid passageway. The fluid passageway is defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid. The permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.

Claims (13)

1. A microfluidic ejection chip, comprising:

a silicon substrate having a fluid passageway, the fluid passageway being defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid;

an operational layer including a plurality of fluid ejection elements deposited on a top surface of the silicon substrate, a device layer having conductive and insulative features, and a flow feature layer; and

a resist layer over the flow feature layer,

wherein the permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.

2. The microfluidic ejection chip of claim 1 , wherein each of the silicon sidewall and the permanent passivation layer extends continuously around a perimeter of the fluid passageway to protect the silicon sidewall from exposure to the acidic fluid.

3. The microfluidic ejection chip of claim 1 , wherein the permanent passivation layer is a fluorocarbon layer.

4. The microfluidic ejection chip of claim 1 , wherein the permanent passivation layer is formed over any exposed portion of the silicon sidewall following each iteration of a deep reactive ion etching of the silicon substrate.

5. The microfluidic ejection chip of claim 1 , wherein the permanent passivation layer is a fluorocarbon layer formed over the silicon sidewall using disposition of C 4 F 8 gas.

6. The microfluidic ejection chip of claim 1 , wherein the acidic fluid is a reagent having a content of hydrofluoric acid/nitric acid (HF/HNO 3 ), Ethylenediamine pyrocatechol (EDP), Potassium hydroxide/Isopropyl alcohol (KOH/IPA), or Tetramethylammonium hydroxide (TMAH).

7. The microfluidic ejection chip of claim 1 , wherein the operational layer includes conductive material that electrically connects the plurality of fluid ejection elements to flex circuit external to the microfluidic ejection chip.

8. The microfluidic ejection chip of claim 1 , wherein each of plurality of fluid ejection elements is an electrical heater or a piezoelectric device.

9. The microfluidic ejection chip of claim 1 , wherein each of plurality of fluid ejection elements is a piezoelectric device.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2025
From: FUNAI ELECTRIC CO., LTD.
To: BRADY WORLDWIDE, INC.
Reel/Frame 070724/0640 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2023
From: FUNAI ELECTRIC HOLDINGS CO., LTD.
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 064093/0487 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 063815 FRAME: 0716. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Jun 2, 2023
From: FUNAI ELECTRIC CO., LTD.
To: FUNAI ELECTRIC HOLDINGS CO., LTD.
Reel/Frame 063843/0907 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2023
From: FUNAI ELECTRIC CO., LTD.
To: FUNAI ELECTRIC HOLDINGS CO., LTD.
Reel/Frame 063815/0716 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2020
From: BERNARD, DAVID L.; WEAVER, SEAN T.
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 052041/0950 →
Continuity (1)
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